Improved packaging techniques for optical transmitters/receivers

Claim 1

An optical communication arrangement comprising a semiconductor optical device (e.g., 61); mounting means (e.g., 62) for said optical device including a pair of electrical leads (e.g., 63,64) extending therefrom; an optical sleeve (e..g, 58) including a central bore for insertion of an optical fiber assembly; and an integrated circuit (e.g., 80) required to operate said semiconductor optical device CHARACTERIZED IN THAT the arrangement further comprises a connector frame assembly (e.g., 52) comprising a plastic material, said frame assembly including a bore (e.g., 56) formed through an endwall thereof for insertion of said optical sleeve, said sleeve being formed of a plastic material identical in composition to said frame assembly, said connector frame assembly further comprising an optical fiber connector port (e.g., 54), said connector port appropriately shaped by means of molding; a plastic dual-in-line package (e.g., 66) for housing the integrated circuit, said dual-in-line package including a pair of end-prong leads (e.g., 68,70) for connection to the pair of electrical leads extending from said mounting means, said dual-in-line package further comprising a plurality of relatively long leads (e.g., 72) extending from both sides of said package; a bottom support plate (e.g., 74) disposed under said dual-in-line package in a manner such that the plurality of relatively long leads pass through a plurality of associated holes (e.g., 75) formed in said bottom support plate, said leads being utilized for connection to external circuitry; and a metallic cover plate (e.g., 76) disposed to contact said connector frame assembly such that said dual-in-line package and said optical sleeve are fully encased.