Patent EP0379404A2 successfully refreshed from Google Patents.
EP0379404A2
Expired / Lapsed
EP
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A multilayer hybrid circuit
Assignee: TDK Corp
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Filing: 1990-01-12
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Granted: —
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Expires: 2010-01-12
Abstract
Abstract A multilayer hybrid circuit, which looks like a conventional printed circuit board, has a laminated body (1) having at least one of a plurality of dielectric layers (17, 18) magnetic layers, and conductive patterns (19), composing a capacitor, an inductor, and a resistor, and mounts a semiconductor chip. An external connection is effected by side terminals (11) positioned on side walls of the laminated body. In one embodiment, said laminated body and said semiconductor chip is molded together by plastics (4) so that it looks as if a conventional semiconductor chip. In another embodiment, a resilient relay board is coupled with the laminated body when mounted on a mother board so that stress on the mother board is not applied directly to the laminated body.
Inventors
- 👤 Minoru Takaya
- 👤 Yoshinori Mochizuki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 16:07
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/165; H03; H03H; H03H3/00; H03H7/00; H03H7/01; H03H7/06; H05K1/02; H05K1/14; H05K1/142; H05K1/162; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/40; H10W70/464; H10W70/465; H10W70/475; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K1/141; H05K1/167; H05K2201/00; H05K2201/08; H05K2201/083; H05K2201/086; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K3/00; H05K3/40; H05K3/403; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H05K3/4688; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
182 words
(1) A multilayer hybrid circuit comprising an essentially flat-shaped laminated body which includes at least one selected from capacitor, inductor, resistor, and inner wiring portion; and a plurality of side terminals provided on side walls of said laminated body for external connection of said capacitor, said inductor, and said resistor, said capacitor being composed of a dielectric layer and conductive layers coupled with said side terminal, said inductor being composed of a magnetic layer and a plurality of U-shaped conductive layers composing a coil by sandwiching said magnetic layer between each U-shaped conductive layers, said resistor being composed of a dielectric layer and a resistor layer deposited on said dielectric layer together with a conductive layer for coupling said resistor layer with one of said side terminals, said inner wiring portion having at least one dielectric layer, a conductive pattern deposited on said dielectric layer, and a conductive through hole penetrating a dielectric layer for connecting conductive patterns on different dielectric layers, and said conductive pattern being coupled with said side terminals, and an electronic component being mounted on said laminated body.
Claim 2
Dependent Claim
45 words
(2) A multilayer hybrid circuit according to claim 1, wherein said electronic component is a bare semiconductor chip mounted on said laminated body, and molded by plastics with said laminated body, and a bulk molded body has a plurality of conductive pins for external connection.
Claim 3
Dependent Claim
34 words
(3) A multilayer hybrid circuit according to claim 2, wherein a conductive layer is provided between said bare semiconductor chip and said laminated body so that said conductive layer functions as a heat sink.
Claim 4
Dependent Claim
17 words
(4) A multilayer hybrid circuit according to claim 2, wherein said terminal pin is offset to L-shaped.
Claim 5
Dependent Claim
56 words
(5) A laminated hybrid circuit according to claim 1, further comprising a resilient relay board which has a conductive pattern and carries said laminated body so that said laminated body is mounted on a mother board through said relay board, and is electrically coupled with the mother board through said conductive pattern on the relay board.
Claim 6
Dependent Claim
246 words
(6) A multilayer hybrid circuit comprising an essentially flat-shaped laminated body which includes at least one selected from a capacitor portion, an inductor portion, a resistor portion and an inner wiring portion laminated to each other, and a plurality of side terminals provided on side walls of said laminated body for external connection of a capacitor, an inductor, and a resistor, said capacitor portion being composed of a dielectric layer and conductive layers coupled with said side terminals for providing capacitance between conductive layers, said inductor portion being composed of a magnetic layer and a plurality of U-shaped conductive layers composing a coil by sandwiching said magnetic layer between each U-shaped conductive layers, said resistor portion being composed of a dielectric layer and a resistor layer deposited on said dielectric layer together with a conductive layer for coupling said resistor layer with one of said side terminals, said inner wiring poriton being composed of at least one dielectric layer, a conductive pattern deposited on said dielectric layer, and a conductive through hole for connecting electrically conductive patterns on different dielectric layers, and said conductive pattern is coupled with said side terminals, an electronic component in bare chip form being mounted on said laminated body so that a wiring for said electronic component is effected through said inner wiring portion, a plurality of L-shaped terminal pins for external connection coupled with each side terminal, and said electronic component and said laminated body being molded together by plastics.
Claim 7
Dependent Claim
35 words
(7) A multilayer hybrid circuit according to claim (6), wherein a conductive layer is provided between said bare electronic component chip and said laminated body so that said conductive layer functions as a heat sink.
Claim 8
Dependent Claim
42 words
(8) A multilayer hybrid circuit according to claim 6, further comprising a resilient relay board which has a conductive pattern and carries said multilayer hybrid circuit so that said multilayer hybrid circuit is mounted on a mother board through said relay board.
Claim 9
Dependent Claim
19 words
(9) A multilayer hybrid circuit according to claim 8, wherein said relay board is ring-shaped having a center hole.
Claim 10
Dependent Claim
19 words
(10) A multilayer hybrid circuit according to claim 5, wherein said relay board is ring-shaped having a center hole.
References Cited (Backward Citations)
No citation records indexed.
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