Patent EP0372880A2 successfully refreshed from Google Patents.
EP0372880A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
Assignee: Resonac Corp
•
Filing: 1989-12-04
•
Granted: —
•
Expires: 2009-12-04
Abstract
Abstract A composition (18) comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles (3) having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductive chip (11) to a wiring substrate (14).
Inventors
- 👤 Isao Tsukagoshi
- 👤 Yutaka Yamaguchi
- 👤 Atsuo Nakajima
- 👤 Yasushi Goto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 20:55
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H10; H10W; H10W20/00; H10W20/40; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H10W72/00; H10W72/20; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0221; H05K2201/0233; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/11; H05K2203/1163; H10W70/099; H10W70/67; H10W70/68; H10W70/681; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/073; H10W72/074; H10W72/29; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/941; H10W72/9415; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
95 words
A composition for circuit connection comprising (A) an epoxy resin-containing reactive adhesive, (B) coated particles comprising a nucleus of a curing agent substantially coated with a film, and (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), the content of the electroconductive particles (C) being 0.1 to 15% by volume based on the total volume of the components (A) and (B). 2. A composition according to claim 1 and further comprising (D) rigid particles having an average particle size smaller than that of the coated particles (B).
Claim 2
Dependent Claim
34 words
A composition according to claim 1 or claim 2 wherein the composition has a chlorine ion concentration in extracted water of 15 ppm or less, and a thermal activation temperature of 70° to 200°C.
Claim 3
Dependent Claim
46 words
A process for connecting circuits, which comprises placing a composition according to any one of claims 1 to 3 between opposed circuits, testing electric current passage in both circuits while subjecting the uncured composition to compression and curing the composition under pressure to obtain electrical connection.
Claim 4
Dependent Claim
96 words
A bump-less connection structure comprising a semiconductor chip, having an electrode portion with a concave form or almost the same height as a major surface, connected electrically to a wiring substrate via an adhesive composition according to any one of claims 1 to 3 comprising pressure-deformable electroconductive particles wherein substantially the whole surface of the electroconductive particles is coated with a metallic thin layer and the electroconductive particles are deformed at least in the region between the electrode portion of the semiconductor chip and circuits on the substrate, the connected portion being fixed by the adhesive.
Claim 5
Dependent Claim
83 words
A connection structure comprising a semiconductor chip having a electrode portion projecting from a major surface and connected electrically to a wiring substrate via an adhesive according to any one of claims 1 to 3 wherein the pressure-deformable electroconductive particles are deformed at least in the region between an end portion of projecting electrode and a circuit on the substrate, at least the portions of the semiconductor chip adjacent the substrate other than the electrode connected portion being covered with an insulating adhesive.
Claim 6
Dependent Claim
35 words
Use of a composition according to any one of claims 1 to 3 for electrically connecting electrodes of a semiconductor chip to electrical circuits on a substrate and fixing the semiconductor chip to the substrate.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.