Dry etching apparatus with anhydrous hydrogen fluoride gas generator
Abstract
Abstract There is provided according to the invention a dry-etching apparatus composed of any of metal, silica, ceramic or combination thereof comprising a processing chamber (3) in which substrates are placed and a diluted anhydrous hydrogen fluoride gas generator (1), the processing chamber (3) being connected to the diluted anhydrous hydrogen fluoride gas generator (1) through a pipe line of such metal as stainless steel or nickel. There is also provided according to the invention a dry-etching method with the dry-etching apparatus, and a diluted anhydrous hydrogen gas generator (1) used in the dry-etching apparatus and dry-etching method.
Inventors
- 👤 Ohmi Tadahiro
- 👤 Miki Masahiro
- 👤 Maeno Matagoro
- 👤 Kikuyama Hirohisa
Bibliographic Details
Claims Analysis
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