Patent EP0353766A2 successfully refreshed from Google Patents.
EP0353766A2
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EP
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Polynorbornene laminates
Assignee: Goodrich Corp
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Filing: 1989-08-04
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Granted: —
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Expires: 2009-08-04
Abstract
Abstract Printed wiring boards useful for high frequency applications are obtained by laminating a copper foil pretreated with a silane to a polynorbornene prepreg. The prepreg is made by impregnating a fiberglass cloth with a ring-opening polymerized polymer. The copper foil is pretreated with a silane which is capable of improving the bond strength between the copper foil and a norbornene copolymer.
Inventors
- 👤 George Martin Benedikt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 09:40
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B15/20; B32B27/00; B32B27/18; B32B27/24; B32B38/00; B32B38/0036; B32B38/08; C; C08; C08G; C08G61/00; C08G61/02; C08G61/04; C08G61/06; C08G61/08; C08J; C08J5/00; C08J5/04; C08J5/06; C08J5/08; C08J5/24; C08J5/241; C08J5/244; C08J5/249; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K3/00; H05K3/38; H05K3/389; B32B2255/00; B32B2255/02; B32B2255/26; B32B2309/00; B32B2309/02; B32B2311/00; B32B2311/12; B32B2457/00; B32B2457/08; C08J2365/00; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12542; Y10T428/12549; Y10T428/12556; Y10T428/12569; Y10T442/00; Y10T442/30; Y10T442/3382; Y10T442/3415; Y10T442/60; Y10T442/654; Y10T442/656
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
90 words
A process for producing a laminate, comprising: (a) providing a polynorbornene dipping solution comprised of polynorbornene polymers within a solvent; (b) impregnating a non-cellulosic cloth with the dipping solution and drying said impregnated cloth to remove a substantial portion of solvent to form a substrate layer; (c) pretreating the surface of a copper film with a solution of a silane compound suitable for increasing the bond strength between the substrate layer and the copper layer; and d) laminating the substrate layer to the metallic film across the pretreated copper layer.
Claim 2
Dependent Claim
90 words
A process for producing a laminate, comprising: (a) providing a polynorbornene dipping solution comprised of polynorbornene polymers within a solvent; (b) impregnating a non-cellulosic cloth with the dipping solution and drying said impregnated cloth to remove a substantial portion of solvent to form a substrate layer; (c) pretreating the surface of a copper film with a solution of a silane compound suitable for increasing the bond strength between the substrate layer and the copper layer; and d) laminating the substrate layer to the metallic film across the pretreated copper layer.
Claim 3
Dependent Claim
20 words
A process as in claim 1 wherein the surface of the copper film which is pretreated has a bronze coating.
Claim 4
Dependent Claim
24 words
The process of claim 1 wherein the polynorbornene polymer is unsaturated and is derived from a cycloolefin monomer selected from methyltetracyclododecene, vinyl-norbornene and dicyclopentadiene.
Claim 5
Dependent Claim
29 words
The process of claim 1 wherein the monomers of the polynorbornene polymer are comprised in a weight to weight ratio of about 50-75 percent methyltetracyclododecene to 25-50 percent vinylnorbornene.
Claim 6
Dependent Claim
29 words
The process of claim 1 wherein the monomers of the polynorbornene polymer are comprised in weight to weight ratio of about 75-90 percent dicyclopentadiene to about 10-25 percent vinyl-norbornene.
Claim 7
Dependent Claim
18 words
The process of claim 1 wherein the dipping solution further comprises a curing agent which initiates radical crosslinking.
Claim 8
Dependent Claim
27 words
The process of claim 1 wherein the silane is selected from the group consisting of 3-methylacryloxypropyltrimethoxysilane, 3-(N-styrylmethyl-2-aminoethylamino)propyltrimethoxysilane hydrochloride, 3-(N-allyl-2-aminoethylamino)-propyltrimethoxysilane hydrochloride, N-(styrylmethyl)-3-aminopropyltrimethoxysilane hydrochloride, N-2-aminoethyl-3-aminopropyltrimethoxysilane, and 3-(N-Benzyl-2-aminoethylamino)-propyltrimethoxy silane hydrochloride.
Claim 9
Dependent Claim
22 words
The process of claim 1 wherein the laminating step is performed at a temperature above the glass transition temperature of the polynorbornene.
Claim 10
Dependent Claim
18 words
The process of claim 1 wherein the laminating step is performed at between ambient temperature and about 250°C.
Claim 11
Dependent Claim
26 words
The process of claim 1 further comprising placing two or more substrate layers in a stacking sequence with copper layers at the outside of the stack.
Claim 12
Dependent Claim
18 words
The process of claim 1 wherein the cloth is impregnated from 30% to 80% by weight polynorbornene polymer.
Claim 13
Dependent Claim
11 words
A printed wiring board made by the process of claim 1.
Claim 14
Dependent Claim
17 words
The printed wiring board of claim 12 wherein the non-cellulosic cloth is woven or non-woven fiberglass cloth.
Claim 15
Dependent Claim
23 words
The printed wiring board of claim 12 wherein the polynorbornene is derived from of vinyl-norbornene monomers polymerized with either methyltetracyclododecene or dicyclopentadiene monomers.
Claim 16
Dependent Claim
20 words
The printed wiring board of claim 12 wherein the dipping solution further comprises a curing agent which initiates radical crosslinking.
Claim 17
Dependent Claim
15 words
The printed wiring board of claim 12 wherein the dipping solution further comprises an antioxidant.
Claim 18
Dependent Claim
36 words
The printed wiring board of claim 12 wherein the copper film is the surface layer of a metallic film selected from the group consisting of copper, nickel, silver, gold, aluminum, platinum, titanium, zinc, bronze and chromium.
Claim 19
Dependent Claim
35 words
The printed wiring board of claim 12 wherein the silane suitable for increasing the bonding strength is selected from the group consisting of 3-methylacryloxypropyltrimethoxysilane, 3-(N-styrylmethyl-2-aminoethylamino)propyltrimethoxysilane hydrochloride, 3-(N-allyl-2-aminoethylamino)-propyltrimethoxysilane hydrochloride, N-(styrylmethyl)-3-aminopropyltrimethoxysilane hydrochloride, N-2-aminoethyl-3-aminopropyltrimethoxysilane, and 3-(N-Benzyl-2-aminoethylamino)-propyl trimethoxysilane hydrochloride.
Claim 20
Dependent Claim
18 words
The printed wiring board of claim 12 wherein the non-cellulosic cloth is pretreated with a styryl diamino silane.
References Cited (Backward Citations)
No citation records indexed.
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