Patent EP0346061A2 successfully refreshed from Google Patents.
EP0346061A2
Expired / Lapsed
EP
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Integrated circuit device having an improved package structure
Assignee: Fujitsu VLSI Ltd
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Filing: 1989-06-06
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Granted: —
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Expires: 2009-06-06
Abstract
Abstract An integrated circuit device includes a package (11, 41) having first and second surfaces and first and second internal connection lines (13b, 41b). A semiconductor integrated circuit chip (16) is mounted on the first surface of the package. A first group of external connection terminals (15) is provided on the first surface of the package, and is electrically connected to the semiconductor integrated circuit chip through the first internal connection lines (13b). A second group of external connection terminals (18) is provided on the second surface of the package so as to form a matrix arrangement of terminals, and is electrically connected to the semiconductor integrated circuit chip through the second internal connection lines (41b). The second group of external connection terminals includes specific terminals (18-2) specifically passing signals to be supplied to or from the semiconductor integrated circuit chip. The signals passing through the specific terminals are signals used at the time of evaluating the semiconductor integrated circuit chip.
Inventors
- 👤 Akihiro Oku
- 👤 Souichi Aonuma
- 👤 Tetsushi Wakabayashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 09:36
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W90/00; H10W90/401; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/682; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
173 words
An integrated circuit device comprising a semiconductor integrated circuit chip (16); a package (11, 41) having first and second surfaces and first and second internal connection lines (13b, 41b), said semiconductor integrated circuit chip being mounted on the first surface of said package; and a first group of external connection terminals (15) provided on the first surface of said package, said first group of external connection terminals being electrically connected to said semiconductor integrated circuit chip through said first internal connection lines (13b), characterized by comprising a second group of external connection terminals (18) provided on the second surface of said package so as to form a matrix arrangement of terminals, said second group of external connection terminals being electrically connected to said semiconductor integrated circuit chip through said second internal connection lines (41b) and including specific terminals (18-2) specifically passing signals to be supplied to or from said semiconductor integrated circuit chip, said signals passing through said specific terminals being signals used at the time of evaluating said semiconductor integrated circuit chip.
Claim 2
Dependent Claim
173 words
An integrated circuit device comprising a semiconductor integrated circuit chip (16); a package (11, 41) having first and second surfaces and first and second internal connection lines (13b, 41b), said semiconductor integrated circuit chip being mounted on the first surface of said package; and a first group of external connection terminals (15) provided on the first surface of said package, said first group of external connection terminals being electrically connected to said semiconductor integrated circuit chip through said first internal connection lines (13b), characterized by comprising a second group of external connection terminals (18) provided on the second surface of said package so as to form a matrix arrangement of terminals, said second group of external connection terminals being electrically connected to said semiconductor integrated circuit chip through said second internal connection lines (41b) and including specific terminals (18-2) specifically passing signals to be supplied to or from said semiconductor integrated circuit chip, said signals passing through said specific terminals being signals used at the time of evaluating said semiconductor integrated circuit chip.
Claim 3
Dependent Claim
34 words
An integrated circuit device as claimed in claim 1, characterized in that said signals passing through said specific terminals (18-2) are different from signals passing through said first group of external connection terminals (15).
Claim 4
Dependent Claim
38 words
An integrated circuit device as claimed in claim 1 or 2, characterized in that said specific terminals (18-2) of said second group of external connection terminals (18) are operationally independent of said first group of external connection terminals.
Claim 5
Dependent Claim
41 words
An integrated circuit device as claimed in any of claims 1 to 3, characterized in that said external connection terminals (18) forming said second group are arranged in the form of a matrix having at least two rows and two columns.
Claim 6
Dependent Claim
36 words
An integrated circuit device as claimed in any of claims 1 to 4, characterized in that said second group of external connection terminals (18) includes power supply terminals (18-1) in addition to said specific terminals (18-2).
Claim 7
Dependent Claim
35 words
An integrated circuit device as claimed in claim 5, characterized in that said power supply terminals (18-1) are located in the corners of the matrix arrangement of said second group of external connection terminals (18).
Claim 8
Dependent Claim
48 words
An integrated circuit device as claimed in claim 5 or 6, characterized in that said first group of external connection terminals (15) includes power supply terminals, and said power supply terminals (18-1) of said second group are electrically connected to said power supply terminals of said first group.
Claim 9
Dependent Claim
28 words
An integrated circuit device as claimed in any of claims 1 to 7, characterized in that said external connection terminals (18) forming said second group are pin-shaped terminals.
Claim 10
Dependent Claim
28 words
An integrated circuit device as claimed in claim 8, characterized in that said external connection terminals (18) forming said second group elevationally project from said package (11, 41).
Claim 11
Dependent Claim
152 words
An integrated circuit device as claimed in any of claims 1 to 9, characterized in that said package comprising: a package body (11) including a chip mounting layer (12) providing said first surface of said package, said semiconductor integrated circuit chip (16) being mounted on said chip mounting layer, and a wire bonding layer (13, 13-1, 13-2) mounted on said chip mounting layer having bonding pads connected to said semiconductor integrated circuit chip through bonding wires (17), and a metallized insulating layer (41) making contact with said chip mounting layer and providing said second surface of said package, said second group of external connection terminals (18) being provided on said metallized insulating layer, and that said first internal connection lines (13b) are formed in said chip mounting layer (12) and said wire bondig layer (13, 13-1, 13-2), and said second internal connection lines (41b) are formed in said metallized insulating layer (41).
Claim 12
Dependent Claim
26 words
An integrated circuit device as claimed in claim 10, characterized in that said metallized insulating layer (41) comprises a plurality of stacked layers (41-1, 41-2, 41-3).
Claim 13
Dependent Claim
34 words
An integrated circuit device as claimed in claim 10 or 11, characterized in that said metallized insulating layer (41) is formed of an insulating material to which said second internal connection lines are provided.
Claim 14
Dependent Claim
40 words
An integrated circuit device as claimed in any of claims 1 to 12, characterized by further comprising a cap (14) provided on said first surface of said package body so as to hermetically seal said semiconductor integrated circuit chip (16).
Claim 15
Dependent Claim
28 words
An integrated circuit device as claimed in any of claims 1 to 13, characterized in that said semiconductor integrated circuit chip (16) comprises an application specific integrated circuit.
Claim 16
Dependent Claim
27 words
An integrated circuit device as claimed in any of claims 1 to 13, characterized in that said semiconductor integrated circuit chip (16) comprises a digital signal processor.
Claim 17
Dependent Claim
212 words
An integrated circuit device comprising a semiconductor integrated circuit chip (93); a package body (100) having first and second surfaces opposite to each other and first and second internal connection lines (96, 98), said semiconductor integrated circuit chip being mounted on the first surface of said package body; and a first group of external connection terminals (95) provided on the second surface of said package body, said first group of external connection terminals being electrically connected to said semiconductor integrated circuit chip through said first internal connection lines (96), characterized by further comprising a metallized insulating cap (92) having third internal lines (92b) and being mounted on said package body so that the first surface of said metallized insulating cap faces the first surface of said package body; and a second group of external connection terminals (102) mounted on the second surface of said metallized insulating cap (92) and being electrically connected to said semiconductor integrated circuit chip through said second and third internal connection lines (98, 92b), said second group of external connection terminals including specific terminals specifically passing signals to be supplied to or from said semiconductor integrated circuit chip, said signals passing through said specific terminals being signals used at the time of evaluating said semiconductor integrated circuit chip.
Claim 18
Dependent Claim
212 words
An integrated circuit device comprising a semiconductor integrated circuit chip (93); a package body (100) having first and second surfaces opposite to each other and first and second internal connection lines (96, 98), said semiconductor integrated circuit chip being mounted on the first surface of said package body; and a first group of external connection terminals (95) provided on the second surface of said package body, said first group of external connection terminals being electrically connected to said semiconductor integrated circuit chip through said first internal connection lines (96), characterized by further comprising a metallized insulating cap (92) having third internal lines (92b) and being mounted on said package body so that the first surface of said metallized insulating cap faces the first surface of said package body; and a second group of external connection terminals (102) mounted on the second surface of said metallized insulating cap (92) and being electrically connected to said semiconductor integrated circuit chip through said second and third internal connection lines (98, 92b), said second group of external connection terminals including specific terminals specifically passing signals to be supplied to or from said semiconductor integrated circuit chip, said signals passing through said specific terminals being signals used at the time of evaluating said semiconductor integrated circuit chip.
Claim 19
Dependent Claim
89 words
An integrated circuit device as claimed in claim 16, characterized in that said package body (100) comprises first conductive pads (97) formed on the first surface thereof and connected to said second internal connection lines (98), and said metallized insulating cap (92) comprises second conductive pads (99) formed on the first surface thereof and connected to said third internal connection lines (92b), and that said metallized insulating cap (92) is mounted on said package body (100) so that said second conductive pads make contact with said first conductive pads.
Claim 20
Dependent Claim
39 words
An integrated circuit device as claimed in claim 17, characterized in that said metallized insulating cap (92) is fastened to said package body (100) by a conductive adhesive (101) formed around each of said first and second conductive pads.
Claim 21
Dependent Claim
30 words
An integrated circuit device as claimed in claim 17 or 18, characterized in that said first conductive pads (97) has the same arrangement pattern as said second conductive pads (99).
Claim 22
Dependent Claim
48 words
An integrated circuit device as claimed in any of claims 16 to 19, characterized in that the first surface of said package body (100) is formed stepwise, and said semiconductor integrated circuit chip (93) is mounted on a bottom portion of said first surface of said package body.
Claim 23
Dependent Claim
45 words
An integrated circuit device as claimed in any of claims 16 to 20, characterized in that said metallized insulating cap (92) comprises a plurality of stacked layers (92-1, 92-2, 92-3) each formed of an insulating material to which said third internal connection lines are provided.
Claim 24
Dependent Claim
40 words
An integrated circuit device as claimed in any of claims 16 to 21, characterized in that said second group of external connection terminals (102) are pin-shaped terminals, and elevationally project from the second surface of said metallized insulating cap (92).
Claim 25
Dependent Claim
32 words
An integrated circuit device as claimed in any of claims 16 to 22, characterized in that said second group of external connection terminals (102) are arranged in the form of a matrix.
Claim 26
Dependent Claim
47 words
An integrated circuit device as claimed in any of claims 16 to 23, characterized in that said signals passing through said specific terminals (102-2) of said second group of external connection terminals (102) are signals used at the time of evaluating said semiconductor integrated circuit chip (93).
Claim 27
Dependent Claim
40 words
An integrated circuit device as claimed in any of claims 16 to 24, characterized in that said specific terminals (102-2) of said second group of external connection terminals (102) are operationally independent of said first group of external connection terminals.
Claim 28
Dependent Claim
33 words
An integrated circuit device as claimed in any of claims 16 to 25, said second group of external connection terminals (102) includes power supply terminals (102-1) in addition to said specific terminals (102-2).
Claim 29
Dependent Claim
52 words
An integrated circuit device as claimed in claim 26, characterized in that said external connection terminals (102) forming said second group are arranged in the form of a matrix, and said power supply terminals (102-1) are located in the corners of the matrix arrangement of said second group of external connection terminals.
Claim 30
Dependent Claim
60 words
An integrated circuit device as claimed in claim 26, characterized in that said first group of external connection terminals (95) includes power supply terminals, and said power supply terminals (102-1) of said second group are electrically connected to said power supply terminals of said first group through some of said first, second and third internal connection lines (96, 98, 92b).
Claim 31
Dependent Claim
28 words
An integrated circuit device as claimed in any of claims 16 to 28, characterized in that said semiconductor integrated circuit chip (93) comprises an application specific integrated circuit.
Claim 32
Dependent Claim
27 words
An integrated circuit device as claimed in any of claims 16 to 28, characterized in that said semiconductor integrated circuit chip (93) comprises a digital signal processor.
Claim 33
Dependent Claim
62 words
An integrated circuit device as claimed in any of claims 16 to 30, characterized in that said metallized insulating cap (92) includes through holes (92c) located so as to have the same arrangement pattern as said second conductive pads, and each of said through holes is provided with a conductive plating (92d) electrically connected to related one of said second conductive pads.
Claim 34
Dependent Claim
33 words
An integrated circuit device as claimed in claim 31, characterized in that said through holes (92c) having conductive plating (92d) are filled with conductive materials (103) electrically contact with said second conductive pads.
References Cited (Backward Citations)
No citation records indexed.
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