Patent EP0343400A2 successfully refreshed from Google Patents.
EP0343400A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic package assembly with flexible carrier and method of making it
Assignee: International Business Machines Corp
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Filing: 1989-04-29
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Granted: —
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Expires: 2009-04-29
Abstract
Abstract The disclosure describes a form of packaging for an electronic device and a method of achieving it in order to overcome the problem of damage because of cycles in environmental temperature. A thin, flexible foil functioning as a carrier of electrically conductive material selected from the group including Invar, copper-Invar-copper and Kovar is coated with a preselected polyimide, on which is formed a thin metalized coating of chromium, in the order of 20 nm, and copper, in the order of 8000 nm. A predetermined electrical circuit is formed out of this metallized coating by a photolithographic process and is connected electrically to the flexible metal foil by vias through the polyimide coating. At least one electronic device is bonded to the electrical circuit at a predetermined location to operate functionally with the circuit, and both the device and the circuit are connected electrically by the vias to the thin, metal carrier which functions as a power plane for the package.
Inventors
- 👤 Donald Gene Mcbride
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 16:22
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H10; H10W; H10W70/00; H10W70/40; H10W70/451; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
115 words
An electronic package assembly, comprising: a flexible carrier formed of a predetermined material that is electrically conductive and has a low coefficient of thermal expansion; a layer of electrically insulating material formed on and supported by said flexible carrier material; an electrical circuit formed on and supported by said layer of electrically insulating material, including conductors of electrically conductive material in a predetermined pattern; a predetermined electronic device bonded to said electrical circuit in a predetermined location to be operatively functional with said electrical circuit; and at least one path formed through said layer of electrically insulating material for connecting said electrical circuit at a preselected location to said flexible carrier of electrically conductive material.
Claim 2
Dependent Claim
115 words
An electronic package assembly, comprising: a flexible carrier formed of a predetermined material that is electrically conductive and has a low coefficient of thermal expansion; a layer of electrically insulating material formed on and supported by said flexible carrier material; an electrical circuit formed on and supported by said layer of electrically insulating material, including conductors of electrically conductive material in a predetermined pattern; a predetermined electronic device bonded to said electrical circuit in a predetermined location to be operatively functional with said electrical circuit; and at least one path formed through said layer of electrically insulating material for connecting said electrical circuit at a preselected location to said flexible carrier of electrically conductive material.
Claim 3
Dependent Claim
27 words
The electronic package assembly as described in claim 1 wherein said flexible carrier is formed from a material from the group including Invar, copper-Invar-copper, Kovar and copper-Kovar-copper.
Claim 4
Dependent Claim
22 words
The electronic package assembly as described in claim 1 or 2 wherein said layer of electrically insulating material consists of a polyimide.
Claim 5
Dependent Claim
20 words
The electronic package assembly as described in claim 1 or 2 wherein said layer of electrically insulating material includes Teflon.
Claim 6
Dependent Claim
62 words
The electronic package assembly as described in claim 3 wherein said layer consisting of a polyimide includes at least one vias formed therethrough to connect said electrical circuit electrically to said flexible carrier; and said flexible carrier is adapted to provide at least one terminal of electrical power to said electrical circuit and to said electronic device bonded to said electrical circuit.
Claim 7
Independent Claim
75 words
The method of making an electronic package assembly, comprising the steps of: providing a flexible carrier of an electrically conductive material; forming a layer on said flexible carrier of an electrically insulating material; forming vias in said layer of electrically insulating material at predetermined locations through to communicate with said flexible carrier; metallizing said layer of electrically insulating material to include said vias; and forming an electronic circuit from said metallization of said insulating material.
Claim 8
Independent Claim
75 words
The method of making an electronic package assembly, comprising the steps of: providing a flexible carrier of an electrically conductive material; forming a layer on said flexible carrier of an electrically insulating material; forming vias in said layer of electrically insulating material at predetermined locations through to communicate with said flexible carrier; metallizing said layer of electrically insulating material to include said vias; and forming an electronic circuit from said metallization of said insulating material.
Claim 9
Dependent Claim
30 words
The method of making an electronic package assembly as described in claim 6 wherein said step of forming vias in said insulating material includes the steps of masking and etching.
Claim 10
Dependent Claim
26 words
The method of making an electronic package assembly as described in claim 6 or 7 wherein said step metallizing said insulating material comprises an evaporation process.
Claim 11
Independent Claim
42 words
The method of making an electronic package assembly as described in one or more of the preceding claims 6 to 8 wherein said step of forming an electronic circuit from the metallization of said layer of insulating material comprises a photolithographic process.
Claim 12
Independent Claim
93 words
The method of making an electronic package assebly as described in one or more of the preceding claims 6 to 9 wherein said insulating material includes a preselected polyimide; said metallizing step includes the use of a preselected chromium and copper chromium material with thicknesses in the order of 20 nm and 8000 nm, respectively; and bonding a predetermined electronic device to said electronic circuit using a Controlled Collapse Chip Connection process; so that said flexible carrier is functionally operable as a power plane for said electrical circuit and for said electronic device.
Claim 13
Independent Claim
61 words
The method of making an electronic package assembly as described in one or more of the preceding claims 6 to 10 including means for providing stress relief between said flexible carrier and a second level carrier by means of pre-formed bent leads or an elastic cross section of circuitry over said electrically insulating layer, where said carrier has been selectively removed.
References Cited (Backward Citations)
No citation records indexed.
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