Patent EP0333374A2 successfully refreshed from Google Patents.
EP0333374A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Edge-mounted, surface-mount package for semiconductor integrated circuit devices
Assignee: Texas Instruments Inc
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Filing: 1989-03-08
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Granted: —
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Expires: 2009-03-08
Abstract
Abstract A flat package (10) for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic (12) containing a semiconductor chip (11), and flat leads (14) extend from one edge of the package. The leads are bent to provide an area (18) to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs (15) extending from the edge of the package adjacent the leads. The studs have stops (17) formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.
Inventors
- 👤 Daniel A. Baudouin
- 👤 Ernest J. Russell
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10454; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10696; H05K2203/00; H05K2203/16; H05K2203/167; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
101 words
A flat, edge-mounted, surface-mount semiconductor integrated circuit device or the like, comprising: a relatively flat package encapsulating a semiconductor chip, said chip having a plurality of bonding pads along at least one edge, a plurality of conductive leads extending from at least one edge of said housing, the leads being electrically connected to said bonding pads, and a plurality of studs extending from said at least one edge of said housing, said studs being shaped to fit into holes in a printed circuit board for mechanically positioning and supporting the package when said leads are soldered to the printed circuit board.
Claim 2
Dependent Claim
101 words
A flat, edge-mounted, surface-mount semiconductor integrated circuit device or the like, comprising: a relatively flat package encapsulating a semiconductor chip, said chip having a plurality of bonding pads along at least one edge, a plurality of conductive leads extending from at least one edge of said housing, the leads being electrically connected to said bonding pads, and a plurality of studs extending from said at least one edge of said housing, said studs being shaped to fit into holes in a printed circuit board for mechanically positioning and supporting the package when said leads are soldered to the printed circuit board.
Claim 3
Dependent Claim
20 words
A device according to claim 1 wherein said package is composed of plastic molded around said chip and said leads.
Claim 4
Dependent Claim
21 words
A device according to claim 1 wherein said leads are bent to present a face generally perperdicular to said flat package.
Claim 5
Dependent Claim
43 words
A device according to claim 1 wherein said studs each have a stop formed thereon to limit the extension of the stud into the printed circuit board and provide a selected spacing between the edge of the package and the printed circuit board.
Claim 6
Independent Claim
14 words
A Device according to calim 1 wherein said studs are composed to non-conductive material.
Claim 7
Independent Claim
14 words
A Device according to calim 1 wherein said studs are composed to non-conductive material.
Claim 8
Dependent Claim
27 words
A device according to claim 5 wherein said leads are bent to present a face generally perpendicular to the printed circuit board and aligned with said stop.
Claim 9
Dependent Claim
17 words
A device according to claim 6 wherein said package and said studs are composed of molded plastic.
Claim 10
Dependent Claim
25 words
A device according to claim 1 wherein said package is a shallow ceramic header and said chip is mounted within a recess in said header.
Claim 11
Dependent Claim
73 words
A plastic frame and package combination for use in the manufacture of semiconductor devices, comprising a flat plastic package containing a semiconductor chip, a plastic frame surrounding said package but spaced therefrom, generally coplanar with said package, a plurality of conductive leads extending from one edge of said package and through one side of said frame, and a plurality of studs composed of nonconductive material extending from said one edge of said package.
Claim 12
Dependent Claim
73 words
A plastic frame and package combination for use in the manufacture of semiconductor devices, comprising a flat plastic package containing a semiconductor chip, a plastic frame surrounding said package but spaced therefrom, generally coplanar with said package, a plurality of conductive leads extending from one edge of said package and through one side of said frame, and a plurality of studs composed of nonconductive material extending from said one edge of said package.
Claim 13
Dependent Claim
18 words
A device according to claim 9 wherein said studs include a stop formed thereon to provide a spacer.
Claim 14
Dependent Claim
48 words
A device according to claim 10 wherein said leads are exposed between said one edge of said package and said frame for a distance sufficient to clip the leads and bend the leads to form a generally flat outer surface generally coplanar with said stops of said studs.
Claim 15
Dependent Claim
44 words
A device according to claim 11 wherein said studs have a portion outward of said stop for insertion into a hole in a printed circuit board when said flat outer surface of said leads is soldered to a conductor on the printed circuit board.
Claim 16
Dependent Claim
111 words
A flat, plastic-encapsulated, edge-mounted, surface-mount semiconductor integrated circuit device or the like, comprising: a relatively flat plastic package encapsulating a semiconductor chip, said chip having a plurality of bonding pads along at least one edge, a plurality of conductive leads extending from at least one edge of said package, each of said leads being electrically connected to one of said bonding pads, and a plurality of non-conductive plastic studs integral with said package extending from said at least one edge of said package, said studs being shaped to fit into holes in a printed circuit board for mechanically supporting the package when said leads are soldered to the printed circuit board.
Claim 17
Dependent Claim
111 words
A flat, plastic-encapsulated, edge-mounted, surface-mount semiconductor integrated circuit device or the like, comprising: a relatively flat plastic package encapsulating a semiconductor chip, said chip having a plurality of bonding pads along at least one edge, a plurality of conductive leads extending from at least one edge of said package, each of said leads being electrically connected to one of said bonding pads, and a plurality of non-conductive plastic studs integral with said package extending from said at least one edge of said package, said studs being shaped to fit into holes in a printed circuit board for mechanically supporting the package when said leads are soldered to the printed circuit board.
Claim 18
Dependent Claim
35 words
A device according to claim 13 wherein said package is composed of plastic molded around said chip and said leads to hermetically seal the chip and leads except where the leads extend from said edge.
Claim 19
Dependent Claim
22 words
A device according to claim 14 wherein said leads are shaped to present a flat face generally perperdicular to said flat package.
Claim 20
Dependent Claim
52 words
A device according to claim 15 wherein said studs each have a clyindrical end piece and have a stop formed inward of said end-piece to limit the extension of the stud into the printed circuit board and provide a selected spacing between the edge of the package and the printed circuit board.
Claim 21
Dependent Claim
32 words
A device according to claim 16 wherein said leads are bent to present said flat face generally perpendicular to the printed circuit board and the flat face is aligned with said stop.
References Cited (Backward Citations)
No citation records indexed.
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