Method of constructing a high performance printed circuit board assembly

Claim 2

Method of constructing a high performance printed circuit board assembly utilizing a modular con­struction technique comprising the steps of: (a) fabricating a number of circuitized power plane sub-assemblies (10), each respective sub-assembly characterized by a signal plane (4, 5) disposed on opposite sides of an internal power plane (2) and electrically communicating by means of plated vias (13) where necessary; and (b) laminating at least two sub-assemblies together to form a composite of triplate construction (11); and (c) constructing a printed circuit board assembly (20) by building a multi-laminate structure using said composite.

Claim 3

The method of constructing a high performance printed circuit board assembly in accordance with claim 1, further comprising the step of: (d) testing each respective sub-assembly (10) for electrical integrity prior to the laminating step (b).

Claim 4

The method of constructing a high performance printed circuit board assembly in accordance with claim 1, wherein the fabrication of each sub-­assembly of step (a) further comprises the steps of: (i) perforating a first conductive sheet (2) having two outer surfaces with a power plane configuration; (ii) laminating a second conductive sheet (4, 5) on each of said outer surfaces of said first perforated conductive sheet to form a core (7); (iii) circuitizing said outer conductive sheets of the core to form a first sub-assembly (10); (iv) fabricating a second sub-assembly by repeating steps (i), (ii) and (iii); and (v) laminating said first and second sub-assemblies together to form a triplate construction (11).

Claim 5

The method of constructing a high performance printed circuit board assembly, in accordance with claim 3, further comprising the step of: (vi) fabricating plated vias (13) in each of said sub-assemblies where necessary.

Claim 6

The method of constructing a high performance printed circuit board assembly in accordance with claim 4, further comprising the step of: (vii) testing each of said sub-assemblies for electrical integrity.

Claim 7

The method of constructing a high performance printed circuit board assembly in accordance with claim 3, wherein the laminating of the first and second sub-assemblies together in step (v) includes the use of a bonding film (9).

Claim 8

The method of constructing a high performance printed circuit board assembly in accordance with claim 3, wherein the laminating of the first and second sub-assemblies together in step (v) in­cludes the use of an epoxy resin.

Claim 11

The method of constructing a high performance printed circuit board assembly in accordance with claim 8, further comprising the step of: (e) testing each respective sub-assembly (10) for electrical integrity prior to the laminating step (c).

Claim 12

The method of constructing a high performance printed circuit board assembly in accordance with claim 8, wherein the fabrication of each sub-assembly of step (a) further comprises the steps of: (i) perforating a first conductive sheet (2) having two outer surfaces with a power plane configuration; (ii) laminating a second conductive sheet (4, 5) on each of said outer surfaces of said first perforated conductive sheet to form a core (7); (iii) circuitizing said outer conductive sheets of the core to form a first sub-assembly (10); (iv) fabricating a second sub-assembly (10) by repeating steps (i), (ii) and (iii); and (v) laminating said first and second sub-assemblies (10) together to form a triplate construction (11).