Abstract A hybrid IC with a heat sink includes a conductive substrate (1), a heat sink (2), an insulating sheet (4), a plurality of terminals (3), a power-consuming component (9), and a resin. The heat sink is separated from the conductive substrate. The insulating sheet is arranged on the conductive substrate. Electric components, wiring conductors (5), and connecting electrodes (5) are arranged on a surface of the insulating sheet. The terminals are connected to the connecting electrodes on the insulating sheet. The power-consuming component is disposed on the heat sink to be connected to the wiring conductors on the insulating sheet through bonding wires. The resin seals the insulating sheet and a portion of the heat sink on which the power-consuming component is disposed.
A hybrid IC with a heat sink, comprising: a conductive substrate (1); a heat sink (2) separated from said conductive substrate (1); an insulating sheet (4) arranged on said conductive substrate (1), electric components, wiring conductors (5), and connecting electrodes (5) being arranged on a surface of said insulating sheet (4); a plurality of terminals (3) connected to said connecting electrodes (5) on said insulating sheet (4); a power-consuming component (9) disposed on said heat sink (2) to be connected to said wiring conductors (5) on said insulating sheet (4) through connecting means (10); and a resin sealing said insulating sheet (4) and a portion of said heat sink (2) on which said power-consuming component (9) is disposed.
Claim 2
Dependent Claim
118 words
A hybrid IC with a heat sink, comprising: a conductive substrate (1); a heat sink (2) separated from said conductive substrate (1); an insulating sheet (4) arranged on said conductive substrate (1), electric components, wiring conductors (5), and connecting electrodes (5) being arranged on a surface of said insulating sheet (4); a plurality of terminals (3) connected to said connecting electrodes (5) on said insulating sheet (4); a power-consuming component (9) disposed on said heat sink (2) to be connected to said wiring conductors (5) on said insulating sheet (4) through connecting means (10); and a resin sealing said insulating sheet (4) and a portion of said heat sink (2) on which said power-consuming component (9) is disposed.
Claim 3
Dependent Claim
22 words
An IC according to claim 1, wherein said substrate (1) and said heat sink (2) are formed by dimpling a metal ribbon.
Claim 4
Dependent Claim
24 words
An IC according to claim 2, wherein said substrate (1) and said heat sink (2) are formed into recesses lower than a ribbon surface.
Claim 5
Dependent Claim
18 words
An IC according to claim 2, wherein said terminals (3) are directly connected to said connecting electrodes (5).
Claim 6
Dependent Claim
20 words
An IC according to claim 1, wherein said power-consuming component (9) includes a plurality of power-consuming components (9a, 9b, 9c).
Claim 7
Dependent Claim
23 words
An IC according to claim 5, wherein said power-consuming component (9) is arranged on said heat sink (2) through an insulating member (2a).
Claim 8
Dependent Claim
28 words
An IC according to claim 1, wherein said heat sink (2) and said terminals (3) are arranged so as to oppose each other through said conductive substrate (1).
References Cited (Backward Citations)
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