Patent EP0320244A2 successfully refreshed from Google Patents.
EP0320244A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electrical contact bump and a package provided with the same
Assignee: Panasonic Holdings Corp
•
Filing: 1988-12-07
•
Granted: —
•
Expires: 2008-12-07
Abstract
Abstract A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.
Inventors
- 👤 Toshio Tsuda
- 👤 Yasuhiko Horio
- 👤 Yoshihiro Bessho
- 👤 Toru Ishida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 21:50
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49151
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
70 words
An electrical contact bump formed on an electrode pad formed on a substrate, comprising: a first raised portion attached to the electrode pad; and a second raised portion formed on the first raised portion and having a cross sectional area in a plane parallel to the surface of the electrode pad smaller than that of the first raised portion in a plane parallel to the surface of the electrode pad.
Claim 2
Dependent Claim
70 words
An electrical contact bump formed on an electrode pad formed on a substrate, comprising: a first raised portion attached to the electrode pad; and a second raised portion formed on the first raised portion and having a cross sectional area in a plane parallel to the surface of the electrode pad smaller than that of the first raised portion in a plane parallel to the surface of the electrode pad.
Claim 3
Dependent Claim
61 words
An electrical contact bump according to Claim 1, wherein the ratio of the sectional area of the first raised portion to that of the second raised portion is in the range of 3/2 to 5/1, and the ratio of the height of the first raised portion to that of the second raised portion is in the range of 1/2 to 2/1.
Claim 4
Dependent Claim
25 words
An electrical contact bump according to Claim 1, wherein the width of the first raised portion is in the range of 60 to 120 µm.
Claim 5
Dependent Claim
36 words
An electrical contact bump according to Claim 1, wherein the the sum of the height of the first raised portion and that of the second raised portion is in the range of 30 to 90 µm.
Claim 6
Dependent Claim
33 words
An electrical contact bump according to Claim 1, wherein the first and second raised portions are formed of gold, copper, aluminum or an alloy containing gold, copper or aluminum as a main component.
Claim 7
Dependent Claim
44 words
An electrical contact bump formed on an electrode pad formed on a substrate, comprising: a first raised portion attached to the electrode pad; and a second raised portion formed on the first raised portion and made of a conductive wire bent in a loop.
Claim 8
Dependent Claim
44 words
An electrical contact bump formed on an electrode pad formed on a substrate, comprising: a first raised portion attached to the electrode pad; and a second raised portion formed on the first raised portion and made of a conductive wire bent in a loop.
Claim 9
Dependent Claim
33 words
An electrical contact bump according to Claim 6, wherein the first and second raised portions are formed of gold, copper, aluminum or an alloy containing gold, copper or aluminum as a main component.
Claim 10
Dependent Claim
138 words
A package comprising: a first substrate provided with a plurality of conductive terminals; a second substrate provided with a plurality of electrode pads respectively at positions corresponding to the conductive terminals of the first substrate; a plurality of electrical contact bumps formed respectively on the plurality of electrode pads, and each consisting of a first raised portion attached to the corresponding electrode pad, and a second raised portion formed on the first raised portion, the area of a section of the second raised portion in a plane parallel to the surface of the electrode pad being smaller than the area of a section of the first raised portion parallel to the section of the second raised portion; and droplets of a conductive adhesive respectively bonding the electrical contact bumps and the corresponding conductive terminals of the first substrate.
Claim 11
Dependent Claim
138 words
A package comprising: a first substrate provided with a plurality of conductive terminals; a second substrate provided with a plurality of electrode pads respectively at positions corresponding to the conductive terminals of the first substrate; a plurality of electrical contact bumps formed respectively on the plurality of electrode pads, and each consisting of a first raised portion attached to the corresponding electrode pad, and a second raised portion formed on the first raised portion, the area of a section of the second raised portion in a plane parallel to the surface of the electrode pad being smaller than the area of a section of the first raised portion parallel to the section of the second raised portion; and droplets of a conductive adhesive respectively bonding the electrical contact bumps and the corresponding conductive terminals of the first substrate.
Claim 12
Dependent Claim
36 words
A package according to Claim 8, wherein each droplet of the conductive adhesive contacts the first raised portion at substantially only a surface of the first raised portion on which the second raised portion is formed.
Claim 13
Dependent Claim
12 words
A package according to Claim 8, wherein the conductive adhesive is flexible.
Claim 14
Dependent Claim
81 words
A package according to Claim 8, wherein the ratio of the area of a section of the first raised portion parallel to the surface of the electrode pad to that of a section of the second raised portion parallel to the section of the first raised portion is in the range of 3/2 to 5/1, and the ratio of the height of the first raised portion to that of the second raised portion is in the range of 1/2 to 2/1.
Claim 15
Dependent Claim
23 words
A package according to Claim 8 wherein the width of the first raised portion is in the range of 60 to 120 µm.
Claim 16
Dependent Claim
33 words
A package according to Claim 8, wherein the sum of the height of the first raised portion and that of the second raised portion is in the range of 30 to 90 µ.
Claim 17
Dependent Claim
29 words
A package according to Claim 8, wherein the electrical contact bumps are formed of gold, copper, aluminum or an alloy containing gold, copper or aluminum as a main component.
Claim 18
Dependent Claim
106 words
A package comprising: a first substrate provided with a plurality of conductive terminals; a second substrate provided with a plurality of electrode pads at positions respectively corresponding to the conductive terminals of the first substrate; a plurality of electrical contact bumps formed respectively on the electrode pads of the second substrate, and each consisting of a first raised portion attached to the electrode pad, and a second raised portion formed on the first raised portion and made of a conductive wire bent in a loop; and droplets of a conductive adhesive respectively bonding the electrical contact bumps and the corresponding conductive terminals of the first substrate.
Claim 19
Dependent Claim
106 words
A package comprising: a first substrate provided with a plurality of conductive terminals; a second substrate provided with a plurality of electrode pads at positions respectively corresponding to the conductive terminals of the first substrate; a plurality of electrical contact bumps formed respectively on the electrode pads of the second substrate, and each consisting of a first raised portion attached to the electrode pad, and a second raised portion formed on the first raised portion and made of a conductive wire bent in a loop; and droplets of a conductive adhesive respectively bonding the electrical contact bumps and the corresponding conductive terminals of the first substrate.
Claim 20
Dependent Claim
36 words
A package according to Claim 15, wherein the droplet of the conductive adhesive contacts the first raised portion at substantially only a surface of the first raised portion on which the second raised portion is formed.
Claim 21
Dependent Claim
12 words
A package according to Claim 15, wherein the conductive adhesive is flexible.
Claim 22
Dependent Claim
29 words
A package according to Claim 15, wherein the electrical contact bumps are formed of gold, copper, aluminum or an alloy containing gold, copper or aluminum as a main component.
Claim 23
Independent Claim
104 words
A method of forming an electrical contact bump consisting of a first raised portion, and a second raised portion having the shape of a loop, comprising: a first step for fixedly attaching a ball formed at the free end of a conductive wire to an electrode pad formed on a substrate with a capillary to form the first raised portion; and a second step for looping the conductive wire in a loop above the first raised portion with the capillary and cutting the conductive wire at the free end of the loop to form the second raised portion having the shape of a loop.
Claim 24
Independent Claim
104 words
A method of forming an electrical contact bump consisting of a first raised portion, and a second raised portion having the shape of a loop, comprising: a first step for fixedly attaching a ball formed at the free end of a conductive wire to an electrode pad formed on a substrate with a capillary to form the first raised portion; and a second step for looping the conductive wire in a loop above the first raised portion with the capillary and cutting the conductive wire at the free end of the loop to form the second raised portion having the shape of a loop.
Claim 25
Dependent Claim
34 words
A method of forming an electrical contact bump according to Claim 19, wherein the conductive wire is formed of gold, copper, aluminum or an alloy containing gold, copper or aluminum as a main component.
Claim 26
Dependent Claim
54 words
A method of forming an electrical contact bump according to Claim 19, wherein the free end of the loop of the conductive wire formed by looping the conductive wire in the second process is fixed to the first raised portion, and then the conductive wire is severed from the free end of the loop.
Claim 27
Dependent Claim
63 words
A method of forming an electrical contact bump according to Claim 19, wherein the free end of the loop of the conductive wire formed by looping the conductive wire in the second process is fixed contiguously with the first raised portion to an electrode pad on which the first raised portion is formed, and then the conductive wire is severed from the loop.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.