Patent EP0315852A2 successfully refreshed from Google Patents.
EP0315852A2
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EP
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Printed circuit board with improved heat conductivity
Assignee: BASF SE
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Filing: 1988-10-31
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Granted: —
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Expires: 2008-10-31
Abstract
Abstract Translated from German Leiterplattensubstrat mit guter Wärmeleitfähigkeit, aufgebaut aus einem Verbund aus A) einem elektrisch und thermisch isolierenden Kunststoff und B) einem mit thermisch gut leitfähigen Füllstoffen ausgerüsteten Kunststoff. Printed circuit board substrate with good thermal conductivity, built up from a composite A) an electrically and thermally insulating plastic and B) a plastic equipped with thermally highly conductive fillers.
Inventors
- 👤 Helmut Dr. Muenstedt
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-10 01:26
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/0141; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0215; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24479; Y10T428/24521; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/256; Y10T428/29; Y10T428/2982; Y10T428/31504; Y10T428/31511; Y10T428/31533; Y10T428/31721; Y10T428/31942
Claims Analysis
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