Circuit board for high currents and process of making the same

Claim 2

Circuit board according to Claim 1, characterised in that the insulating material (13) comprising the bent part of the attachments has a thickness greater than the length of the bent attachment part and constitutes a raised relief component having a thickness greater than that of the layer of insulating material (19).

Claim 3

Circuit board according to Claim 1, characterised in that the tracks on the face opposite to the one covered with insulating material are insulated from each other by insulating material, and in that the portions of insulating material (14), at the attachments, have a thickness substantially equal to that of the insulating material between tracks.

Claim 4

Circuit board according to Claim 1, characterised in that connecting blades (5) are provided on at least one of the edges of the said circuit.

Claim 5

Circuit board according to Claims 1 and 4, characterised in that another metal sheet (27), which is bare and has previously been cut, is mounted on the said moulded circuit board so as to constitute a double-face circuit, in that the said bare metal sheet which constitutes a second circuit board comprises connecting devices (30) provided between the tracks, the said second circuit board being disposed on the opposite face of the first circuit which is covered with insulating material, and in that the connecting devices (30) pass through suitable orifices (36) in the first moulded circuit and are bent so as to be hooked by one end onto the said first moulded circuit.

Claim 6

Circuit board according to Claim 5, characterised in that the connecting devices (30) are hooked by their free end (34) onto an area of the tracks on the first moulded circuit which has no insulating material, so as to connect electrically at least one track on the first moulded circuit board to at least one track on the second circuit board.

Claim 7

Circuit board according to one of Claims 5 or 6, characterised in that the connecting devices (30) have a free end (34) substantially in the form of a spike.

Claim 8

Circuit board according to one of Claims 1 or 5, characterised in that the raised relief insulating component consists of a bar (13) with a parallelepipedal shape.

Claim 9

Circuit board according to Claim 8, characterised in that the bars (13) are oriented differently from each other.

Claim 10

Circuit board according to one of Claims 1 or 5, characterised in that the raised relief insulating component (14) consists of a vertical pin (24) with a height greater than the thickness of the layer of insulating material, the said pin (24) being disposed at the centre of an area which has no insulating material and connected to the layer of insulating material by two insulating bridges (25a, 25b).

Claim 11

Circuit board according to Claim 10, characterised in that the bridges (25a, 25b) situated on each side of any one pin are in line with each other.

Claim 12

Circuit board according to Claim 11, characterised in that the directions of the alignments of the bridges are different.

Claim 13

Method of manufacturing a circuit board according to Claim 1, according to which tracks (2) constituting at least one electrical circuit and connected to each other by attachments (4) are cut into a metal sheet (1), orifices (18) are formed on one face of the said printed circuit, notably for components to be connected to the said tracks to pass through, the said face of the circuit is covered with an insulating material (19) by means of a so-called moulding technique, and which is characterised in that at least some of the attachments are cut at one end and bent about their other end prior to the moulding, so that the insulating material passes into the space created by the bending of the attachments and covers the major part of the bent attachments.

Claim 14

Method according to Claim 13, characterised in that the attachments are cut and bent in a single operation.

Claim 15

Method according to Claim 13, characterised in that connecting blades, which are disposed on at least one edge of the metal sheet, are cut out at the same time as the tracks.

Claim 16

Circuit board according to one of Claims 1 or 5, characterised in that it comprises, on each of its faces, at least one continuous area (44) which is completely without insulating material and is provided with orifices (45) aligned so as to allow the bending of the said plate along the said orifices.

Claim 17

Interconnection box obtained by means of the circuit board according to one of Claims 1 to 12 and 16, of the type comprising a moulded mount (42a, 42b, 42c) made from plastics material on which the connecting devices are accessible on the two opposite faces of the said mount, and characterised in that at least one first single-face circuit is mounted on the said mount, which is formed in several parts forming between them an angle of between zero and 180°, and in that at least a second double-face circuit (49) is mounted on a part of the first circuit, and in that at least a third printed circuit (51) is connected to the double-face circuit, the said third printed circuit having receptacles (53) for components.

Claim 18

Box according to Claim 17, characterised in that the said mount is formed in three parts, the first (42a) disposed horizontally and forming an angle of between 90° and 180° to the adjacent second part (42b), the first (42a) and third (42c) parts being substantially parallel but in different planes.

Claim 19

Box according to Claim 18, characterised in that the three parts of the mount are separate and connected to each other by means of the first circuit.

Claim 20

Box according to Claims 17 to 19, characterised in that the base and the circuits which are connected to each other are mounted in the space defined by a bottom (41) and cover (57) which are substantially in the shape of the said mount.

Claim 21

Box according to Claim 20, characterised in that the bottom and cover and provided with means (56) suitable for allowing, from the outside, the plugging in and electrical connection of the components to be connected to the said printed circuits fixed to the mount.