Printed circuit comprising a heat sink

Abstract

Abstract The printed circuit according to the invention comprises, for the mounting and the soldering of modules (17) of electronic components, two respective faces (11, 12), conductive tracks (13), holes (14) for housing the leads of the modules and a heat sink (S) formed by a metallic part provided with leads (21) inserted into holes (22) of the board in the vicinity of the leads (16) of the modules. A metallic area (24, 25) forms a thermal adduction path between at least one module (17) and the heat sink (S). <??>The invention makes it possible to improve the efficiency of the heat dissipation permitted by the heat sink without complicating the process for manufacturing the circuit. <IMAGE>

Inventors

• 👤 Pierre Gohl
• 👤 Raymond Llabres
• 👤 Pascal Malgouires

Bibliographic Details