Patent EP0307591A2 successfully refreshed from Google Patents.
EP0307591A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method and apparatus for aligning solder balls
Assignee: Hitachi Ltd
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Filing: 1988-07-27
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Granted: —
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Expires: 2008-07-27
Abstract
Abstract Solder balls (9) are supplied onto an aligning plate (1) having aligned through-holes (4, 5) formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.
Inventors
- 👤 Hideyuki Fukasawa
- 👤 Mamoru Kobayashi
- 👤 Masahiro Wanami
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 12:06
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H10; H10W; H10W70/00; H10W70/099; H10W72/00; H10W72/01; H10W72/012; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/0195; H05K2203/02; H05K2203/0257; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/041; H05K2203/08; H05K2203/082; H10W72/011; H10W72/0112; H10W72/01204; H10W72/01221; H10W72/01225; H10W72/20; H10W72/251; Y; Y10; Y10S; Y10S269/00; Y10S269/903
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
50 words
A method for aligning solder balls comprising the steps of: supplying solder balls (9) onto an aligning plate (1) having aligned through-holes (4, 5) formed therein; and sucking air from the bottom of said aligning plate to fit and attract solder balls into said through-holes and align the solder balls.
Claim 2
Independent Claim
50 words
A method for aligning solder balls comprising the steps of: supplying solder balls (9) onto an aligning plate (1) having aligned through-holes (4, 5) formed therein; and sucking air from the bottom of said aligning plate to fit and attract solder balls into said through-holes and align the solder balls.
Claim 3
Dependent Claim
16 words
A method for aligning solder balls according to Claim 1, wherein said aligning plate comprises glass.
Claim 4
Dependent Claim
17 words
A method for aligning solder balls according to Claim 1, wherein said aligning plate comprises photosensitive glass.
Claim 5
Dependent Claim
16 words
A method for aligning solder balls according to Claim 1, wherein said aligning plate comprises ceramics.
Claim 6
Dependent Claim
177 words
A method for aligning solder balls according to Claim 1, wherein said aligning plate comprises two plates comprising a lower plate (2) and an upper plate (3), through-holes (4) having smaller diameters than outer diameters of solder balls to be aligned being opened at positions of said lower plate corresponding to alignment positions, through holes (5) having slightly larger diameters than outer diameters of solder balls being opened at positions of said upper plate corresponding to said through-holes (4) opened in said lower plate; said aligning plate is fixed to an aligning plate fixing block (6), said alignment plate fixing plate being coupled to an air sucking nozzle (8); and said method comprises the steps of: supplying solder balls onto said aligning plate; sucking air by using said sucking nozzle; attracting and fitting solder balls existing on said aligning plate into through-holes (5) having slightly larger diameters than outer diameters of the solder balls; and positioning and attracting solder balls into through-holes (4) having smaller diameters than outer diameters of solder balls to align the solder balls.
Claim 7
Independent Claim
51 words
An apparatus for aligning solder balls comprising: an aligning plate (1) having aligned through-holes (4, 5) formed therein, supplied solder balls being aligned by said aligning plate; an aligning plate fixing block (6) for fixing said aligning plate; and an air sucking nozzle (8) coupled to said aligning plate fixing block.
Claim 8
Independent Claim
51 words
An apparatus for aligning solder balls comprising: an aligning plate (1) having aligned through-holes (4, 5) formed therein, supplied solder balls being aligned by said aligning plate; an aligning plate fixing block (6) for fixing said aligning plate; and an air sucking nozzle (8) coupled to said aligning plate fixing block.
Claim 9
Dependent Claim
84 words
An apparatus for aligning solder balls according to Claim 6, wherein said aligning plate comprises two plates comprising a lower plate (2) and an upper plate (3); through-holes (4) having smaller diameters than outer diameters of solder balls to be aligned are opened at positions of said lower plate corresponding to alignment positions; and through-holes (5) having slightly larger diameters than outer diameters of solder balls are opened at positions of said upper plate corresponding to said through-holes (4) opened in said lower plate.
Claim 10
Dependent Claim
16 words
An apparatus for aligning solder balls according to Claim 6, wherein said aligning plate comprises glass.
Claim 11
Dependent Claim
17 words
An apparatus for aligning solder balls according to Claim 6, wherein said aligning plate comprises photosensitive glass.
Claim 12
Dependent Claim
16 words
An apparatus for aligning solder balls according to Claim 6, wherein said aligning plate comprises ceramics.
Claim 13
Dependent Claim
29 words
An apparatus for aligning solder balls according to Claim 7, wherein two plates comprising the lower plate (2) and the upper plate (3) constituting the aligning plate comprise glass.
Claim 14
Dependent Claim
30 words
An apparatus for aligning solder balls according to Claim 7, wherein two plates comprising the lower plate (2) and the upper plate (3) constituting the aligning plate comprise photosensitive glass.
Claim 15
Dependent Claim
29 words
An apparatus for aligning solder balls according to Claim 7, wherein two plates comprising the lower plate (2) and the upper plate (3) constituting the aligning plate comprise ceramics.
References Cited (Backward Citations)
No citation records indexed.
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