Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
202 words
A personality board (103) for use with a semiconductor wafer test set interposed between said test set test head (101) and a probe card (106), said personality board (103) comprising: a plurality of electrically conductive pad groups (220,221,222) disposed on a circuit board (201) of insulating material, each of said pad groups (220,221,222) corresponding to a terminal group (102) of said test head (101), said terminal group (102) including at least a force terminal, a sense terminal and a guard terminal; each pad group (220,221,222) disposed on said circuit board (201) in spaced-apart relationship with each of the other pad groups, each pad group (220,221,222) separated from adjacent pad groups by a slit (202) in said insulating material; an electrically conductive material disposed on said circuit board (201) in a predetermined pattern forming a first guard pattern (204,205) surrounding said plurality of pad groups, (220,221,222) said first guard pattern (204,205) electrically connected to the pad (220) in each of said plurality of pad groups (220,221,222) corresponding to said guard terminal; characterized in that each of the pads (221,222) in each group corresponding to said force terminal and said sense terminal, respectively, being electrically separated from each other on said circuit board (201).
Claim 2
Dependent Claim
202 words
A personality board (103) for use with a semiconductor wafer test set interposed between said test set test head (101) and a probe card (106), said personality board (103) comprising: a plurality of electrically conductive pad groups (220,221,222) disposed on a circuit board (201) of insulating material, each of said pad groups (220,221,222) corresponding to a terminal group (102) of said test head (101), said terminal group (102) including at least a force terminal, a sense terminal and a guard terminal; each pad group (220,221,222) disposed on said circuit board (201) in spaced-apart relationship with each of the other pad groups, each pad group (220,221,222) separated from adjacent pad groups by a slit (202) in said insulating material; an electrically conductive material disposed on said circuit board (201) in a predetermined pattern forming a first guard pattern (204,205) surrounding said plurality of pad groups, (220,221,222) said first guard pattern (204,205) electrically connected to the pad (220) in each of said plurality of pad groups (220,221,222) corresponding to said guard terminal; characterized in that each of the pads (221,222) in each group corresponding to said force terminal and said sense terminal, respectively, being electrically separated from each other on said circuit board (201).