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EP0304118A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Alignment of fibre arrays

Assignee: BAE Systems Electronics Ltd
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Filing: 1988-08-08
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Granted: —
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Expires: 2008-08-08
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Abstract

Abstract In order accurately to align an array of optical fibres (10) with optical components such as waveguides (14) in a block of insulative material (12) on a substrate (2) both in the plane of the substrate and in a height dimension normal to the substrate, the fibres are fixed in accurately formed V-grooves (8), and the block (12) has an array of accurately formed solder pads (16) in one to one correspondence with an array of solder pads (4) on the surface of the substrate (2) the array of solder pads (4, 16) being secured to one another by solder drops (6) containing controlled amounts of solder and thus being precisely dimensioned. The fibres (10) may be secured in V-grooves (8) with solder. Some of the solder pads (4) may be formed as conductive tracks electrically interconnecting with electrical components formed in block (12) and integrated circuits formed in substrate (2).

Inventors

  • 👤 Fredrick Arthur Randle

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-06 14:52
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4202; G02B6/4219; G02B6/4228; G02B6/4232; G02B6/4249; H; H10; H10W; H10W72/00; H10W72/01; H10W72/012

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 190 words
A method of aligning an array of one or more optical elements with an array of one or more optical components arranged in one or more blocks, the method comprising: a) providing a substrate having formed thereon locating means for receiving said optical elements; b) forming on the substrate an array of solder pads each of predetermined area surrounded by areas which are solder-repellent; c) forming on the or each block an array of solder pads each of predetermined area surrounded by areas which are solder repellent, the solder pads on the or each block being in one-to-one correspondence with the solder pads on the substrate; d) depositing on some or all of the solder pads controlled amounts of solder; and, e) locating the optical elements in the locating means and positioning and securing the or each block on the substrate with the respective arrays of solder pads in registration and the controlled amounts of solder forming solder drops of predetermined dimensions which serve to secure the blocks and align the blocks in the plane of the substrate and in a height dimension normal to the plane of the substrate.
Claim 2
Independent Claim 190 words
A method of aligning an array of one or more optical elements with an array of one or more optical components arranged in one or more blocks, the method comprising: a) providing a substrate having formed thereon locating means for receiving said optical elements; b) forming on the substrate an array of solder pads each of predetermined area surrounded by areas which are solder-repellent; c) forming on the or each block an array of solder pads each of predetermined area surrounded by areas which are solder repellent, the solder pads on the or each block being in one-to-one correspondence with the solder pads on the substrate; d) depositing on some or all of the solder pads controlled amounts of solder; and, e) locating the optical elements in the locating means and positioning and securing the or each block on the substrate with the respective arrays of solder pads in registration and the controlled amounts of solder forming solder drops of predetermined dimensions which serve to secure the blocks and align the blocks in the plane of the substrate and in a height dimension normal to the plane of the substrate.
Claim 3
Independent Claim 26 words
A method as claimed in claim1 wherein the optical elements comprise optical fibres and the locating means comprise grooves of predetermined dimensions formed in the substrate.
Claim 4
Dependent Claim 19 words
A method as claimed in claim 2 wherein the optical fibres are secured in the grooves by adhesive means.
Claim 5
Dependent Claim 44 words
A method as claimed in claim 1 wherein the optical elements comprise optical components formed in one or more blocks, such optical components being secured and aligned to the substrate in similar manner to the first mentioned array of one or more optical components.
Claim 6
Dependent Claim 17 words
A method as claimed in claim 1 wherein the solder pads are formed by a photolithographic process.
Claim 7
Dependent Claim 27 words
A method as claimed in claim 1 wherein the controlled amounts of solder are evaporated onto the the substrate employing a mask formed by a photolithographic process.
Claim 8
Dependent Claim 38 words
A method as claimed in claim 1 wherein some or all of the solder pads formed on the substrate are formed as the ends of conductive tracks for interconnection to electrical components within said one or more blocks.
Claim 9
Dependent Claim 28 words
A method as claimed in claim 7 wherein the substrate is formed of semiconductor material which contains one or more integrated circuits electrically connected with said conductive tracks.
Claim 10
Dependent Claim 17 words
A method as claimed in claim 1 and substantially as described with reference to the accompanying drawings.
Claim 11
Dependent Claim 23 words
An optical coupling formed by the method of claim 1 and substantially as described with reference to any one of the accompanying drawings.

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