Positive photosensitive resin composition and process for its production

Claim 1

A positive type photosensitive resinous composition comprising a resin obtained by reacting (A) at least one polyepoxide compound having an epoxy equivalent of 75 to 1000 selected from the group consisting of polyvalent alcohol glycidyl ether compound, polycarboxylic acid glycidyl ester compound, alicyclic glycidyl compound, glycidyl amine compound, heterocyclic glycidyl compound and bisphenol-A alkylene oxide compound, with (B) an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) having the structure Wherein A is substituted or unsubstituted alkylene or arylene, -CH=CH- R 4 and R . are substituted or unsubstituted alkylene or arylene group; n stands for 0 or 1; m is an integer from 1 to 3; R 2 and R 3 are the same or different, and each represents hydrogen, halogen, alkyl, alkenyl, nitrile or alkoxyl group and also can be an aromatic, alicyclic or heterocyclic ring formed together with carbon atoms of the benzene ring of the abovesaid carboxylic acid (B); and (C) 1,2-quinondiazido sulfonic acid halide in the proportions by equivalent of carboxyl group of (B): epoxy group of (A)= 1:0.8 to 1.2 and phenolic hydroxyl group of (B): sulfonyl halide group of (C)= 1:0.05 to 1.2.

Claim 4

A method for preparing a positive type photosensitive type resinous composition characterized in that (A) at least one polyepoxide compound having an epoxy equivalent of 75 to 1000 selected from the group consisting of polyvalent alcohol glycidyl ether compound, polycarboxylic acid glycidyl ester compound, alicyclic glycidyl compound, glycidyl amine compound, heterocyclic glycidyl compound and bisphenol-A alkylene oxide compound is reacted with (B) an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) having the structure wherein A is substituted or unsubstituted alkylene or arylene, -CH=CEi- , R 4 and R 5 are substituted or unsubstituted alkylene or arylene group; n stands for 0 or 1; m is an integer from 1 to 3; R 2 and R 3 are the same or different, and each represents hydrogen, halogen, alkyl, alkenyl, nitrile or alkoxyl group and also can be an aromatic, alicyclic or heterocyclic ring formed together with carbon atoms of the benzene ring of the abovesaid carboxylic acid (B) in the proportion by equivalent of carboxyl group of (B): epoxy group of (A)= 1:0.8 to 1.2 and thereafter the abovesaid reaction product is reacted with (C) 1,2-quinondiazido sulfonic acid halide in the proportion by equivalent of phenolic group of (B): sulfonyl halide group of (C)= 1:0.05 to 1.2.

Claim 5

A method for preparing a positive type photosensitive type resinous composition characterized in that (A) at least one polyepoxide compound having an epoxy equivalent of 75 to 1000 selected from the group consisting of polyvalent alcohol glycidyl ether compound, polycarboxylic acid glycidyl ester compound, alicyclic glycidyl compound, glycidyl amine compound, heterocyclic glycidyl compound and bisphenol-A alkylene oxide compound is reacted with (B) an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) having the structure wherein A is substituted or unsubstituted alkylene or arylene, -CH=CEi- , R 4 and R 5 are substituted or unsubstituted alkylene or arylene group; n stands for 0 or 1; m is an integer from 1 to 3; R 2 and R 3 are the same or different, and each represents hydrogen, halogen, alkyl, alkenyl, nitrile or alkoxyl group and also can be an aromatic, alicyclic or heterocyclic ring formed together with carbon atoms of the benzene ring of the abovesaid carboxylic acid (B) in the proportion by equivalent of carboxyl group of (B): epoxy group of (A)= 1:0.8 to 1.2 and thereafter the abovesaid reaction product is reacted with (C) 1,2-quinondiazido sulfonic acid halide in the proportion by equivalent of phenolic group of (B): sulfonyl halide group of (C)= 1:0.05 to 1.2.

Claim 6

A method for preparing a positive type photosensitive type resinous composition characterized in that (B) an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) having the structure wherein A is substituted or unsubstituted alkylene or arylene, -CH=CH- , R 4 and R 5 are substituted or unsubstituted alkylene or arylene group; n stands for 0 or 1; m is an integer from 1 to 3; R 2 and R 3 are the same or different, and each represents hydrogen, halogen, alkyl, alkenyl, nitrile or alkoxyl group and also can be an aromatic, alicyclic or heterocyclic ring formed together with carbon atoms of the benzene ring of the abovesaid carboxylic acid (B) is reacted with (C) 1,2-quinondiazido sulfonic acid halide in the proportion by equivalent of phenolic hydroxyl group of (B): sulfonic halide group of (C)= 1:0.05 to 1.2 and thereafter the reaction product is reacted with (A) at least one polyepoxide compound having an epoxy equivalent of 75 to 1000 selected from the group consisting of polyvalent alcohol glycidyl ether compound, polycarboxylic acid glycidyl ester compound, alicyclic glycidyl compound, glycidyl amine compound, heterocyclic glycidyl compound and bisphenol-A alkylene oxide compound in the proportion by equivalent of carboxyl group of (B): epoxy group of (A)= 1:0.8 to 1.2.

Claim 7

A method for preparing a positive type photosensitive type resinous composition characterized in that (B) an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) having the structure wherein A is substituted or unsubstituted alkylene or arylene, -CH=CH- , R 4 and R 5 are substituted or unsubstituted alkylene or arylene group; n stands for 0 or 1; m is an integer from 1 to 3; R 2 and R 3 are the same or different, and each represents hydrogen, halogen, alkyl, alkenyl, nitrile or alkoxyl group and also can be an aromatic, alicyclic or heterocyclic ring formed together with carbon atoms of the benzene ring of the abovesaid carboxylic acid (B) is reacted with (C) 1,2-quinondiazido sulfonic acid halide in the proportion by equivalent of phenolic hydroxyl group of (B): sulfonic halide group of (C)= 1:0.05 to 1.2 and thereafter the reaction product is reacted with (A) at least one polyepoxide compound having an epoxy equivalent of 75 to 1000 selected from the group consisting of polyvalent alcohol glycidyl ether compound, polycarboxylic acid glycidyl ester compound, alicyclic glycidyl compound, glycidyl amine compound, heterocyclic glycidyl compound and bisphenol-A alkylene oxide compound in the proportion by equivalent of carboxyl group of (B): epoxy group of (A)= 1:0.8 to 1.2.