Patent EP0298668A2 successfully refreshed from Google Patents.
EP0298668A2
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EP
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High temperature adhesive for polyimide films and its use
Assignee: Ethyl Corp
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Filing: 1988-07-01
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Granted: —
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Expires: 2008-07-01
Abstract
Abstract Thermoplastic polyimides of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane are excellent adhesives for, for example, bonding polyimide films to various substrates including polyimide film, and metals. The film and substrate need not be abraded before application of the polyamic acid resin or polyimide precursor from which the polyimide is formed on curing. The bond is tenacious. Even after heating to 425°C the bond was stronger than two different polyimide films. Interposing between the polyimide film and the substrate a strip or patch of a prepreg made from polyimide precursor solutions composed of monomers, solvent and polyamic acid, and applying heat to cure the resin in situ while keeping the components in intimate contact by application of slight pressure is a preferred way of applying and utilizing the adhesives. Such prepregs are also useful for bonding metal to metal or to various other substrates.
Inventors
- 👤 David Neal Roark
- 👤 Jules Adam Lambert
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 03:18
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/04; B32B7/00; B32B7/04; B32B7/12; B32B15/00; B32B15/04; B32B15/08; B32B15/20; B32B27/06; B32B27/08; B32B27/28; B32B27/281; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1046; C08G73/105; C08J; C08J5/00; C08J5/12; C08J5/124; C08J5/24; C08J5/241; C08J5/243; C08J5/249; B32B2311/00; B32B2311/12; B32B2379/00; B32B2379/08; C08J2379/00; C08J2379/04; C08J2379/08; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T428/00; Y10T428/249921; Y10T428/249924; Y10T428/24994; Y10T428/24995; Y10T428/249951; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721; Y10T442/00; Y10T442/10; Y10T442/102; Y10T442/133; Y10T442/138
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
27 words
A polyimide film bonded to a substrate by means of a thermoplastic polyimide adhesive of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane.
Claim 2
Dependent Claim
27 words
A polyimide film bonded to a substrate by means of a thermoplastic polyimide adhesive of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane.
Claim 3
Dependent Claim
14 words
An article of Claim 1 in which the 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane of the adhesive is 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane.
Claim 4
Dependent Claim
16 words
An article of Claim 1 in which the substrate is a polyimide film or a metal.
Claim 5
Independent Claim
112 words
A method of bonding a metal or polyimide film to a substrate which comprises placing therebetween a prepreg composed of a fibrous substrate coated and impregnated with a tacky polyimide precursor of (a) a substantially equimolar mixture of (i) 2,2-bis[4-aminophenoxy)phenyl]hexafluoropropane or 2,2-bis[4-(3-aminophenoxy)phenyl]hexafluoropropane, or both, and (ii) lower alkyl diester of benzophenone tetracarboxylic acid; (b) 2 to 50 weight percent of polyamide (polyamic acid) producible from components (i) and (ii); and (c) 10 to 50 weight percent of solvent; applying heat to cause the formation of the polyimide in situ while maintaining the metal or polyimide film and first-named substrate in intimate contact with the curing prepreg; and then cooling the resultate article.
Claim 6
Independent Claim
112 words
A method of bonding a metal or polyimide film to a substrate which comprises placing therebetween a prepreg composed of a fibrous substrate coated and impregnated with a tacky polyimide precursor of (a) a substantially equimolar mixture of (i) 2,2-bis[4-aminophenoxy)phenyl]hexafluoropropane or 2,2-bis[4-(3-aminophenoxy)phenyl]hexafluoropropane, or both, and (ii) lower alkyl diester of benzophenone tetracarboxylic acid; (b) 2 to 50 weight percent of polyamide (polyamic acid) producible from components (i) and (ii); and (c) 10 to 50 weight percent of solvent; applying heat to cause the formation of the polyimide in situ while maintaining the metal or polyimide film and first-named substrate in intimate contact with the curing prepreg; and then cooling the resultate article.
Claim 7
Dependent Claim
25 words
A method of Claim 4 in which the polyimide film and the substrate are both polyimide films e.g. polyimide films of pyromellitic dianhydride and oxydianiline.
Claim 8
Dependent Claim
16 words
A method of Claim 4 in which the substrate is a metal or a polyimide film.
Claim 9
Independent Claim
48 words
A method of bonding metallic copper to a substrate which comprises applying a polyamic acid of benzophenone tetracarboxylic acid and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane between the surfaces of the metallic copper and the substrate, and applying heat to cause the polamic acid to cure in situ to a polyamic adhesive.
Claim 10
Independent Claim
48 words
A method of bonding metallic copper to a substrate which comprises applying a polyamic acid of benzophenone tetracarboxylic acid and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane between the surfaces of the metallic copper and the substrate, and applying heat to cause the polamic acid to cure in situ to a polyamic adhesive.
Claim 11
Dependent Claim
21 words
A method of Claim 7 in which the substrate is a polyimide film or is a metallic substrate, e.g. metallic copper.
Claim 12
Dependent Claim
19 words
The use of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane in making an adhesive.
Claim 13
Dependent Claim
19 words
The use of benzophenone tetracarboxylic acid or an ester or anhydride thereof and a 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane in making an adhesive.
Claim 14
Dependent Claim
11 words
The use of Claim 9 in which the 2,2-bis[4-(aminophenoxy)phenyl]hexafluoropropane is 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane.
References Cited (Backward Citations)
No citation records indexed.
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