Patent EP0289026A2 successfully refreshed from Google Patents.
EP0289026A2
Expired / Lapsed
EP
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External circuit connecting method and packaging structure
Assignee: Canon Inc
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Filing: 1988-04-28
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Granted: —
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Expires: 2008-04-28
Abstract
Abstract There is disclosed a method of connecting an external circuit, comprising disposing between an electrode (15) for connecting the external circuit (18) connected with an electrode for driving a liquid crystal panel (14) and an external circuit electrode (13) connected with the external circuit (18), a film (11) comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage (17) to a heat tool (16) under the pressure-applied state.
Inventors
- 👤 Shigeki Yabu
- 👤 Hiroshi Takabayashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 14:59
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13452; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2203/00; H05K2203/01; H05K2203/0195; H05K3/34; H05K3/3494; H05K3/36; H05K3/361; Y; Y10; Y10S; Y10S257/00; Y10S257/93
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
61 words
A method of connecting an outer circuit, comprising disposing between an electrode for connecting the external circuit connected with an electrode for driving a liquid crystal panel and an external circuit electrode connected with the external circuit, a film comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage to a heat tool under the pressure-applied state.
Claim 2
Independent Claim
61 words
A method of connecting an outer circuit, comprising disposing between an electrode for connecting the external circuit connected with an electrode for driving a liquid crystal panel and an external circuit electrode connected with the external circuit, a film comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage to a heat tool under the pressure-applied state.
Claim 3
Dependent Claim
17 words
The connecting method of Claim 1, wherein said liquid crystal panel comprises a ferroelectric liquid crystal panel.
Claim 4
Dependent Claim
14 words
The connecting method of Claim 1, wherein said insulating resin comprises a thermoplastic resin.
Claim 5
Dependent Claim
21 words
The connecting method of Claim 1, wherein said pressure-applied state is maintained also after application of the pulse voltage is stopped.
Claim 6
Dependent Claim
17 words
The connecting method of Claim 1, wherein said pressure applied state is released after temperature is dropped.
Claim 7
Independent Claim
90 words
A method of electrically connecting conductive material films facing to each other, comprising electrically connecting conductive material films disposed with a given spacing, wherein one of the conductive material films facing to each other is supported by a substrate and the other conductive material film is not supported by the substrate, and an anisotropic conductive member are placed on the substrate provided with said one conductive material film, and an insulating member is provided on the anisotropic conductive member, and the conductive material films facing to each other are thermocompression-bonded.
Claim 8
Independent Claim
90 words
A method of electrically connecting conductive material films facing to each other, comprising electrically connecting conductive material films disposed with a given spacing, wherein one of the conductive material films facing to each other is supported by a substrate and the other conductive material film is not supported by the substrate, and an anisotropic conductive member are placed on the substrate provided with said one conductive material film, and an insulating member is provided on the anisotropic conductive member, and the conductive material films facing to each other are thermocompression-bonded.
Claim 9
Dependent Claim
23 words
The electrically connecting method of Claim 6, wherein said insulating member is a film formed of an insulating resin having a hot-melting property.
Claim 10
Dependent Claim
31 words
The electrically connecting method of Claim 6, wherein said anisotropic conductive member is a film formed of an insulating resin comprising a conductive material dispersed therein and having a hot-melting property.
Claim 11
Dependent Claim
40 words
The electrically connecting method of Claim 6, wherein said conductive material film not supported by the substrate has a thickness substantially equal to the sum of the thickness of the insulating member and the thickness of the anisotropic conductive member.
Claim 12
Dependent Claim
16 words
The electrically connecting method of Claim 6, wherein said conductive material comprises metal or alloy particles.
Claim 13
Dependent Claim
89 words
A film carrier packaging structure comprising an outer lead-bonding area and an inner lead-bonding area of a conductive material pattern formed on a flexible insulating film, wherein said outer lead-bonding area of a film carrier, extending from said flexible insulating film in the shape of a finger, is disposed so as to face to a wiring substrate with the interposition of an anisotropic conductive film, said outer lead-bonding area being thermocompression-bonded to said wiring substrate by heating through another flexible insulating film thinner than said first-mentioned flexible insulating film.
Claim 14
Dependent Claim
89 words
A film carrier packaging structure comprising an outer lead-bonding area and an inner lead-bonding area of a conductive material pattern formed on a flexible insulating film, wherein said outer lead-bonding area of a film carrier, extending from said flexible insulating film in the shape of a finger, is disposed so as to face to a wiring substrate with the interposition of an anisotropic conductive film, said outer lead-bonding area being thermocompression-bonded to said wiring substrate by heating through another flexible insulating film thinner than said first-mentioned flexible insulating film.
Claim 15
Dependent Claim
40 words
The packaging structure of Claim 11, wherein a conductive foil of said outer lead-bonding area has a thickness substantially equal to the sum of the thickness of said another flexible insulating film and the thickness of said anisotropic conductive film.
References Cited (Backward Citations)
No citation records indexed.
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