Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
146 words
An aqueous developable, radiation curable composition consisting essentially of: (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; (3) a photoinitiator; and (4) (a) a polyvthiol in an amount of up to the stoichiometric amount necessary to react with the ethylenic unsaturation in the composition, or (b) a monothiol in an amount up to 90% of the stoichiometric amount necessary to react with the ethylenic unsaturation in the composition;
Claim 2
Dependent Claim
146 words
An aqueous developable, radiation curable composition consisting essentially of: (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; (3) a photoinitiator; and (4) (a) a polyvthiol in an amount of up to the stoichiometric amount necessary to react with the ethylenic unsaturation in the composition, or (b) a monothiol in an amount up to 90% of the stoichiometric amount necessary to react with the ethylenic unsaturation in the composition;
Claim 3
Dependent Claim
43 words
wherein component (1) is present in an amount ranging from 10 - 90%, component (2) is present in an amount ranging from 1 to 90%, and component (3) is present in an amount ranging from 0.01 to 10% by weight of the composition.
Claim 4
Dependent Claim
43 words
wherein component (1) is present in an amount ranging from 10 - 90%, component (2) is present in an amount ranging from 1 to 90%, and component (3) is present in an amount ranging from 0.01 to 10% by weight of the composition.
Claim 5
Dependent Claim
152 words
A process for forming a photoresist on a substrate which comprises (A) applying to the surface of the substrate a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing the exposed areas of said composition, and (C) removing the unexposed uncured areas of the composition with an aqueous developer.
Claim 6
Dependent Claim
152 words
A process for forming a photoresist on a substrate which comprises (A) applying to the surface of the substrate a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing the exposed areas of said composition, and (C) removing the unexposed uncured areas of the composition with an aqueous developer.
Claim 7
Dependent Claim
14 words
The process according to Claim 5 wherein the surface of the substrate is copper.
Claim 8
Dependent Claim
181 words
A process for forming a printed circuit board which comprises (A) applying to a metallic surface of a circuit board blank a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing and forming a photoresist of the exposed areas of said composition, (C) removing the unexposed uncured areas of the composition with an aqueous developer thereby exposing the metallic surface there beneath, (D) etching away said exposed metallic surface, (E) removing the photoresist therebv exposing the printed circuit.
Claim 9
Dependent Claim
181 words
A process for forming a printed circuit board which comprises (A) applying to a metallic surface of a circuit board blank a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing and forming a photoresist of the exposed areas of said composition, (C) removing the unexposed uncured areas of the composition with an aqueous developer thereby exposing the metallic surface there beneath, (D) etching away said exposed metallic surface, (E) removing the photoresist therebv exposing the printed circuit.
Claim 10
Dependent Claim
190 words
A process for forming a printed circuit board which comprises (A) applying to a metallic surface of a circuit board blank a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a stvrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing and forming a photoresist of the exposed areas of said composition, (C) removing the unexposed uncured areas of the composition with an aqueous developer thereby exposing the metal surface there beneath, (D) plating a conductive metal on said exposed metal surface, (E) removing the photoresist, and (F) etching away the metal surface beneath the removed photoresist.
Claim 11
Dependent Claim
190 words
A process for forming a printed circuit board which comprises (A) applying to a metallic surface of a circuit board blank a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a stvrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing and forming a photoresist of the exposed areas of said composition, (C) removing the unexposed uncured areas of the composition with an aqueous developer thereby exposing the metal surface there beneath, (D) plating a conductive metal on said exposed metal surface, (E) removing the photoresist, and (F) etching away the metal surface beneath the removed photoresist.
Claim 12
Dependent Claim
178 words
A process for forming a printed circuit board on a substrate which comprises (A) applying to the surface of the substrate a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing and forming a photoresist of the exposed areas of said composition, (C) removing the unexposed uncured areas of the composition with an aqueous developer thereby exposing the surface of the substrate, and (D) plating a conductive metal on the exposed surface of the substrate.
Claim 13
Dependent Claim
178 words
A process for forming a printed circuit board on a substrate which comprises (A) applying to the surface of the substrate a layer of an aqueous developable, radiation curable composition comprising (1) a carboxylic acid containing reaction product of a styrene-maleic anhydride copolymer and a hydroxy (meth)acrylate of the formula: wherein R is alkyl, alkyl ester or alkyl ether containing 2-20 carbon atoms and R₁ is H or CH₃, the mole ratio of the hydroxy (meth)acrylate to the anhydride in the styrene-maleic anhydride copolymer being in the range 0.8 - 1.0; (2) an ethylenically unsaturated, reactive diluent of the formula: wherein R₂ is H or CH₃, R₃ is an organic moiety and n is 1 or more; and (3) a photoinitiator, (B) imagewise exposing selected areas of said composition to actinic radiation thereby curing and forming a photoresist of the exposed areas of said composition, (C) removing the unexposed uncured areas of the composition with an aqueous developer thereby exposing the surface of the substrate, and (D) plating a conductive metal on the exposed surface of the substrate.