Patent EP0285779A2 successfully refreshed from Google Patents.
EP0285779A2
Expired / Lapsed
EP
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Improved cooling system for semiconductor modules
Assignee: International Business Machines Corp
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Filing: 1988-02-19
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Granted: —
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Expires: 2008-02-19
Abstract
Abstract A cooling structure (10) for a semiconductor package (16,18) wherein the cooling fluid is circulated over the cooling fins (24) over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.
Inventors
- 👤 Charles Allen Gotwald
- 👤 Sevgin Oktay
- 👤 Ajay Sharma
- 👤 Vijay Sonnad
- 👤 Arthur Richard Zingher
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 04:20
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; Y; Y10; Y10S; Y10S165/00; Y10S165/903
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
122 words
An improved system for cooling electronic elements comprising a base element adapted to receive heat from electronic elements, a plurality of spaced fins mounted on said base element, at least one elongated duct means mounted over said spaced fins, said duct means provided with a pair of flat bottom wall members in engagement with the upper ends of said fins, and an upwardly bulged top wall member joined to the outer edges of said pair of bottom wall members, said duct means having at least one open end, a plenum mounted on said base member for conveying cooling fluid through said system, said system in operation adapted to pass cooling fluid through said plenum, through said fins and through said duct means.
Claim 2
Dependent Claim
122 words
An improved system for cooling electronic elements comprising a base element adapted to receive heat from electronic elements, a plurality of spaced fins mounted on said base element, at least one elongated duct means mounted over said spaced fins, said duct means provided with a pair of flat bottom wall members in engagement with the upper ends of said fins, and an upwardly bulged top wall member joined to the outer edges of said pair of bottom wall members, said duct means having at least one open end, a plenum mounted on said base member for conveying cooling fluid through said system, said system in operation adapted to pass cooling fluid through said plenum, through said fins and through said duct means.
Claim 3
Dependent Claim
25 words
The system of claim 1 wherein said base element and said fins are formed of Cu and wherein said base element is a laminated structure.
Claim 4
Dependent Claim
34 words
The system of claim 2 wherein a plurality of unitary flat elements form both the base element and the fins, and said base element further including flat members sandwiched between said unitary flat elements.
Claim 5
Dependent Claim
51 words
The system of claim 3 which further includes flat spacer members sandwiched between the upper ends of said flat membersand wherein said spacer members and the upper ends of said flat members form said wall members of said duct means wherein said top wall member has an arcuate cross sectional configuration.
Claim 6
Dependent Claim
26 words
The system of claim 1 wherein said fins are comprised of at least one pair of rows of spaced parallel fins mounted on said base member.
Claim 7
Dependent Claim
40 words
The system of claim 1 wherein the ratio of the distance between said fins over the fin thickness is in the range of 0,5 to 4 and wherein the thickness of said fins is of the order of 0,25 mm.
Claim 8
Independent Claim
23 words
The system according to anyone of the preceding claims wherein said duct means is made of a material with a low heat conductivity.
Claim 9
Dependent Claim
33 words
The system of claim 1 wherein said duct means is open at both ends and wherein a flow splitting structure is provided in said duct means to direct cooling fluid in opposite directions.
Claim 10
Dependent Claim
33 words
The system of claim 5 wherein a spacing is provided between the ends of said fins and the walls of said plenum, said spacing being in the range of 2 to 5 mm.
Claim 11
Dependent Claim
40 words
The system of claim 1 which further includes apertures in the bottom side of said base member, and pistons movably mounted in said aperture for contacting electronic elements, said pistons conducting heat from said electronic elements to said base member.
Claim 12
Independent Claim
89 words
A system for cooling electronic elements comprising: a base element adapted to receive heat from electronic elements, a plurality of fins mounted on said base element, a blower to direct cooling gas downwardly toward said base element, a means to funnel said cooling gas to said fins, a duct means over said fins to convey said cooling gas away from said fins, said system in operation adapted to move cooling gas inwardly between said fins, and exhaust said gas upwardly and transverse to said fins through said duct means.
Claim 13
Independent Claim
89 words
A system for cooling electronic elements comprising: a base element adapted to receive heat from electronic elements, a plurality of fins mounted on said base element, a blower to direct cooling gas downwardly toward said base element, a means to funnel said cooling gas to said fins, a duct means over said fins to convey said cooling gas away from said fins, said system in operation adapted to move cooling gas inwardly between said fins, and exhaust said gas upwardly and transverse to said fins through said duct means.
References Cited (Backward Citations)
No citation records indexed.
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