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EP0285129A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Dry etching method

Assignee: Toshiba Corp
•
Filing: 1988-03-30
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Granted: —
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Expires: 2008-03-30
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Abstract

Abstract A dry etching method of etching a material to be etched including a transition metal using an etching gas including a carbon oxide gas is provided. The carbon oxide gas is carbon monoxide gas, carbon dioxide gas, or mixed gas of these gases. The carbon oxide gas in a range where the ratio R of the number of molecules is expressed as R = X/3 to 200X with respect to the ratio X of the number of atoms of the transition metal is preferably included in the etching gas. Such a dry etching is particularly preferably carried out when the material to be etched is aluminum-silicon alloy, the transition metal is copper, the etching gas is mixed gas of chlorine gas, boron trichloride gas and helium gas, and the carbon oxide gas is carbon monoxide.

Inventors

  • 👤 Makoto Fujino
  • 👤 Isahiro Hasegawa
  • 👤 Masao Ito

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-31 23:19
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/20; H10P50/26; H10P50/264; H10P50/266; H10P50/267

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 25 words
A dry etching method in which etching is applied to material to be etched including transition metal using an etching gas containing carbon oxide gas.
Claim 2
Dependent Claim 25 words
A dry etching method in which etching is applied to material to be etched including transition metal using an etching gas containing carbon oxide gas.
Claim 3
Dependent Claim 28 words
A dry etching method as set forth in claim 1, wherein said carbon oxide gas is carbon monoxide gas, carbon dioxide gas, or mixed gas of these gases.
Claim 4
Dependent Claim 51 words
A dry etching method as set forth in claim 1, wherein carbon oxide gas in a range where the ratio R of the number of molecules is expressed by R = X/3 to 200X is contained in said etching gas where X is the ratio of number of transition metal atoms.
Claim 5
Dependent Claim 51 words
A dry etching method as set forth in claim 2, wherein carbon oxide gas in a range where the ratio R of the number of molecules is expressed by R = X/3 to 200X is contained in said etching gas where X is the ratio of number of transition metal atoms.
Claim 6
Dependent Claim 47 words
A dry etching method as set forth in claim 1, wherein said material to be etched is aluminum-silicon alloy, said transition metal is copper, said etching gas is mixed gas of chlorine gas, boron trichloride gas, and helium gas, and said carbon oxide gas is carbon monoxide.
Claim 7
Dependent Claim 47 words
A dry etching method as set forth in claim 2, wherein said material to be etched is aluminum-silicon alloy, said transition metal is copper, said etching gas is mixed gas of chlorine gas, boron trichloride gas, and helium gas, and said carbon oxide gas is carbon monoxide.
Claim 8
Dependent Claim 47 words
A dry etching method as set forth in claim 3, wherein said material to be etched is aluminum-silicon alloy, said transition metal is copper, said etching gas is mixed gas of chlorine gas, boron trichloride gas, and helium gas, and said carbon oxide gas is carbon monoxide.
Claim 9
Dependent Claim 47 words
A dry etching method as set forth in claim 4, wherein said material to be etched is aluminum-silicon alloy, said transition metal is copper, said etching gas is mixed gas of chlorine gas, boron trichloride gas, and helium gas, and said carbon oxide gas is carbon monoxide.

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