Epoxy resin composition
Abstract
Abstract Provided herein is an epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a-triphenol-alkane type resin or a polymer thereof with a specific organopolysiloxane. It provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and less liability to exerting stress to the semiconductor devices. It exhibits its distinct performance when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very little liable to warp the semiconductor device sealed with it.
Inventors
- 👤 Toshio Shiobara
- 👤 Kazutoshi Tomiyoshi
Bibliographic Details
Claims Analysis
Total Claims: 4References Cited (Backward Citations)
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