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EP0282977A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Epoxy resin composition

Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1988-03-15
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Granted: —
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Expires: 2008-03-15
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Abstract

Abstract Provided herein is an epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a-triphenol-alkane type resin or a polymer thereof with a specific organopolysiloxane. It provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and less liability to exerting stress to the semiconductor devices. It exhibits its distinct performance when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very little liable to warp the semiconductor device sealed with it.

Inventors

  • 👤 Toshio Shiobara
  • 👤 Kazutoshi Tomiyoshi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 13:12
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08L; C08L63/00; C08L83/00; C08L83/10

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 142 words
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, and a block copolymer formed by the reaction of a compound represented by the formula (1) below or an oligomer thereof, (where R L denotes a hydrogen atom, or a monovalent organic group including an alkenyl group; R 2 denotes a monovalent hydrocarbon group having 1 to 10 carbon atoms of the same or different kind; X denotes a halogen atom; t denotes an integer of 1 or 2; m and n each denote an integer of 0 to 2; and ℓ + m + n≦5) with an organopolysiloxane represented by the formula (2) below, (where R 3 denotes a hydrogen atom, halogen atom, hydroxyl group, alkoxyl group, or substituted monovalent hydrocarbon group; R 4 denotes monovalent organic group of the same or different kind; 0.001≦a≦2, 1;5b<3, and 1.001≦a+b≦3.)
Claim 2
Dependent Claim 142 words
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, and a block copolymer formed by the reaction of a compound represented by the formula (1) below or an oligomer thereof, (where R L denotes a hydrogen atom, or a monovalent organic group including an alkenyl group; R 2 denotes a monovalent hydrocarbon group having 1 to 10 carbon atoms of the same or different kind; X denotes a halogen atom; t denotes an integer of 1 or 2; m and n each denote an integer of 0 to 2; and ℓ + m + n≦5) with an organopolysiloxane represented by the formula (2) below, (where R 3 denotes a hydrogen atom, halogen atom, hydroxyl group, alkoxyl group, or substituted monovalent hydrocarbon group; R 4 denotes monovalent organic group of the same or different kind; 0.001≦a≦2, 1;5b<3, and 1.001≦a+b≦3.)
Claim 3
Dependent Claim 40 words
An epoxy resin composition as claimed in Claim 1, wherein the content of the block copolymer is 1 to 100 parts by weight for 100 parts by weight of the total amount of the curable epoxy resin and curing agent.
Claim 4
Dependent Claim 43 words
An epoxy resin composition as claimed in Claim 1, wherein an inorganic filler is blended in an amount of from 100 to 1000 parts by weight per 100 parts by weight of the total of said curable epoxy resin and said curing agent.

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