Patent EP0281900A2 successfully refreshed from Google Patents.
EP0281900A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Removable holder and method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
Assignee: International Business Machines Corp
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Filing: 1988-03-01
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Granted: —
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Expires: 2008-03-01
Abstract
Abstract A method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier (2) on a second level electronic package, such that the flexible film (6) of the carrier is supported substantially in a plane above the surface of the second level electronic package. The method comprises positioning preformed spacers (10) embedded in a dissolvable polysulfone foam holder (18) between the outer lead bonding pads (11) on the flexible film semiconductor chip carrier and corresponding (matching) bonding pads (12) on the second level electronic package. Each of the preformed spacers may comprise, for example, a solder cylinder with a copper core. The preformed spacers may be bonded to the outer lead bonding pads on the chip carrier, and to the matching bonding pads on the second level electronic package, by reflowing the solder of the spacers using, for example, a conventional solder reflow oven. Then, the holder (18) is dissolved, and washed away, in a conventional vapor degreaser using, for example, methylene chloride, to leave the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired.
Inventors
- 👤 Kishor Vithaldas Desai
- 👤 Harold Kohn
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 13:09
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/36; H05K3/361; H05K3/363; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H10W90/401; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10424; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2201/10704; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/07; H05K2203/0756; H05K2203/0769; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
153 words
A method for outer lead bonding a circuitized, flexible film (6) onto a circuitized substrate (4) having mounting pads (12) thereon in a pattern matching a corresponding pattern of outer lead bonding pads (11) on the circuitized, flexible film, which comprises the steps of: attaching electrically conductive spacers (10) embedded in a removable holder (18) to the outer lead bonding pads on the circuitized, flexible film, said spacers sized and configured to physically support the circuitized, flexible film substantially in a plane above the surface of the circuitized substrate when the circuitized, flexible film is mounted on the circuitized substrate; positioning the circuitized, flexible film having the spacers attached thereto, on the circuitized substrate, with each of the spacers in contact with its corresponding bonding pad on the circuitized substrate; and bonding the spacers to the bonding pads of the circuitized substrate whereby the circuitized, flexible film is mounted on the circuitized substrate.
Claim 2
Independent Claim
153 words
A method for outer lead bonding a circuitized, flexible film (6) onto a circuitized substrate (4) having mounting pads (12) thereon in a pattern matching a corresponding pattern of outer lead bonding pads (11) on the circuitized, flexible film, which comprises the steps of: attaching electrically conductive spacers (10) embedded in a removable holder (18) to the outer lead bonding pads on the circuitized, flexible film, said spacers sized and configured to physically support the circuitized, flexible film substantially in a plane above the surface of the circuitized substrate when the circuitized, flexible film is mounted on the circuitized substrate; positioning the circuitized, flexible film having the spacers attached thereto, on the circuitized substrate, with each of the spacers in contact with its corresponding bonding pad on the circuitized substrate; and bonding the spacers to the bonding pads of the circuitized substrate whereby the circuitized, flexible film is mounted on the circuitized substrate.
Claim 3
Dependent Claim
35 words
A method for outer lead bonding as recited in claim 1, further comprising the step of removing the holder (18) after the step of bonding the spacers to the bonding pads on the circuitized substrate.
Claim 4
Dependent Claim
19 words
A method for outer lead bonding as recited in claim 1 or 2, wherein the holder comprises polysulfone foam.
Claim 5
Dependent Claim
36 words
A method for outer lead bonding as recited in claim 3, further comprising the step of removing the polysulfone foam holder after the step of bonding the spacers to the bonding pads on the circuitized substrate.
Claim 6
Dependent Claim
27 words
A method for outer lead bonding as recited in claim 4, wherein the step of removing the polysulfone foam holder comprises dissolving and washing away the holder.
Claim 7
Dependent Claim
30 words
A method for outer lead bonding as recited in claim 5, wherein the step of dissolving and washing away the polysulfone foam holder comprises immersing the holder in methylene chloride.
Claim 8
Independent Claim
27 words
A method for outer lead bonding as recited in one of the claims 1-6, wherein each of the spacers comprises a solder cylinder with a copper core.
Claim 9
Dependent Claim
76 words
A method for outer lead bonding as recited in claim 7, wherein the step of attaching the spacers comprises: placing flux on the spacers in the holder and/or on the pads on the film and the substrate; positioning each of the spacers in the holder on its corresponding pads on the film and the substrate; and reflowing the solder part of the spacers to bond the spacers to the pads on the film and the substrate.
Claim 10
Independent Claim
92 words
An apparatus for outer lead bonding a circuitized, flexible film (6) onto a circuitized substrate (4) having mounting pads (12) thereon in a pattern matching a corresponding pattern of outer lead bonding pads (11) on the circuitized, flexible film, comprising: a removable holder (18) having at least one opening for accommodating an electronic device; and a plurality of spacers (10) embedded in the removable holder, said spacers sized and configured for attachment between the outer lead bonding pads on the circuitized, flexible film and the matching bonding pads on the circuitized substrate.
Claim 11
Independent Claim
92 words
An apparatus for outer lead bonding a circuitized, flexible film (6) onto a circuitized substrate (4) having mounting pads (12) thereon in a pattern matching a corresponding pattern of outer lead bonding pads (11) on the circuitized, flexible film, comprising: a removable holder (18) having at least one opening for accommodating an electronic device; and a plurality of spacers (10) embedded in the removable holder, said spacers sized and configured for attachment between the outer lead bonding pads on the circuitized, flexible film and the matching bonding pads on the circuitized substrate.
Claim 12
Dependent Claim
19 words
An apparatus for outer lead bonding as recited in claim 9 wherein the removable holder (18) comprises polysulfone foam.
Claim 13
Dependent Claim
25 words
An apparatus for outer lead bonding as recited in claim 9 wherein each of the spacers (10) comprises a solder cylinder with a copper core.
Claim 14
Dependent Claim
92 words
An electronic packaging structure comprising: a circuitized substrate (4) having a pattern of mounting pads (12) thereon; a circuitized, flexible film (6) having outer lead bonding pads in a pattern corresponding to the pattern of the mounting pads on the circuitized substrate; and spacers (10) electrically interconnecting each of the mounting pads on the circuitized substrate with its corresponding outer lead bonding pad on the circuit ized, flexible film, said spacers sized and configured to physically support the circuitized, flexible film substantially in a plane above the surface of the circuitized substrate.
Claim 15
Dependent Claim
92 words
An electronic packaging structure comprising: a circuitized substrate (4) having a pattern of mounting pads (12) thereon; a circuitized, flexible film (6) having outer lead bonding pads in a pattern corresponding to the pattern of the mounting pads on the circuitized substrate; and spacers (10) electrically interconnecting each of the mounting pads on the circuitized substrate with its corresponding outer lead bonding pad on the circuit ized, flexible film, said spacers sized and configured to physically support the circuitized, flexible film substantially in a plane above the surface of the circuitized substrate.
References Cited (Backward Citations)
No citation records indexed.
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