Patent EP0273725A2 successfully refreshed from Google Patents.
EP0273725A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Encapsulated semiconductor device
Assignee: Toshiba Corp
•
Filing: 1987-12-23
•
Granted: —
•
Expires: 2007-12-23
Abstract
Abstract This invention provides a semiconductor device comprising a die-pad (2) supported by tie-bars (1), a semiconductor element (3) mounted in the die-pad (2) with the die-pad (2), tie-bars (1) and semiconductor element (3) being encapsulated in a moulding compound (6), wherein at least one aperture (6a) or cut-away (6b) extends in to the moulding compound (6) so as to expose a portion of a tie-bar (1).
Inventors
- 👤 Yasuhiro C/O Patent Division Yamaji
- 👤 Kenji C/O Patent Division Takahashi
- 👤 Seiichi C/O Patent Division Hirata
- 👤 Toshiharu C/O Patent Division Sakurai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-26 16:48
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/40; H10W70/421; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
60 words
A semiconductor device comprising: a die-pad (2) supported by tie-bars (1); a semiconductor element (3) mounted on the die-pad (2) with the die-pad, tie-bars and semiconductor element being encapsulated in moulding compound (6); characterised by at least one aperture (6a) or cut-away (6b) which extends into the moulding compound (6) so as to expose a portion of a tie bar.
Claim 2
Dependent Claim
60 words
A semiconductor device comprising: a die-pad (2) supported by tie-bars (1); a semiconductor element (3) mounted on the die-pad (2) with the die-pad, tie-bars and semiconductor element being encapsulated in moulding compound (6); characterised by at least one aperture (6a) or cut-away (6b) which extends into the moulding compound (6) so as to expose a portion of a tie bar.
Claim 3
Dependent Claim
22 words
A semiconductor device as claimed in claim 1, further characterised in that the aperture or cut-away is formed as a hole (6a).
Claim 4
Dependent Claim
39 words
A semiconductor device as claimed in claim 1, further characterised in that the aperture (6a) or cut-away (6b) is in the form of a cut-away (6b) open to the underside and one lateral edge of the moulding compound (6).
Claim 5
Dependent Claim
36 words
A semiconductor device as claimed in claim 1, further characterised in that the exposed portion of the tie-bar is part of a shaped area of the tie-bar which is larger than the cross-section of the aperture.
Claim 6
Dependent Claim
32 words
A semiconductor device as claimed in claim 1, further characterised by at least two apertures (6a) which extend into the moulding compound (6) so as to expose a portion of respective tie-bars.
Claim 7
Dependent Claim
45 words
A semiconductor device as claimed in claim 1, further characterised by at least two apertures in both the underside and the upperside of the moulding compound, with the apertures (6a) extending into the moulding compound (6) so as to expose respective portions of tie-bars (1).
Claim 8
Dependent Claim
39 words
A semiconductor device as claimed in claim 1, further characterised in that the portion of the tie-bar adjacent the exposed portion of the tie-bar (1) is smaller in surface area than is the exposed portion of the tie-bar (1).
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.