Patent EP0272027A2 successfully refreshed from Google Patents.
EP0272027A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed circuit board
Assignee: AT&T Inc
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Filing: 1987-12-07
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Granted: —
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Expires: 2007-12-07
Abstract
Abstract This printed circuit board (200) with optical signal distribution layer (101, 102) uses a layer of transparent material or an optical fiber mat build into the laminated printed circuit board structure to interconnect various opto-electrical devices (110,111) which are attached to the surface of the printed circuit board. The optical devices are connected to the buried optical fiber layer by drilling vias in the printed circuit board to intercept the fiber or the particular optical signal distribution layer at a desired location. The via is then filled with an optical material (210) whose optical properties provide for the coupling of light energy from the intercepted optical signal distribution layer through the via material to the surface of the printed circuit board. Opto-electrical devices are connected over the top of these vias and perform the optical light energy to electrical signal conversion function.
Inventors
- 👤 Larry Joe Gabbard
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-26 15:27
CPC Classifications
H; H05; H05K; H05K3/00; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4204; G02B6/26; G02B6/28; G02B6/2804; G02B6/2817; G02B6/4219; G02B6/4236; G02B6/4245; G02B6/4256; G02B6/4257; G02B6/4274; G02B6/428; H05K1/00; H05K1/02; H05K1/0274; G02B6/424; G02B6/4285
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
83 words
A method of manufacturing a circuit board, comprising the step of arranging optical signal distribution means (110 to 113 or 303) relative to a component layer (101 or 304), CHARACTERISED BY laminating at least another layer (100) of circuit board to the said component layer to cover the said distribution means, and forming at least one via (130) of optical transmission material (204) through at least one of the said layers between the said distribution means and the surface of the circuit board.
Claim 2
Independent Claim
83 words
A method of manufacturing a circuit board, comprising the step of arranging optical signal distribution means (110 to 113 or 303) relative to a component layer (101 or 304), CHARACTERISED BY laminating at least another layer (100) of circuit board to the said component layer to cover the said distribution means, and forming at least one via (130) of optical transmission material (204) through at least one of the said layers between the said distribution means and the surface of the circuit board.
Claim 3
Dependent Claim
24 words
A method according to claim 1, CHARACTERISED IN THAT the distribution means is secured to the said component layer prior to the lamination step.
Claim 4
Dependent Claim
34 words
A method according to claim 1 or 2, CHARACTERISED IN THAT the distribution means comprises a plurality of optical fibers (110 to 113) with a via (130 to 133) intersecting with each repective fiber.
Claim 5
Dependent Claim
16 words
A method according to claim 3, CHARACTERISED IN THAT a mirrored plug (210) forms each via.
Claim 6
Dependent Claim
51 words
A method according to claim 1 or 2, CHARACTERISED IN THAT the distribution means comprises at least one layer of transparent material or at least one optical fiber mat of interwoven fibers, and in that each via extends from a transparent layer or mat to a component on the component layer.
Claim 7
Dependent Claim
78 words
A printed circuit board comprising a component layer (101, 304), and optical signal distribution means (110 to 113 or 303) secured to the said component layer, CHARACTERISED BY at least another layer (100) of circuit board laminated to the component layer and covering the said distribution means, and at least one via (130) of optical transmission material (412) extending through at least one (300) of the layers between the distribution means and the surface of the circuit board.
Claim 8
Dependent Claim
78 words
A printed circuit board comprising a component layer (101, 304), and optical signal distribution means (110 to 113 or 303) secured to the said component layer, CHARACTERISED BY at least another layer (100) of circuit board laminated to the component layer and covering the said distribution means, and at least one via (130) of optical transmission material (412) extending through at least one (300) of the layers between the distribution means and the surface of the circuit board.
Claim 9
Dependent Claim
27 words
A printed circuit board according to claim 6, CHARACTERISED IN THAT an opto-electrical device (121) is located on the circuit board surface and over a respective via.
Claim 10
Dependent Claim
34 words
A circuit board according to claim 6 or 7, CHARACTERISED IN THAT the distribution means comprises a plurality of optical fibers (110 to 113) with a via (130 to 133) intersecting with each fiber.
Claim 11
Dependent Claim
54 words
A circuit board according to claim 6 or 7, CHARACTERISED IN THAT the distribution means comprises at least one layer of transparent material (103) or at least one optical fiber mat of interwoven fibers, and in that each via extends from a transparent layer or mat to a component (411) on the component layer.
Claim 12
Dependent Claim
17 words
A circuit board according to claim 8, CHARACTERISED IN THAT a mirrored plug (210) forms each via.
References Cited (Backward Citations)
No citation records indexed.
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