Photopolymerizable composition having superior adhesion, articles and processes

Claim 2

A photopolymerizable composition comprising (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 3

The composition of claim 1 wherein component (a) comprises wherein R 1 is R 2 is R 3 is H or an alkyl group 1 to 10 carbon atoms, and A is or -A- represents a linkage between O and and wherein m is an integer from 1 to 10, n is zero or an integer from 1 to 5, q is an integer from 1 to 10 r is an integer from 1 to 10, and s is an integer from 1 to 10.

Claim 4

The composition of claim 2 wherein for Formula (I) of component (a): R 1 is and R 2 is and n is 2.

Claim 5

The composition of claim 2 wherein Formula (I) is at least 30% by weight of component (a).

Claim 6

The composition of claim 3 wherein Formula (I) is at least 30% by weight of compound (a).

Claim 7

The composition of claim 2 wherein an analogue of Formula (I) is present with Formula (I) as defined except R 1 and R 2 are identical for the analogue.

Claim 8

The composition of claim 3 wherein an analogue of Formula (I) is present with Formula (I) as defined except R 1 and R 2 are identical for the analogue.

Claim 9

The composition of claim 7 wherein R and R 2 are both

Claim 10

The composition of claim 7 wherein R 1 and R 2 are both

Claim 11

The composition of claim 8 wherein which addition contains an analogue wherein both R 1 and R 2 are

Claim 12

The composition of claim 1 wherein an acrylated urethane is present.

Claim 13

An article..comprising a storage stable photopolymerizable composition supported by a flexible film wound in a roll whereby the photopolymerizable composition comprises (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 14

An article..comprising a storage stable photopolymerizable composition supported by a flexible film wound in a roll whereby the photopolymerizable composition comprises (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 15

The article of claim 12 wherein component (a) comprises wherein R 1 is R 2 is R 3 is H or an alkyl group 1 to 10 carbon atoms, and A is or -A- represents a linkage between O and and wherein m is an integer from 1 to 10, n is zero or an integer from 1 to 5, q is an integer from 1 to 10 r is an integer from 1 to 10, and s is an integer from 1 to 10.

Claim 16

The article of claim 13 wherein Formula (I) of component (a) includes and and n is 2.

Claim 17

A multilayer printed circuit board comprising two conductive layers separated by a dielectric layer of a photopolymerized composition formed from a precursor photopolymerizable composition which comprises (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 18

A multilayer printed circuit board comprising two conductive layers separated by a dielectric layer of a photopolymerized composition formed from a precursor photopolymerizable composition which comprises (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 19

The multilayer printed circuit board of claim 15 wherein component (a) comprises wherein R 1 is R 2 is R 3 is H or an alkyl group 1 to 10 carbon atoms, and A is or or -A- represents a linkage between O and and wherein m is an integer from 1 to 10. n is zero or an integer from 1 to 5, q is an integer from 1 to 10 r is an integer from 1 to 10, and s is an integer from 1 to 10.

Claim 20

The multilayer printed circuit board of claim 16 wherein Formula (I) of component (a) includes R 1 is and R 2 is and n is 2.

Claim 21

In a process for laminating a photopolymerizable film to a substrate comprising (a) laminating to the substrate a supported photopolymerizable film, (b) imagewise exposing the layer to actinic radiation, (c) removing unexposed areas of the layer to form resist areas, (d) permanently modifying areas of the substrate which are unprotected by the resist areas by etching the substrate or by depositing a material onto the substrate, and wherein the improvement comprises the photopolymerizable film which contains (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 22

In a process for laminating a photopolymerizable film to a substrate comprising (a) laminating to the substrate a supported photopolymerizable film, (b) imagewise exposing the layer to actinic radiation, (c) removing unexposed areas of the layer to form resist areas, (d) permanently modifying areas of the substrate which are unprotected by the resist areas by etching the substrate or by depositing a material onto the substrate, and wherein the improvement comprises the photopolymerizable film which contains (a) a monomeric component which is a half acryloyl ester of bisphenol A epoxy monomer; (b) an initiating system activated by actinic radiation; and (c) a preformed macromolecular elastomeric water-insoluble polymer binder having substantially no acidic groups; with the proviso that after exposure of the photopolymerizable composition to actinic radiation the resulting photopolymerizable compositions has the ability to withstand contact for 24 hours with a liquid at a pH 12 maintained at a temperature of 70°C and with the further proviso that after lamination of the photopolymerizable composition onto a substrate and upon exposure of actinic radiation and curing at a temperature of 150°C the resulting photopolymerized composition can withstand a peel force of at least 5.0 pounds per linear inch without removal of the exposed and cured composition from the substrate.

Claim 23

The process of claim 18 wherein (e) an additional layer is adhered to the resist areas.

Claim 24

The process of claim 19 wherein component (a) comprises wherein R 1 is R 2 is R 3 is H or an alkyl group 1 to 10 carbon atoms, and A is -A- represents a linkage between O and and wherein m is an integer from 1 to 10, n is zero or an integer from 1 to 5, q is an integer from 1 to 10 r is an integer from 1 to 10, and s is an integer from 1 to 10.

Claim 25

The process of claim 20 wherein Formula (I) of component (a) includes R 1 is R 2 is - and n is 2.