Patent EP0265631A1 successfully refreshed from Google Patents.
EP0265631A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Use of tapered head pin design to improve the stress distribution in the braze joint
Assignee: International Business Machines Corp
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Filing: 1987-09-01
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Granted: —
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Expires: 2007-09-01
Abstract
Abstract Connector structure for reducing the stresses created on a substrate (11) and on the bonding surface (22) at which a connector is attached. The connector has a tapered or beveled head (23) thereby tapering the stress away from the edges of the bonding surface and therefore away from the high stress areas of the substrate, preventing cracking and delamination problems that might otherwise result. The taperedhead geometry also allows greater flexibility in manufacturing the connectors particularly when fabricating pins using a coldheading process in that a greater shank diameter:pin head diameter ratio can be obtained.
Inventors
- 👤 Birendra Nath Agarwala
- 👤 Paul Harry Palmateer
- 👤 Da Yuan Shih
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 19:59
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/099; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
38 words
A connector to be bonded to a substrate for electrically connecting that substrate to another electrical entity comprising; a flat bonding surface; a shank for interconnection; and, a tapered portion extending from the shank to the bonding surface.
Claim 2
Dependent Claim
38 words
A connector to be bonded to a substrate for electrically connecting that substrate to another electrical entity comprising; a flat bonding surface; a shank for interconnection; and, a tapered portion extending from the shank to the bonding surface.
Claim 3
Dependent Claim
28 words
The connector of Claim 1, wherein the tapered portion is beveled wherein the angle defined by said beveled portion to the bonding surface is less than 90 .
Claim 4
Dependent Claim
17 words
The connector of Claim 1, wherein the tapered portion is beveled at an angle of 45 .
Claim 5
Dependent Claim
14 words
The connector of Claim 1, 2 or 3, wherein the tapered portion is concave.
Claim 6
Dependent Claim
13 words
The connector of Claim 1,2 or 3, wherein the tapered portion is convex.
Claim 7
Dependent Claim
25 words
The connector according to anyone of the preceding Claims, wherein the diameter of the shank is substantially smaller than the diameter of the bonding surface.
Claim 8
Dependent Claim
25 words
The connector of Claim 6, wherein the ratio of the diameter of the bonding surface to the diameter of the shank is greater than 2,4:1.
Claim 9
Dependent Claim
45 words
An electrical component for attachment to an assembly member comprising: a head attached on a predetermined surface region of said assembly member, said head having tapered edges so as to reduce the stresses applied on said assembly member; and a shank extending from said head.
Claim 10
Dependent Claim
45 words
An electrical component for attachment to an assembly member comprising: a head attached on a predetermined surface region of said assembly member, said head having tapered edges so as to reduce the stresses applied on said assembly member; and a shank extending from said head.
Claim 11
Dependent Claim
30 words
A component as claimed in claim 8, wherein the tapered edges are linear and the angle formed by the surface region and the tapered edges is less than 90 .
Claim 12
Dependent Claim
36 words
A component as claimed in claim 8 or 9, wherein the tapered edges are linear and the angle formed by the surface region at which the head is attached and the beveled edges is 45 .
Claim 13
Dependent Claim
26 words
The component of claim 9 or 10, wherein the ratio of the diameter of the head to the diameter of the shank is greater than 2.4:1.
Claim 14
Dependent Claim
44 words
In a semiconductor integrated circuit packaging assembly having a plurality of interconnect pins with pin heads brazed on metallic pads located on a dielectric substrate, the improvement comprising: tapered edges on said pin heads adapted to reduce the stresses applied on said adjoining substrate.
Claim 15
Dependent Claim
44 words
In a semiconductor integrated circuit packaging assembly having a plurality of interconnect pins with pin heads brazed on metallic pads located on a dielectric substrate, the improvement comprising: tapered edges on said pin heads adapted to reduce the stresses applied on said adjoining substrate.
Claim 16
Dependent Claim
54 words
In a semiconductor integrated circuit packaging assembly having a plurality of interconnect pins having pin heads attached by a bonding material to metallic bonding pads located on a dielectric substrate, the improvement comprising: the use of pins having heads with beveled edges adapted to reduce the total volume of bonding material in the bond.
Claim 17
Dependent Claim
54 words
In a semiconductor integrated circuit packaging assembly having a plurality of interconnect pins having pin heads attached by a bonding material to metallic bonding pads located on a dielectric substrate, the improvement comprising: the use of pins having heads with beveled edges adapted to reduce the total volume of bonding material in the bond.
References Cited (Backward Citations)
No citation records indexed.
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