Package density doubling device for semiconductor chips containing monolithically integrated circuits

Abstract

Abstract To double the packing density of semiconductor chips (1) the top and bottom of an electrically insulating substrate (2) are provided with semiconductor chips (1) and conductor tracks. The latter originate from contact areas (3) at the edges of the substrate (2). Soldered to the contact areas (3) on the surface of the substrate (2) are contact springs (4). The substrate (2) provided with semiconductor chips (1), covering cap (5) and heat sinks (6) is inserted into the recess (9) of a mother board (12). The latter is provided with contact areas (10) on the top and bottom at the edges of the recess (9). Soldered to the contact areas (10) at the bottom are contact springs (13) whose free end makes contact with the contact areas (3) on the bottom of the substrate (2). Mounted at two opposite sides of the heat sink (6) are two locking brackets (7) made of resilient material which have a projection (8) at their free ends. The projections (8) catch under lugs (14) of locking pillars (11) mounted on the mother board (12) and hold the substrate (2) firmly in position. <IMAGE>

Inventors

• 👤 Manfred Perske
• 👤 Horst Dipl.-Ing. Maier
• 👤 Jürgen Landrock
• 👤 Halim Dipl.-Ing. Tandjung

Bibliographic Details