Patent US4329155A successfully refreshed from Google Patents.
Patent EP0264105A2 successfully refreshed from Google Patents.
EP0264105A2
Expired / Lapsed
EP
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Method of producing multilayer printed-wiring board containing metal core
Assignee: Hitachi Ltd
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Filing: 1987-10-13
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Granted: —
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Expires: 2007-10-13
Abstract
Abstract Disclosed is a method of producing a multilayer printed-wiring board containing at least a metal plate (1) as an inner layer plate. The method comprises the steps of: forming as the metal plate a metal plate having a peripheral portion (3) which is a non-product portion, and a product portion (2) surrounded by the non-product portion, the peripheral portion (3) and the product portion (2) being partially connected; filling an insulating material (10) in non-connecting portions (16) formed between the peripheral portion and the product portion; laminating the metal plate (1) with another inner layer plates to form a multilayer body (20); and separating the peripheral portion from the product portion within the regions (16) in which the insulating material (10) is filled.
Inventors
- 👤 Fumio Imahashi
- 👤 Hisato Shirasawa
- 👤 Masami Kawaguchi
- 👤 Norio Sengoku
- 👤 Tsutomu Imai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 18:45
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/44; H05K3/445; H05K3/46; H05K3/4611; H05K3/4641; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/0969; H05K2203/00; H05K2203/14; H05K2203/143; H05K3/0011; H05K3/0044; H05K3/0052
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
108 words
A method of producing a multilayer printed-wiring board containing at least one metal plate as an inner layer plate, comprising the steps of: forming as said metal plate a metal plate having a peripheral portion which is a non-product portion, and a product portion surrounded by said non-product portion, said peripherical portion and said product portion being partially connected; filling an insulating material in non-connecting portions formed between said peripheral portion and said product portion; laminating said metal plate with another inner layer plates to form a multilayer body; and separating said peripheral portion form said product portion within the regions in which said insulating material is filled.
Claim 2
Independent Claim
108 words
A method of producing a multilayer printed-wiring board containing at least one metal plate as an inner layer plate, comprising the steps of: forming as said metal plate a metal plate having a peripheral portion which is a non-product portion, and a product portion surrounded by said non-product portion, said peripherical portion and said product portion being partially connected; filling an insulating material in non-connecting portions formed between said peripheral portion and said product portion; laminating said metal plate with another inner layer plates to form a multilayer body; and separating said peripheral portion form said product portion within the regions in which said insulating material is filled.
Claim 3
Dependent Claim
31 words
A method of producing a multilayer printed-wiring board according to claim 1, wherein said metal plate is monolithically formed to have said peripheral portion, said product portion and said connecting portions.
Claim 4
Dependent Claim
43 words
A method of producing a multilayer printed-wiring board according to claim 1, wherein in said separating step said connecting portions are cut away in such a manner that a cutting line is recessed inwardly toward said product portion side from the separated surface.
Claim 5
Dependent Claim
26 words
A method of producing a multilayer printed-wiring board according to claim 1, wherein it contains two or more of said metal plates having the same shape.
Claim 6
Independent Claim
115 words
A method of producing a multilayer printed-wiring board containing at least one metal plate as an inner layer plate, comprising the steps of: forming as said metal plate a metal plate having a peripheral portion which is a non-product portion, and a product portion surrounded by said peripheral portion, said peripheral portion and said product portion being partially connected; filling an insulating material is non-connecting portions formed between said peripheral portion and said product portion; laminating two or more of said metal plates to form a multilayer body, said metal plates having mutually non-aligned connecting portions; and separating said peripheral portions from said product portions within the regions in which said insulating material is filled.
Claim 7
Independent Claim
115 words
A method of producing a multilayer printed-wiring board containing at least one metal plate as an inner layer plate, comprising the steps of: forming as said metal plate a metal plate having a peripheral portion which is a non-product portion, and a product portion surrounded by said peripheral portion, said peripheral portion and said product portion being partially connected; filling an insulating material is non-connecting portions formed between said peripheral portion and said product portion; laminating two or more of said metal plates to form a multilayer body, said metal plates having mutually non-aligned connecting portions; and separating said peripheral portions from said product portions within the regions in which said insulating material is filled.
Claim 8
Dependent Claim
31 words
A method of producing a multilayer printed-wiring board according to claim 5, wherein said metal plate is monolithically formed to have said peripheral portion, said product portion and said connecting portions.
Claim 9
Independent Claim
127 words
A method of producing a multilayer printed-wiring board containing at least one metal plate as an inner layer plate, comprising the steps of: forming as said metal plate a metal plate having a peripheral portion which is a non-product portion, and a product portion surrounded by said peripheral portion, said peripheral portion and said product portion being partially connected; filling an insulation material in non-connecting portions formed between said peripheral portion and said product portion; laminating two or more of said metal plates to form a multilayer body, said metal plates having mutually non-aligned connecting portions; separating said connecting portions and filling an insulating material in separated portions; and separating said peripheral portions from said product portions within the regions in which said insulating material is filled.
Claim 10
Independent Claim
127 words
A method of producing a multilayer printed-wiring board containing at least one metal plate as an inner layer plate, comprising the steps of: forming as said metal plate a metal plate having a peripheral portion which is a non-product portion, and a product portion surrounded by said peripheral portion, said peripheral portion and said product portion being partially connected; filling an insulation material in non-connecting portions formed between said peripheral portion and said product portion; laminating two or more of said metal plates to form a multilayer body, said metal plates having mutually non-aligned connecting portions; separating said connecting portions and filling an insulating material in separated portions; and separating said peripheral portions from said product portions within the regions in which said insulating material is filled.
Claim 11
Dependent Claim
44 words
A metal plate to be disposed as an inner layer plate of a multilayer printed-wiring board characterized in that it is formed such that a peripheral portion which is a non-product portion and a product portion surrounded by said peripheral portion are partially connected.
Claim 12
Dependent Claim
44 words
A metal plate to be disposed as an inner layer plate of a multilayer printed-wiring board characterized in that it is formed such that a peripheral portion which is a non-product portion and a product portion surrounded by said peripheral portion are partially connected.
References Cited (Backward Citations)
No citation records indexed.
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