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Patent EP0260857A2 successfully refreshed from Google Patents.
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EP0260857A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Multilayer wiring substrate

Assignee: NEC Corp
•
Filing: 1987-09-07
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Granted: —
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Expires: 2007-09-07
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Abstract

Abstract A multilayer wiring substrate wherein a substrate of ceramic material (11) contains a plurality of power supply wiring layers (1) and is formed with first and second through-holes (20,20a). Each of the first through-holes (20) contains a first metal layer (32,33) which is connected to at least one of the power supply wiring layers (12,13). Each of the second through-holes (20a) has a wall surface coated with a layer of a fluoride resin dielectric (21) with a second metal layer (22) formed on the coating. A circuit is supplied with power via the first metal layers and with signals via the second metal layers. The circuit comprises thin film wiring layers (25) formed on the substrate, insulating layers (24) made of an organic material, and electronic circuit elements (not shown). The substrate is made by coating upper and lower surfaces and through-holes of a substrate with a layer of the fluid resin dielectric, removing the coating from the upper and lower surfaces, forming a metal layer in the upper and lower surfaces and on the coating and removing the metal layer except for portions at each end of and within the through-holes.

Inventors

  • 👤 Tatsuo Inoue

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-30 16:05
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H05K1/0213; H05K1/0237; H05K1/024; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/0154; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K3/00; H05K3/46; H05K3/4602; H05K3/4605; H05K3/4644; H05K3/467; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917; Y10T428/24926

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 133 words
A multilayer wiring substrate comprising: a substrate section made of a ceramic material; a plurality of power-­supply wiring layers formed within said substrate section; a plurality of first and second through-holes penetrating said substrate section; first electrically conductive metal layers, each of which is formed on a wall surface of said section to define each of said first through-holes and is connected electrically to at least one of said power supply wiring layers; coating layers of a fluoride resin dielectric, each of which is formed on a wall surface of said section to define each of said second through-holes; second electrically conductive metal layers formed on said coating layers, respectively; and a circuit supplied with power via said first electrically conductive metal layers and with signals via said second electrically conductive metal layers.
Claim 2
Dependent Claim 133 words
A multilayer wiring substrate comprising: a substrate section made of a ceramic material; a plurality of power-­supply wiring layers formed within said substrate section; a plurality of first and second through-holes penetrating said substrate section; first electrically conductive metal layers, each of which is formed on a wall surface of said section to define each of said first through-holes and is connected electrically to at least one of said power supply wiring layers; coating layers of a fluoride resin dielectric, each of which is formed on a wall surface of said section to define each of said second through-holes; second electrically conductive metal layers formed on said coating layers, respectively; and a circuit supplied with power via said first electrically conductive metal layers and with signals via said second electrically conductive metal layers.
Claim 3
Dependent Claim 63 words
A multilayer wiring substrate as claimed in Claim 1, in which said circuit comprises: a plurality of thin film wiring layers formed on said substrate section; insulating layers made of an organic material electrically insulating between said thin film wiring layers; and one or more electronic circuit elements packaged on the uppermost layer of said thin film wiring layers and said insulating layers.
Claim 4
Independent Claim 118 words
A method of manufacturing a multilayer wiring substrate, comprising the steps of: forming a coating layer made of a fluoride resin dielectric on the upper and lower surfaces of a substrate section and on surfaces of said substrate section to define through-holes penetrating through said substrate section made of a ceramic material; removing said coating layer from said upper and lower surfaces of said substrate section; forming a metal layer made of one or more conductive materials on said upper and lower surfaces of said substrate section and on said coating layer; and removing said metal layer except for portions of said metal layer which lie on both ends of each of said through-holes and within said through-holes.
Claim 5
Independent Claim 118 words
A method of manufacturing a multilayer wiring substrate, comprising the steps of: forming a coating layer made of a fluoride resin dielectric on the upper and lower surfaces of a substrate section and on surfaces of said substrate section to define through-holes penetrating through said substrate section made of a ceramic material; removing said coating layer from said upper and lower surfaces of said substrate section; forming a metal layer made of one or more conductive materials on said upper and lower surfaces of said substrate section and on said coating layer; and removing said metal layer except for portions of said metal layer which lie on both ends of each of said through-holes and within said through-holes.

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