EP0260516A1
Expired / Lapsed
EP
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Photoselective metal deposition process
Assignee: General Electric Co
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Filing: 1987-08-31
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Granted: —
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Expires: 2007-08-31
Abstract
Abstract Metal is deposited on a substrate by irradiating at least a portion of the substrate in the presence of a catalytic metal-containing compound with radiation sufficient to decompose the catalytic metal-containing compound and thereby deposit the catalytic metal on the substrate, and then contacting the catalytic metal with an electroless plating solution containing the metal to be deposited on the substrate. Products produced by the method are useful in the manufacture of electronic components including printed circuit boards, semiconductor devices and the like.
Inventors
- 👤 Herbert Stanley Cole, Jr.
- 👤 Yung Scheng Liu
- 👤 Herbert Reynold Philipp
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 01:10
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/1633; C23C18/1646; C23C18/165; C23C18/18; C23C18/20; C23C18/28; C23C18/30; C23C18/31; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
93 words
A method of depositing metal on a substrate comprising: (a) irradiating at least a portion of the substrate in the presence of a volatile catalytic metal-containing compound with an amount of radiation sufficient to decompose the metal-containing compound and thereby selectively deposit an amount of the catalytic metal on the substrate sufficient to instigate deposition of metal from an electroless plating solution; and (b) contacting the catalytic metal-coated portion of the substrate with an electroless plating solution containing the metal to be deposited, to thereby deposit metal from the solution on the substrate.
Claim 2
Independent Claim
93 words
A method of depositing metal on a substrate comprising: (a) irradiating at least a portion of the substrate in the presence of a volatile catalytic metal-containing compound with an amount of radiation sufficient to decompose the metal-containing compound and thereby selectively deposit an amount of the catalytic metal on the substrate sufficient to instigate deposition of metal from an electroless plating solution; and (b) contacting the catalytic metal-coated portion of the substrate with an electroless plating solution containing the metal to be deposited, to thereby deposit metal from the solution on the substrate.
Claim 3
Dependent Claim
29 words
The method of claim 1 wherein the catalytic metal-containing compound has a vapor pressure of from about 1 to about 100 Torr at a temperature below its decomposition temperature.
Claim 4
Dependent Claim
17 words
The method of claim 1 wherein step (a) is conducted at a temperature of up to 150°C.
Claim 5
Dependent Claim
19 words
The method of claim 3 wherein step (a) is conducted at a temperature of between about 50° and 80°C.
Claim 6
Dependent Claim
61 words
The method of claim 1 wherein step (a) comprises: (a) adding the volatile catalytic metal-containing compound to a reaction vessel containing the substrate; (b) heating the reaction vessel to a temperature below the decomposition temperature of the catalytic metal-containing compound; and (c) irradiating the surface of the substrate to heat the substrate above the decomposition temperature of the catalytic metal-containing compound.
Claim 7
Dependent Claim
15 words
The method of claim 1 wherein the catalytic metal-containing compound comprises a volatile palladium compound.
Claim 8
Dependent Claim
30 words
The method of claim 6 wherein the volatile palladium compound comprises one of the group consisting of palladium (II) 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, palladium (II) 1,1,1-trifluoro-2,4-pentanedionate, palladium (II) 2,4-pentanedionate and palladium (II) heptafluorodimethyloctanedionate.
Claim 9
Dependent Claim
14 words
The method of claim 6 wherein the volatile palladium compound comprises palladium 1,1,1,5,5,5-hexafluoro-2, 4-pentanedionate.
Claim 10
Dependent Claim
22 words
The method of claim 1 wherein the electrolessly-plated metal comprises one of the group consisting of copper, palladium, nickel, cobalt and iron.
Claim 11
Dependent Claim
11 words
The method of claim 1 wherein the electrolessly-plated metal comprises copper.
Claim 12
Dependent Claim
27 words
The method of claim 1 wherein the substrate comprises one of the group consisting of polyimides, alumina, ceramics, silicone-polyimides, polysulfones, silicon, silicone rubber, metal and silicon dioxide.
Claim 13
Dependent Claim
21 words
The method of claim 1 wherein the substrate includes an insulative layer thereon, said metal being deposited on the insulative layer.
Claim 14
Dependent Claim
31 words
The method of claim 1 wherein step (a) comprises irradiating the substrate with laser radiation at a wavelength selected from 257nm and 351nm to thereby photochemically decompose the catalytic metal-containing compound.
Claim 15
Dependent Claim
29 words
The method of claim 1 wherein step (a) comprises irradiating the substrate with laser radiation at a wavelength of about 514nm to thereby pyrolytically decompose the catalytic metal-containing compound.
Claim 16
Dependent Claim
26 words
The method of claim 1 wherein step (a) comprises irradiating the substrate with an excimer laser at 248nm to thereby photochemically decompose the catalytic metal-containing compound.
Claim 17
Dependent Claim
23 words
The method of claim 15 wherein the laser radiation is emitted at an energy level of from about 10 mJ/cm² to 300 mJ/cm².
Claim 18
Dependent Claim
9 words
The product produced by the method of claim 1.
Claim 19
Independent Claim
96 words
A method of depositing metal on a substrate comprising: (a) irradiating at least a portion of the substrate in the presence of a volatile palladium compound at a temperature of up to 150°C with an amount of radiation sufficient to decompose the palladium compound and thereby deposit an amount of palladium metal on the substrate sufficient to instigate deposition of the metal from an electroless plating solution; and (b) contacting the palladium metal-coated portion of the substrate with an electroless plating solution containing the metal to be deposited to thereby deposit the metal on the substrate.
Claim 20
Independent Claim
96 words
A method of depositing metal on a substrate comprising: (a) irradiating at least a portion of the substrate in the presence of a volatile palladium compound at a temperature of up to 150°C with an amount of radiation sufficient to decompose the palladium compound and thereby deposit an amount of palladium metal on the substrate sufficient to instigate deposition of the metal from an electroless plating solution; and (b) contacting the palladium metal-coated portion of the substrate with an electroless plating solution containing the metal to be deposited to thereby deposit the metal on the substrate.
Claim 21
Dependent Claim
29 words
The method of claim 18 wherein the palladium compound comprises one of the group consisting of palladium (II) 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, palladium (II) 1,1,1-trifluoro-2,4-pentanedionate, palladium (II) 2,4-pentanedionate and palladium (II) heptafluorodimethyloctanedionate.
Claim 22
Dependent Claim
13 words
The method of claim 18 wherein the volatile palladium compound comprises palladium 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate.
Claim 23
Dependent Claim
13 words
The method of claim 19 wherein the metal to be deposited comprises copper.
Claim 24
Dependent Claim
9 words
The product produced by the method of claim 18.
References Cited (Backward Citations)
EP0182193A2
Cited
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