EP0260360A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Resin-sealed semiconductor device
Assignee: DuPont Toray Specialty Materials KK
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Filing: 1986-09-19
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Granted: —
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Expires: 2006-09-19
Abstract
Abstract The resin-sealed semiconductor device of the present invention is characterized by a thin cured silicone film formed in such a way that it integratedly covers a surface of a semiconductor chip together with surfaces of bonding pads but does not substantially cover the bonding wires. This contributes to an improvement in the moisture resistance of the resin-sealed semiconductor device, while preventing bonding wire breaking caused by stress set up upon infliction of thermal shock to eliminate the adverse effect of stress on a semiconductor chip.
Inventors
- 👤 Katsutoshi Mine
- 👤 Kazumi Nakayoshi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 06:10
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W74/137; H10W74/476; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/07551; H10W72/07553; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
69 words
In a resin-sealed semiconductor device comprising a semiconductor chip having thereon bonding pads electrically connected with a le ad frame by bonding wires and having a surface thereof covered with a cured silicone film; an improvement wherein said cured silicone film is so thin that it does not substantially cover said bonding wires while integratedly covering said surface of said semiconductor chip together with surfaces of said bonding pads.
Claim 2
Dependent Claim
69 words
In a resin-sealed semiconductor device comprising a semiconductor chip having thereon bonding pads electrically connected with a le ad frame by bonding wires and having a surface thereof covered with a cured silicone film; an improvement wherein said cured silicone film is so thin that it does not substantially cover said bonding wires while integratedly covering said surface of said semiconductor chip together with surfaces of said bonding pads.
Claim 3
Dependent Claim
22 words
A resin-sealed semiconductor device as claimed in Claim 1, wherein the thickness of said cured silicone film is 10 µm or less.
Claim 4
Dependent Claim
45 words
A resin-sealed semiconductor device as claimed in Claim 2 wherein said cured silicone film has a thickness of 7 to 8 µm in recessed surface portions of said semiconductor chip and a thickness of 1 to 2 µm in protruding portions of said semiconductor chip.
Claim 5
Dependent Claim
19 words
A resin-sealed semiconductor device as claimed in Claim 3, wherein the surface of said cured silicone film is even.
Claim 6
Dependent Claim
25 words
A resin-sealed semiconductor device as claimed in Claim 1, wherein the material of said cured silicone film is a silicone rubber or a silicone gel.
Claim 7
Dependent Claim
23 words
A resin-sealed semiconductor device as claimed in Claim 2, wherein said cured silicone film is a hardened silicone rubber or silicone gel film.
Claim 8
Dependent Claim
23 words
A resin-sealed semiconductor device as claimed in Claim 1, wherein said semiconductor chip is an LSI, a transistor, an IC, or a VLSI.
Claim 9
Dependent Claim
27 words
A resin-sealed semiconductor device as claimed in Claim 1, wherein said bonding pads are made of aluminum, and said bonding wires are made of gold or aluminum.
Claim 10
Dependent Claim
18 words
A resin-sealed semiconductor device as claimed in Claim 1, wherein said resin for sealing is a thermosetting resin.
Claim 11
Dependent Claim
17 words
A resin-sealed semiconductor device as claimed in Claim 9, wherein said thermosetting resin is an epoxy resin.
References Cited (Backward Citations)
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