EP0108502A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A plastics moulded semiconductor device and a method of producing it
Assignee: Fujitsu Ltd
•
Filing: 1983-10-06
•
Granted: —
•
Expires: 2003-10-06
Abstract
Abstract A semiconductor device 11 having a moulded plastics body 12 has its stage 13 on which the semiconductor chip 14 is mounted formed separately from the lead frame 21 carrying the leads 15. This enables the innermost part 15a of the leads 15 to overlap the stage 13 and the chip 14. With this arrangement the width of the chip 14 may be close to that of the plastic body 12 without decreasing the resistance of the inner leads 15a to the pull out from the plastic body 12. The layout of the inner leads 15a is also not restricted since-the inner leads 15a may occupy the region above the chip 14.
Inventors
- 👤 Akihiro Kubota
- 👤 Rikio Sugiura
- 👤 Tsuyoshi Fujitsu-Ida-Shataku 4207 Aoki
- 👤 Michio Ono
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 00:25
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W90/00; H10W90/811; H10W70/01; H10W70/04; H10W70/411; H10W70/456; H10W70/458; H10W70/475; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W76/00; H10W76/10; H10W76/17; H10W76/18; H10W95/00; H10W72/00; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S257/00; Y10S257/916
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
94 words
A semiconductor device comprising: a moulded plastics body (12); a stage (13) in the moulded plastics body (12); a semiconductor chip (14) having electrodes (20) mounted on the stage (13); and, a plurality of leads (15) each consisting of an inner lead portion (15a) embedded in the moulded plastics body (12) and an outer lead portion (15b) extending outside the moulded plastics body (12), the leads (15) and the electrodes (20) of the semiconductor chip (14) being interconnected, characterised in that part of at least one of the leads (15) overlaps the stage (13).
Claim 2
Dependent Claim
94 words
A semiconductor device comprising: a moulded plastics body (12); a stage (13) in the moulded plastics body (12); a semiconductor chip (14) having electrodes (20) mounted on the stage (13); and, a plurality of leads (15) each consisting of an inner lead portion (15a) embedded in the moulded plastics body (12) and an outer lead portion (15b) extending outside the moulded plastics body (12), the leads (15) and the electrodes (20) of the semiconductor chip (14) being interconnected, characterised in that part of at least one of the leads (15) overlaps the stage (13).
Claim 3
Dependent Claim
19 words
A semiconductor device according to claim 1, wherein part of the leads (15) also overlaps the semiconductor chip (14).
Claim 4
Dependent Claim
30 words
A semiconductor device according to claim 1 or 2, wherein an insulating film (25) covers the entire top surface of the semiconductor chip (14) except for the electrodes (20) thereof.
Claim 5
Dependent Claim
31 words
A semiconductor device according to claim 1 or 2, wherein an insulating film (62,64) is located only between the end portions (15a) of the leads (15) and the semiconductor chip (14).
Claim 6
Dependent Claim
21 words
A semiconductor device according to claim 3 or 4, wherein the insulating film is a polyimide or a silicone based material.
Claim 7
Dependent Claim
39 words
A semiconductor device according to claim 2, wherein the ends (15a) of the leads (15) extend near to the two sides of the semiconductor chip (14) running perpendicular to the rows of leads (15) and carrying the electrodes (20).
Claim 8
Dependent Claim
39 words
A semiconductor device according to any one of the preceding claims wherein the stage (40) is a capacitor made of a ceramic plate (41) having two electrodes (42), each electrode (42) being interconnected to one of the leads (15).
Claim 9
Independent Claim
136 words
A method for fabricating a semiconductor device, including the steps of: mounting a semiconductor chip .(14) having electrodes (20) onto a stage (13); fixing the stage (13) on which the semiconductor chip (14) is mounted to a lead frame (21,43,51) having a plurality of leads (15) each consisting of an inner lead.portion (15a) and an outer lead portion (15b) in such a manner that part of at least one of the leads (15) overlaps the stage (13); interconnecting the electrodes (20) of the semiconductor chip and the inner lead portions (15a) of the leads (15); moulding a plastics material around the stage (13), the semiconductor chip (14) and the inner lead portions (15a) of the leads (15); and, separating the moulded structure and the outer lead portions (15b) from the remainder of the lead frame (21,43,51).
Claim 10
Independent Claim
136 words
A method for fabricating a semiconductor device, including the steps of: mounting a semiconductor chip .(14) having electrodes (20) onto a stage (13); fixing the stage (13) on which the semiconductor chip (14) is mounted to a lead frame (21,43,51) having a plurality of leads (15) each consisting of an inner lead.portion (15a) and an outer lead portion (15b) in such a manner that part of at least one of the leads (15) overlaps the stage (13); interconnecting the electrodes (20) of the semiconductor chip and the inner lead portions (15a) of the leads (15); moulding a plastics material around the stage (13), the semiconductor chip (14) and the inner lead portions (15a) of the leads (15); and, separating the moulded structure and the outer lead portions (15b) from the remainder of the lead frame (21,43,51).
Claim 11
Dependent Claim
50 words
A method according to claim 8, further including the step of forming an insulating layer between the semiconductor chip (14) and the leads (15) by adhering an insulating film (25) onto the top surface of the semiconductor chip (14) to cover all of the top surface except the electrodes (20).
Claim 12
Dependent Claim
68 words
A method according to claim 8, further including the step of forming an insulating layer between the semiconductor chip (14) and the leads (15) by adhering an insulating film (62,64) onto a part of the semiconductor chip (14) or onto the end portions (15a) of the leads (15) to insert the insulating film only between the semiconductor chip (14) and the end portions (15a) of the leads (15).
Claim 13
Dependent Claim
47 words
ll. A method according to claim 8, 9 or 10, wherein for fixing the stage (13) to the lead frame (21) a tab comprising a stage (13) and arms (24) is prepared and this fixed to the lead frame (21) which may include a receiving portion (22).
Claim 14
Dependent Claim
30 words
.A method according to claim 8, 9 or 10 wherein the stage (14, Figure 7a) includes its own outer frame (17) the two frames (17) are fixed to one another.
Claim 15
Independent Claim
30 words
A method according to any one of claims 7 to 11, wherein the step of fixing the stage (13) to the lead frame is effected by welding or by bonding.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.