Patent EP0251836A1 successfully refreshed from Google Patents.
EP0251836A1
Expired / Lapsed
EP
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Integral heat pipe module
Assignee: Digital Equipment Corp
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Filing: 1987-05-26
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Granted: —
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Expires: 2007-05-26
Abstract
Abstract An integral heat pipe for transferring heat away from electronic components (12) is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate (14). A condenser cap (18) is fastened over the substrate to define a sealed pipe chamber (20) around the electronic component. The top of the condenser cap facing the component is a condenser surface (26) and is provided with a number of parallel fluted sections (28). Each fluted section has parallel vertical sidewalls (30) and a semi-circular top section (32). A multi-layered fiberous, porous, wick (36) is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves (15) exposed to the wick. The pipe chamber (20) is filled with a two-phase working fluid (33). The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface (26). The latent heat of vaporization is removed from the vapor so it recondenses and returns to the bottom of the module to repeat the heat transfer cycle. The wick's capillary pumping action keeps the fluid distributed over the top surface of the electronic component. The grooved top surface of the electronic component exposed to the wick cause an inverted liquid meniscus to be formed over the component. This causes the liquid adjacent the top of the component to readily evaporate.
Inventors
- 👤 Elric Saaski
- 👤 Robert J. Hannemann
- 👤 Leslie R. Fox
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 14:37
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F; F28; F28D; F28D15/00; F28D15/02; F28D15/0233; F28D15/04; F28D15/046; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
140 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condenser cap sealing attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap spaced away from the top surface of the electrical component, said surface having a plurality of fluted sections that extend across the condenser surface; and c. a sufficient volume of a two-phase, noncorrosive dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so as to maintain a thin film of liquid working fluid between the top surface of the electronic component and said condenser surface.
Claim 2
Dependent Claim
140 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condenser cap sealing attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap spaced away from the top surface of the electrical component, said surface having a plurality of fluted sections that extend across the condenser surface; and c. a sufficient volume of a two-phase, noncorrosive dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so as to maintain a thin film of liquid working fluid between the top surface of the electronic component and said condenser surface.
Claim 3
Dependent Claim
33 words
The integral heat pipe module of claim l wherein the flutes are separated by vertical side walls, and the bottom of the side walls forming said condenser surface spaced from the electronic component.
Claim 4
Dependent Claim
20 words
The integral heat pipe module of claim l wherein each of the flutes has a top section with semicircular cross-section.
Claim 5
Dependent Claim
20 words
The integral heat pipe module of claim l wherein the flutes are connected together by at least one cross flute.
Claim 6
Dependent Claim
17 words
The integral heat pipe of claim l wherein the condenser cap is connected to a heat sink.
Claim 7
Dependent Claim
29 words
The integral heat pipe of claim 5 wherein the condenser cap is provided with at least one external cooling fin, whereby said cooling fin serves as a heat sink.
Claim 8
Dependent Claim
29 words
The integral heat pipe of claim 5 wherein the condenser cap is connected to a heat sink by securing a cold plate to the top of the condensor cap.
Claim 9
Dependent Claim
168 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condensor cap sealingly attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap spaced away from the top surface of the electrical component, said surface having a plurality of fluted sections that extend across the condenser surface; c. a porous wick in said chamber between the top of the electrical component and said condenser surface; and d. a sufficient volume of a two-phase, noncorrosive, dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so said porous wick is saturated with the liquid fraction of working fluid so as to maintain a thin film of liquid working fluid adjacent to the top surface of the electronic component.
Claim 10
Dependent Claim
168 words
An integral heat pipe module for electronic components having at least one component mounted to a substrate, the component having a top surface spaced away from the surface of the substrate, said module comprising: a. a condensor cap sealingly attached to the substrate over the electronic component so as to define a sealed chamber around the electronic component; b. a condenser surface under the top of said condenser cap spaced away from the top surface of the electrical component, said surface having a plurality of fluted sections that extend across the condenser surface; c. a porous wick in said chamber between the top of the electrical component and said condenser surface; and d. a sufficient volume of a two-phase, noncorrosive, dielectric working fluid having a low-viscosity, high surface tension liquid fraction retained inside said chamber so said porous wick is saturated with the liquid fraction of working fluid so as to maintain a thin film of liquid working fluid adjacent to the top surface of the electronic component.
Claim 11
Dependent Claim
18 words
The internal heat pipe of claim 8 wherein the wick is composed of multiple layers of fibrous material.
Claim 12
Dependent Claim
21 words
l0. The integral heat pipe of claim 8 wherein the wick is formed of a plurality of layers of polyester cloth.
Claim 13
Dependent Claim
38 words
The integral heat pipe of claim 9 wherein the wick is composed of woven fibrous material and the layer in contact with the electronic component has a greater mesh than the layers spaced away from the electronic component.
Claim 14
Dependent Claim
40 words
The integral heat pipe of claim 9 wherein the wick is composed of woven fibrous material and the layer in contact with the condenser surface flutes has a coarse mesh than the layers spaced away from the condenser surface flutes.
Claim 15
Dependent Claim
23 words
The integral heat pipe of claim 8 wherein the electronic component is provided with a grooved top surface in contact with the wick.
Claim 16
Dependent Claim
33 words
The integral heat pipe module of claim 8 wherein the flutes are separated by vertical side walls, and the bottom of the side walls form the condenser surface spaced from the electronic component.
Claim 17
Dependent Claim
20 words
The integral heat pipe module of claim 8 wherein each of the flutes has a top section with semicircular cross-section.
Claim 18
Dependent Claim
20 words
The integral heat pipe module of claim 8 wherein the flutes are connected together by at least one cross flute.
Claim 19
Dependent Claim
39 words
The integral heat pipe of claim 8 wherein an evaporator cap having a grooved top surface is attached to the top of the electronic component, and the top of said grooved top surface is in contact with said wick.
Claim 20
Dependent Claim
17 words
The integral heat pipe of claim 8 wherein the condenser cap is connected to a heat sink.
Claim 21
Dependent Claim
29 words
The integral heat pipe of claim l8 wherein the condenser cap is provided with at least one external cooling fin, whereby said cooling fin serves as a heat sink.
Claim 22
Dependent Claim
29 words
The integral heat pipe of claim l8 wherein the condenser cap is connected to a heat sink by securing a cold plate to the top of the condenser cap.
References Cited (Backward Citations)
GB1435110A
Cited
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