Patent EP0247775A2 successfully refreshed from Google Patents.
EP0247775A2
Expired / Lapsed
EP
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Semiconductor package with high density I/O lead connection
Assignee: AT&T Inc
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Filing: 1987-05-19
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Granted: —
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Expires: 2007-05-19
Abstract
Abstract Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers (16) backed by an insulating tape (17) are bonded to the ends of the fingers (11) on a lead frame (10). The tape fingers are electrically coupled to the bond pads (21) on one major surface of the semiconductor chip (20) by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle (13) on the lead frame through an aperture (18) in the tape for maximum heat dissipation.
Inventors
- 👤 Lawrence Arnold Greenberg
- 👤 David Jacob Lando
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 14:27
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W70/421; H10W70/435; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
100 words
A semiconductor device package characterized by a mounting pad (41); a plurality of first conductive fingers (11) with one end of each in close lateral proximity to the pad and defining a first gap (42) therebetween; a plurality of second conductive fingers (16) formed on an insulating layer (17) and extending over the gap, one end of said second conductive fingers (11) being bonded to corresponding first conductive fingers and the opposite end of the second conductive fingers terminating in close lateral proximity to the pad to define a second gap (40) therebetween which is less than the first gap.
Claim 2
Dependent Claim
100 words
A semiconductor device package characterized by a mounting pad (41); a plurality of first conductive fingers (11) with one end of each in close lateral proximity to the pad and defining a first gap (42) therebetween; a plurality of second conductive fingers (16) formed on an insulating layer (17) and extending over the gap, one end of said second conductive fingers (11) being bonded to corresponding first conductive fingers and the opposite end of the second conductive fingers terminating in close lateral proximity to the pad to define a second gap (40) therebetween which is less than the first gap.
Claim 3
Dependent Claim
41 words
The package according to claim 1 further CHARACTERIZED BY a semiconductor device (20) with two major surfaces, said device having one major surface bonded to the mounting pad (41) and the opposite major surface including a plurality of bonding pads (21).
Claim 4
Dependent Claim
25 words
The package according to claim 2 further CHARACTERIZED BY electrical wire connections (22) between the bonding pads on the device and corresponding second conductive fingers.
Claim 5
Dependent Claim
21 words
The package according to claim 3 CHARACTERIZED IN THAT the length of the wire is less than 150 mils (3.8 mm).
Claim 6
Dependent Claim
27 words
The package according to claim 3 CHARACTERIZED IN THAT the number of electrical connections between the pads and second conductive fingers is at least 15 per side.
Claim 7
Dependent Claim
23 words
The package according to claim 1 CHARACTERIZED IN THAT the pitch of the second conductive fingers is less than 16 mils (.4 mm).
Claim 8
Dependent Claim
34 words
The package according to claim 1 CHARACTERIZED IN THAT a conductive paddle (13) is formed on a plane with the first conductive fingers (11) and the insulating layer (17) is mounted on the paddle.
Claim 9
Dependent Claim
35 words
The package according to claim 7 CHARACTERIZED IN THAT the insulating layer includes a hole (18) therein so that the mounting pad is defined by the portion of the underlying paddle exposed by said hole.
Claim 10
Dependent Claim
33 words
The package according to claim 1 CHARACTERIZED IN THAT the mounting pad (30 of FIG. 4) is formed on the same surface of the insulating layer (17) as the second conductive fingers (16).
Claim 11
Dependent Claim
29 words
The package according to claim 1 CHARACTERIZED IN THAT the mounting pad has four sides and there are at least 15 conductive fingers in close proximity to each side.
References Cited (Backward Citations)
No citation records indexed.
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