Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
55 words
A flexible printed-circuit board comprising a metal foil and a polyimide film directly bonded thereto, said polyimide film having been formed by mixing a symmetrical aromatic meta-substituted primary diamine with a symmetrical aromatic para-substituted primary diamine in an equivalent weight ratio of 10-60:90-40, and then reacting the resulting mixture with an aromatic tetracarboxylic acid anhydride.
Claim 2
Dependent Claim
55 words
A flexible printed-circuit board comprising a metal foil and a polyimide film directly bonded thereto, said polyimide film having been formed by mixing a symmetrical aromatic meta-substituted primary diamine with a symmetrical aromatic para-substituted primary diamine in an equivalent weight ratio of 10-60:90-40, and then reacting the resulting mixture with an aromatic tetracarboxylic acid anhydride.
Claim 3
Dependent Claim
82 words
A flexible printed-circuit board comprising a metal foil and a polyimide film directly bonded thereto, said polyimide film having been formed by reacting a symmetrical aromatic meta-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (A), reacting a symmetrical aromatic para-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (B), mixing said polyamic acid (A) with said polyamic acid (B) in an equivalent weight ratio of 10-60:90-40, and further reacting the-resulting mixture.
Claim 4
Dependent Claim
82 words
A flexible printed-circuit board comprising a metal foil and a polyimide film directly bonded thereto, said polyimide film having been formed by reacting a symmetrical aromatic meta-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (A), reacting a symmetrical aromatic para-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (B), mixing said polyamic acid (A) with said polyamic acid (B) in an equivalent weight ratio of 10-60:90-40, and further reacting the-resulting mixture.
Claim 5
Dependent Claim
22 words
A flexible printed-circuit board as claimed in claim 1 wherein said polyimide layer has a thickness of 10 µm to 1 mm.
Claim 6
Dependent Claim
22 words
A flexible printed-circuit board as claimed in claim 2 wherein said polyimide layer has a thickness of -10 µm to 1 mm.
Claim 7
Independent Claim
81 words
A method of making a flexible printed-circuit board which comprises the steps of mixing a symmetrical aromatic meta-substituted primary diamine with a symmetrical aromatic para-substituted primary diamine in an equivalent weight ratio of 10-60:90-40, reacting the resulting mixture with an aromatic tetracarboxylic acid anhydride to form a polyamic acid as a precursor of polyimide, coating a metal foil directly with the resulting organic solvent solution of said polyamic acid, and then heating the coated metal foil to dehydrate said polyamic acid.
Claim 8
Independent Claim
81 words
A method of making a flexible printed-circuit board which comprises the steps of mixing a symmetrical aromatic meta-substituted primary diamine with a symmetrical aromatic para-substituted primary diamine in an equivalent weight ratio of 10-60:90-40, reacting the resulting mixture with an aromatic tetracarboxylic acid anhydride to form a polyamic acid as a precursor of polyimide, coating a metal foil directly with the resulting organic solvent solution of said polyamic acid, and then heating the coated metal foil to dehydrate said polyamic acid.
Claim 9
Independent Claim
100 words
A method of making a flexible printed-circuit board which comprises the steps of reacting a symmetrical aromatic meta-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (A), reacting a symmetrical aromatic para-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (B), mixing the resulting organic solvent solution of said polyamic acid (A) with the resulting organic solvent solution of said polyamic acid (B) in an equivalent ratio of 10-60:90-40, coating a metal foil directly with the resulting mixture, and then heating the coated metal foil to dehydrate said polyamic acids.
Claim 10
Independent Claim
100 words
A method of making a flexible printed-circuit board which comprises the steps of reacting a symmetrical aromatic meta-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (A), reacting a symmetrical aromatic para-substituted primary diamine with an aromatic tetracarboxylic acid anhydride to form a polyamic acid (B), mixing the resulting organic solvent solution of said polyamic acid (A) with the resulting organic solvent solution of said polyamic acid (B) in an equivalent ratio of 10-60:90-40, coating a metal foil directly with the resulting mixture, and then heating the coated metal foil to dehydrate said polyamic acids.
Claim 11
Dependent Claim
37 words
A method of making a flexible printed-circuit board as claimed in claim 5 wherein said step of heating the coated metal foil to dehydrate said polyamic acid is carried out in an atmosphere of an inert gas.
Claim 12
Dependent Claim
37 words
A method of making a flexible printed-circuit board as claimed in claim 6 wherein said step of heating the coated metal foil to dehydrate said polyamic acids is carried out in an atmosphere of an inert gas.
Claim 13
Dependent Claim
68 words
A method of making a flexible printed-circuit board as claimed in claim 5 wherein the substrate formed by coating a metal foil directly with the resulting organic solvent solution of said polyamic acid is dried to a substantially tack-free state and rolled up, and the rolled substrate is heated in an atmosphere of an inert gas to remove the solvent therefrom and convert said polyamic acid to polyimide.
Claim 14
Dependent Claim
83 words
A method of making a flexible printed-circuit board as claimed in claim 6 wherein the laminate formed by coating a metal foil directly with a mixture of the resulting organic solvent solution of said polyamic acid (A) and the resulting organic solvent solution of said polyamic acid (B) is dried to a substantially tack-free state and rolled up, and the rolled laminate is heated in an atmosphere of an inert gas to remove the solvent therefrom and convert said polyamic acids to polyimides.
Claim 15
Dependent Claim
51 words
A method of making a flexible printed-circuit board as claimed in claim 1 wherein said symmetrical aromatic meta-substituted primary diamine is a compound of the formula where X is O, SO 2 , S, CO, CH 2 , C(CH 3 ) 2 , C(CF 3 ) 2 or a direct bond.
Claim 16
Dependent Claim
51 words
A method of making a flexible printed-circuit board as claimed in claim 2 wherein said symmetrical aromatic meta-substituted primary diamine is a compound of the formula where X is 0, SO 2 , S, CO, CH 2 , C(CH 3 ) 2 , C(CF 3 ) 2 or a direct bond.
Claim 17
Dependent Claim
51 words
A method of making a flexible printed-circuit board as claimed in claim 3 wherein said symmetrical aromatic meta-substituted primary diamine is a compound of the formula where X is O, SO 2 , S, CO, CH 2 , C(CH 3 ) 2 , C(CF 3 ) 2 or a direct bond.
Claim 18
Dependent Claim
51 words
A method of making a flexible printed-circuit board as claimed in claim 4 wherein said symmetrical aromatic meta-substituted primary diamine is a compound of the formula where X is O, SO 2 , S, CO, CH 2 , C(CH 3 ) 2 , C(CF 3 ) 2 or a direct bond.