Patent EP0242303A2 successfully refreshed from Google Patents.
EP0242303A2
Expired / Lapsed
EP
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Anisotropic elastomeric interconnecting system
Assignee: Digital Equipment Corp
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Filing: 1987-04-16
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Granted: —
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Expires: 2007-04-16
Abstract
Abstract Electronic assemblies are fabricated by stacking alternate connecting layers and component layers. The component layers may be virtually any rigid structure having contact regions formed on at least one face thereof. The connecting layers are formed from anisotropic elastomeric conductors which in turn are fabricated by stacking a plurality of conductive sheets and insulating sheets, where the conductive sheets have a plurality of parallel electrically conductive elements formed therein. By introducing a curable elastomeric resin into the stacked structure so formed, and then curing the elastomer, a solid elastomeric block having a plurality of parallel electrically conductive elements running its length is obtained. Individual elastomeric conductors suitable as connecting layers interfacing between adjacent component layers are obtained by slicing the block in a direction perpendicular to the conductors.
Inventors
- 👤 James C.K. Lee
- 👤 Richard Beck
- 👤 Chune Lee
- 👤 Edward Hu
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 21:44
CPC Classifications
H; H01; H01R; H01R13/00; H01R13/02; H01R13/22; H01R13/24; H01R13/2407; H01R13/2414; H01R43/00; H01R43/007; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/4038; H10; H10W; H10W90/00; H01R43/16; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/02; H05K2201/0275; H05K2201/0281; H05K2203/00; H05K2203/02; H05K2203/0235; H10W72/00; H10W72/01; H10W72/60; H10W90/701; H10W90/721; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
164 words
An electronic assembly comprising alternating component layers and connecting layers, said component layers being rigid structures having at least one planar face with electrical contacts formed thereon and said connecting layers being anisotropic elastomeric conductors positioned between opposed electrical contacts on adjacent component layers, wherein said anisotropic elastomeric conductors are formed by a method comprising: forming a stack of first and second sheets so that at least one second sheet lies between adjacent first sheets, wherein said first sheets include electrically conductive elements running in one direction only and the second sheets are composed of electrically insulating material; introducing a curable elastomeric resin to the stack; curing the elastomeric resin to form a solid matrix having the electrically conductive elements electrically isolated from one another and extending from one side of the block to the opposite side; and slicing the matrix in a direction transverse to the direction of the electrically conductive elements to yield said anisotropic elastomeric conductors having the elements extending thereacross.
Claim 2
Dependent Claim
164 words
An electronic assembly comprising alternating component layers and connecting layers, said component layers being rigid structures having at least one planar face with electrical contacts formed thereon and said connecting layers being anisotropic elastomeric conductors positioned between opposed electrical contacts on adjacent component layers, wherein said anisotropic elastomeric conductors are formed by a method comprising: forming a stack of first and second sheets so that at least one second sheet lies between adjacent first sheets, wherein said first sheets include electrically conductive elements running in one direction only and the second sheets are composed of electrically insulating material; introducing a curable elastomeric resin to the stack; curing the elastomeric resin to form a solid matrix having the electrically conductive elements electrically isolated from one another and extending from one side of the block to the opposite side; and slicing the matrix in a direction transverse to the direction of the electrically conductive elements to yield said anisotropic elastomeric conductors having the elements extending thereacross.
Claim 3
Dependent Claim
17 words
An assembly as in claim 1, wherein at least some of the component layers are semiconductor devices.
Claim 4
Dependent Claim
17 words
An assembly as in claim 1, wherein at least some of the component layers are ceramic substrates.
Claim 5
Dependent Claim
18 words
An assembly as in claim 1, wherein at least some of the component layers are printed circuit boards.
Claim 6
Dependent Claim
17 words
A assembly as in claim 1, wherein at least some of the component layers are terminal strips.
Claim 7
Dependent Claim
44 words
An assembly as in claim 1, wherein said component layers include a plurality of printed circuit boards each carrying a multiplicity of semiconductor devices and having contact regions formed on both faces, said board being stacked with the conductors interposed between adjacent contact regions.
Claim 8
Dependent Claim
22 words
An assembly as in claim 1, wherein the resin is introduced to the stack by coating the first sheets with said resin.
Claim 9
Dependent Claim
19 words
An assembly as in claim 1, wherein the first sheets are metal sheets having said conductive elements formed therein.
Claim 10
Dependent Claim
14 words
An assembly as in claim 8, wherein the second sheets are continuous elastomeric sheets.
Claim 11
Dependent Claim
17 words
An assembly as in claim 9, wherein the elastomeric resin and the elastomeric sheets are silicone rubber.
Claim 12
Independent Claim
144 words
A method for fabricating an electronic assembly, said method comprising: forming connecting layers by: (a) stacking first and second sheets so that at least one second sheet lies between adjacent first sheets, wherein said first sheets include electrically conductive elements ranging in one direction only and the second sheets are composed of electrically insulating material; (b) introducing a curable elastomeric resin to the stack; (c) curing the elastomeric resin to form a solid matrix having the electrically conductive elements electrically isolated from one another and extending from one side of the block to the opposite side; and (d) slicing the matrix in a direction transverse to the direction of the electrically conductive elements to yield said ccnnecting layers; and interposing connecting layers between adjacent component layers, wherein said component layers are rigid structures having at least one planar face with electrical contacts formed thereon.
Claim 13
Independent Claim
144 words
A method for fabricating an electronic assembly, said method comprising: forming connecting layers by: (a) stacking first and second sheets so that at least one second sheet lies between adjacent first sheets, wherein said first sheets include electrically conductive elements ranging in one direction only and the second sheets are composed of electrically insulating material; (b) introducing a curable elastomeric resin to the stack; (c) curing the elastomeric resin to form a solid matrix having the electrically conductive elements electrically isolated from one another and extending from one side of the block to the opposite side; and (d) slicing the matrix in a direction transverse to the direction of the electrically conductive elements to yield said ccnnecting layers; and interposing connecting layers between adjacent component layers, wherein said component layers are rigid structures having at least one planar face with electrical contacts formed thereon.
Claim 14
Dependent Claim
17 words
A method as in claim 11, wherein at least some of said component layers are semiconductor devices.
Claim 15
Dependent Claim
17 words
A method as in claim 11, wherein at least some of the component layers are ceramic substrates.
Claim 16
Dependent Claim
18 words
A method as in claim 11, wherein at least some of the component layers are printed circuit boards.
Claim 17
Dependent Claim
17 words
A method as in claim 11, wherein at least some of the component layers are terminal strips.
Claim 18
Dependent Claim
44 words
A method as in claim 11, wherein said component layers include a plurality of printed circuit boards each carrying a multiplicity of semiconductor devices and having contact regions formed on both faces, said board being stacked with the conductors interposed between adjacent contact regions.
Claim 19
Dependent Claim
22 words
A method as in claim 11, wherein the resin is introduced to the stack by coating the first sheets with said resin.
Claim 20
Dependent Claim
19 words
A method as in claim 11, wherein the first sheets are metal sheets having said conductive elements formed therein.
Claim 21
Dependent Claim
14 words
A method as in claim 18, wherein the second sheets are continuous elastomeric sheets.
Claim 22
Dependent Claim
17 words
A method as in claim 19, wherein the elastomeric resin and the elastomeric sheets are silicone rubber.
References Cited (Backward Citations)
No citation records indexed.
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