Patent EP0237808A2 successfully refreshed from Google Patents.
EP0237808A2
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EP
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Multilayered interposer board for powering high current chip modules
Assignee: International Business Machines Corp
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Filing: 1987-02-17
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Granted: —
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Expires: 2007-02-17
Abstract
Abstract A multilayered interposer powering board (2) is disclosed for the distribution of required voltage levels to integrated circuit chip modules (1) under conditions of high current demand and heat induced expansions. The interposer board (2) is introduced between the module (1) and its module mounting board (12). Flexible connector fingers (8, 9) are intermetallically or ohmically connected between a given level of the interposer board and a given power level of the module.
Inventors
- 👤 Charles John Kraus
- 👤 Herbert Ivan Stoller
- 👤 Leon Li-Heng Wu
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 06:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W90/00; H10W90/401; H05K1/0213; H05K1/0263; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10272; H05K2201/10295; H05K2201/10303; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10757; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3447; H05K3/36; H05K3/368
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
114 words
An interposer board (2) positioned between a multilayered module (1) and a module mounting board (12), said module having a plurality of chip powering levels and signal path levels for servicing a plurality of semiconductor circuit chips, said interposer board comprising a plurality of insulated current-carrying conductive planes of greater conductivity than said powering levels of said module, groups of flexible contacting members, each said plane being apertured to receive one of said groups of flexible contacting members, each member of the same group, at one end, being ohmically connected to a respective first location on a respective plane and, at the other end, to a respective second location on an associated powering level.
Claim 2
Dependent Claim
114 words
An interposer board (2) positioned between a multilayered module (1) and a module mounting board (12), said module having a plurality of chip powering levels and signal path levels for servicing a plurality of semiconductor circuit chips, said interposer board comprising a plurality of insulated current-carrying conductive planes of greater conductivity than said powering levels of said module, groups of flexible contacting members, each said plane being apertured to receive one of said groups of flexible contacting members, each member of the same group, at one end, being ohmically connected to a respective first location on a respective plane and, at the other end, to a respective second location on an associated powering level.
Claim 3
Dependent Claim
46 words
The interposer board defined in claim 1 wherein each said aperture is of sufficient dimensions to accommodate displacement of the respective member due to thermal expansion without causing contact between said respective member and any plane other than the plane to which it is ohmically connected.
Claim 4
Dependent Claim
35 words
The interposer board defined in claim 1 or 2 wherein said planes are further apertured to allow passage of conductors from said signal path levels through said interposer board without contacting any of said planes.
Claim 5
Dependent Claim
27 words
The interposer board defined in anyone of the preceding claims and further including a respective power bus connected to each of said planes for applying power thereto.
Claim 6
Dependent Claim
18 words
The interposer board defined in any one of the preceding claims wherein each of said planes comprises copper.
References Cited (Backward Citations)
No citation records indexed.
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