Liquid cooling system for integrated circuit chips

Assignee: NEC Corp

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Filing: 1987-02-25

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Granted: —

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Expires: 2007-02-25

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Abstract

Abstract A cooling system for an electronic system comprises a connector (6) mounted on a panel (7) and an integrated circuit package (3, 2) removably connected to the connector by a mounting frame (10). A layer of heat conductive bonding material (17) is provided between the package and a heat conductive member (8) which is removably secured to a water-cooling heat exchanger(11). A plurality of guide posts (12) are secured to the panel (7) for holding the heat exchanger. Each guide post is formed with an externally threaded portion (12a) on to which a thumb nut (13) is screwed. A coil spring (14) is provided between each thumb nut and the heat exchanger to exert a predetermined amount of contact pressure between the connector (6) and package (3, 2) and take the weight of the heat exchanger (11).

Inventors

👤 Yuji C/O Nec Corporation Kuramitsu
👤 Yukio C/O Nec Corporation Yamaguchi

Bibliographic Details

Application Number —

Jurisdiction EP

Data Source google_patents

Last Synchronized 2026-11-04 03:13

CPC Classifications

H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/60; H10W40/611; H10W40/20; H10W40/231; H10W40/625

Claims Analysis

Total Claims: 6

Claim 1

Independent Claim 96 words

A cooling system for an electronic system comprising: a connector mounted on a panel; an integrated circuit package removably connectable to said connector; a mounting frame for mounting said package into contact with said connector; a heat exchanger means provided with inlet and outlet means to permit liquid coolant to flow through said heat exchanger; a layer of heat conductive bonding material for bonding said heat exchanger means to said package to provide a low thermal resistance contact therebetween; and a plurality of fastening means mounted on said panel for removably holding said heat exchanger means.

Claim 2

Dependent Claim 96 words

Claim 3

Dependent Claim 77 words

A cooling system as claimed in claim l, wherein each of said fastening means comprises a guide post having a shaft portion and an externally threaded portion, a nut having an internally threaded portion engaging with said externally threaded portion, and a coil spring between said heat echanger means and said nut, said coil spring exerting a predetermined amount of pressure on said heat exchanger means when said nut is tightened until it reaches said shaft portion.

Claim 4

Dependent Claim 71 words

A cooling system as claimed in claim l, wherein said heat exchanger means includes a heat exchange unit having a plurality of throughholes and a heat conductive member having a plurality of screw thread holes in positions corresponding to said throughholes for detachably connecting said heat exchange unit and said heat conductive member together by screws, said heat conductive member being in low thermal resistance contact with said integrated circuit package.

Claim 5

Dependent Claim 40 words

A cooling system as claimed in claim l, wherein said layer comprises nonfluidic silicone compound and a wall of silicone rubber surrounding said silicone compound layer, said slicone rubber wall bonding said integrated circuit package to said heat exchanger means.

Claim 6

Dependent Claim 40 words

A cooling system as claimed in claim 3, wherein said layer comprises nonfluidic silicone compound and a wall of silicone rubber surrounding said silicone compound layer, said slicone rubber wall bonding said integrated circuit package to said heat conductive member.

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