Patent EP0234450A2 successfully refreshed from Google Patents.
EP0234450A2
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EP
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Thermosetting resin and prepreg and laminate using the same
Assignee: Hitachi Ltd
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Filing: 1987-02-13
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Granted: —
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Expires: 2007-02-13
Abstract
Abstract A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
Inventors
- 👤 Junichi Katagiri
- 👤 Akira Nagai
- 👤 Keiko Tawara
- 👤 Akio Takahashi
- 👤 Toshikazu Narahara
- 👤 Ryo Hiraga
- 👤 Motoyo Wajima
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-07 16:50
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/02; C08G59/027; C08L; C08L25/00; C08L25/02; C08L25/04; C08F; C08F12/00; C08F12/02; C08F12/04; C08F12/14; C08F12/22; C08F290/00; C08F290/08; C08F290/12; C08F290/124; C08F299/00; C08F8/00; C08L63/00; C08L63/08; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31511; Y10T428/31529; Y10T428/31678; Y10T428/31692; Y10T428/31696; Y10T442/00; Y10T442/60; Y10T442/674
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A thermosetting poly(p-hydroxystyrene) deviative resin represented by the formula: wherein A is an alkyl group; X is a halogen group; R is an alkenyl or alkenoyl group having 2 to 4 carbon atoms; p and q are independently zero or an integer of 1 to 4; and n is an integer of 1 to 100.
Claim 2
Dependent Claim
55 words
A thermosetting poly(p-hydroxystyrene) deviative resin represented by the formula: wherein A is an alkyl group; X is a halogen group; R is an alkenyl or alkenoyl group having 2 to 4 carbon atoms; p and q are independently zero or an integer of 1 to 4; and n is an integer of 1 to 100.
Claim 3
Dependent Claim
31 words
The resin of Claim 1, wherein R in the formula (I) is an ally group, an isobutenyl gruop, a vinyl group, an acrynoyl group, a methacrynoyl group, or an epoxymethacrynoyl group.
Claim 4
Dependent Claim
22 words
The resin of Claim 2, wherein X in the formula (I) is bromine and p is an integer of 1 to 4.
Claim 5
Dependent Claim
19 words
A thermosetting resin composition comprising the resin of any of claims 1 to 3 and a radical polymerization initiator.
Claim 6
Dependent Claim
32 words
The resin composition of Claim 4, which further comprises an epoxy modified polybutadiene represented by the formula: wherein Y is an epoxy resin; and m is an integer of 4 to 100.
Claim 7
Dependent Claim
22 words
The resin composit of Claim 5, wherein the poly(p-hydroxystyrene) derivative resin is brominated poly(p-hydroxystyrene) methacrylic acid ester and/or poly(p-hydroxystyrene) acrylic acid ester.
Claim 8
Dependent Claim
35 words
A prepreg obtained by impregnating a sheet-like base material with a varnish containing a solvent and the thermosetting resin composition of any of Claims 4 to 6, followed by removal of the solvent by drying.
Claim 9
Dependent Claim
18 words
A laminate obtained by piling a plurality of the prepregs of Claim 7, followed by pressing with heating.
Claim 10
Dependent Claim
66 words
A multilayer printed circuit board comprising a plurality of insulating layers and a plurality of circuit conductor layers, said insulating layers and said circuit conductor layers being laminated and bonded alternately, said insulating layers being obtained by impregnating a sheet-like base material with a varnish containing a solvent and the thermosetting resin composition of Claim 4 or 5, followed by removal of the solvent by drying.
References Cited (Backward Citations)
No citation records indexed.
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