Patent US3507153A successfully refreshed from Google Patents.
Patent EP0233824A2 successfully refreshed from Google Patents.
EP0233824A2
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EP
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Microcircuit package
Assignee: Isotronics Inc
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Filing: 1987-02-18
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Granted: —
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Expires: 2007-02-18
Abstract
Abstract A flat housing package for microcircuits constructed entirely of metal with a stainless steel, cold-rolled steel, 52 alloy, or KOVAR frame (10) and an alumina/copper alloy base (20) and the process for brazing the components to one another. The brazing process involves heating the frame (10) and (20) base in three different heating zones and permits brazing at temperatures above 800°C. The package has good heat transfer characteristics and electrical connections between the microcircuit substrates and the housing can be reworked without disturbing the brazed seal between the frame and the base.
Inventors
- 👤 Raymond J. Duff
- 👤 Iii Sidney R. Overall
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 17:54
CPC Classifications
H; H10; H10W; H10W95/00; H05; H05K; H05K5/00; H05K5/0091; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; H10W76/17
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
77 words
A flat structural housing for electronic microcircuits comprising: a frame (10) composed of a metal containing iron having electrical leads extending therethrough and glass-sealed to said frame; a flat alumina/copper alloy base (20); said frame forming the side walls of said structural housing and being brazed to said alumina/copper alloy base to form a continuous seal between said frame and said base; and said brazing having been performed after said electrical leads were glass-sealed in said frame.
Claim 2
Dependent Claim
77 words
A flat structural housing for electronic microcircuits comprising: a frame (10) composed of a metal containing iron having electrical leads extending therethrough and glass-sealed to said frame; a flat alumina/copper alloy base (20); said frame forming the side walls of said structural housing and being brazed to said alumina/copper alloy base to form a continuous seal between said frame and said base; and said brazing having been performed after said electrical leads were glass-sealed in said frame.
Claim 3
Dependent Claim
15 words
The structural housing of claim 1 wherein said metal frame (10) is made of KOVAR.
Claim 4
Dependent Claim
16 words
The structural housing of claim 1 wherein said metal frame (10) is made of 52 alloy.
Claim 5
Dependent Claim
16 words
The structural housing of claim 1 wherein said metal frame (10) is made of cold-rolled steel.
Claim 6
Dependent Claim
16 words
The structural housing of claim 1 wherein said metal frame (10) is made of stainless steel.
Claim 7
Dependent Claim
18 words
The structural housing of claim 1 containing a microcircuit substrate (50) which is soldered to said base (20).
Claim 8
Dependent Claim
17 words
The structural housing of claim 6 wherein a power chip is mounted on said microcircuit substrate (50).
Claim 9
Dependent Claim
28 words
The structural housing according to any of claims 1 to 7 further including a lid welded to said frame (10), said lid composed of a metal containing iron.
Claim 10
Dependent Claim
14 words
The structural housing of claim 8 wherein said metal lid is composed of KOVAR.
Claim 11
Dependent Claim
15 words
The structural housing of claim 8 wherein said metal lid is composed of 52 alloy.
Claim 12
Dependent Claim
15 words
The structural housing of claim 8 wherein said metal lid is composed of stainless steel.
Claim 13
Dependent Claim
15 words
The structural housing of claim 8 wherein said metal lid is composed of cold-rolled steel.
Claim 14
Independent Claim
100 words
The method of manufacturing a flat housing package for electronic microcircuits comprising: glass-sealing electrical leads (30) in apertures of a frame (10) composed of a metal containing iron, mounting said frame to a base (20) composed of an alumina copper alloy with a braze (60) disposed therebetween; placing said frame (10), braze (60), base (20) unit in a heating apparatus capable of a multiplicity of heating zones at different temperatures; and exposing said frame, braze, base unit to at least two successive heating zones with each of said heating zones at a higher temperature than the heating zone before it.
Claim 15
Independent Claim
100 words
The method of manufacturing a flat housing package for electronic microcircuits comprising: glass-sealing electrical leads (30) in apertures of a frame (10) composed of a metal containing iron, mounting said frame to a base (20) composed of an alumina copper alloy with a braze (60) disposed therebetween; placing said frame (10), braze (60), base (20) unit in a heating apparatus capable of a multiplicity of heating zones at different temperatures; and exposing said frame, braze, base unit to at least two successive heating zones with each of said heating zones at a higher temperature than the heating zone before it.
Claim 16
Dependent Claim
17 words
The method according to claim 13 wherein said electrical leads (30) are glass-sealed in a KOVAR frame.
Claim 17
Dependent Claim
18 words
The method according to claim 13 wherein said electrical leads (30) are glass-sealed in a 52 alloy frame.
Claim 18
Dependent Claim
19 words
The method according to claim 13 wherein said electrical leads (30) are glass sealed in a cold-rolled steel frame.
Claim 19
Dependent Claim
18 words
The method according to claim 13 wherein said electrical leads (30) are glass-sealed in a stainless steel frame.
Claim 20
Independent Claim
23 words
The method according to any of claims 13 to 17 wherein a gold/tin braze is used to bind said base to said frame.
Claim 21
Independent Claim
23 words
The method according to any of claims 13 to 17 wherein a gold/germanium braze is used to bind said base to said frame.
Claim 22
Independent Claim
23 words
The method according to any of claims 13 to 17 wherein a copper/silver braze is used to bind said frame to said base.
Claim 23
Dependent Claim
20 words
The method according to claim 18 wherein the brazing is performed successively in temperature zones of 150°C, 200°C, and 310°C.
Claim 24
Dependent Claim
20 words
The method according to claim 19 wherein the brazing is performed successively in temperature zones of 175°C, 300°C, and 410°C.
Claim 25
Dependent Claim
20 words
The method according to claim 20 wherein the brazing is performed successively in temperature zones of 400°C, 700°C, and 825°C.
References Cited (Backward Citations)
No citation records indexed.
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