X-ray exposure masks

Claim 1

An X-ray exposure mask, comprising: a mask substrate translucent to X-ray and light beams; an electrically conductive layer on the mask substrate, translucent to X-ray and light beams; a stencil pattern structure formed on the electrically conductive layer, translucent to light; a metal layer formed on the electrically conductive layer, for forming a plating base with the electrically conductive layer, the metal layer being translucent to X-ray and light beams; and X-ray absorption means formed on the metal layer in the stencil apertures of the stencil pattern structure.

Claim 7

A method for fabricating a patterned X-ray exposure mask, comprising the steps of: (1) providing a mask substrate translucent to X-ray and light beams; (2) forming an electrically conductive layer, translucent to X-ray and light beams, on the mask substrate; (3) forming a polymer layer on the electrically conductive layer; (4) forming an inorganic layer on the polymer layer; (5) forming resist on the inorganic layer; (6) writing mask patterns onto the resist, and developing the resist; (7) etching the inorganic layer using the resist pattern as a mask; (8) etching the polymer layer using the patterned resist and/or remaining inorganic layer parts as a mask, the remaining inorganic layer and polymer layer parts providing a stencil pattern structure; (9) forming gold, having a thickness such as to be translucent to X-ray and light beams, for forming a plating base in combination with the electrically conductive layer; and (10) plating gold on the plating base, so as to fill up at least partially apertures in the stencil pattern structure, using said plating base as an electrode for the plating.

Claim 8

A method for fabricating a patterned X-ray exposure mask, comprising the steps of: (1) providing a mask substrate translucent to X-ray and light beams; (2) forming an electrically conductive layer, translucent to X-ray and light beams, on the mask substrate; (3) forming a polymer layer on the electrically conductive layer; (4) forming an inorganic layer on the polymer layer; (5) forming resist on the inorganic layer; (6) writing mask patterns onto the resist, and developing the resist; (7) etching the inorganic layer using the resist pattern as a mask; (8) etching the polymer layer using the patterned resist and/or remaining inorganic layer parts as a mask, the remaining inorganic layer and polymer layer parts providing a stencil pattern structure; (9) forming gold, having a thickness such as to be translucent to X-ray and light beams, for forming a plating base in combination with the electrically conductive layer; and (10) plating gold on the plating base, so as to fill up at least partially apertures in the stencil pattern structure, using said plating base as an electrode for the plating.