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EP0231790A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Process for fabricating laminated structures of improved structural integrity

Assignee: HP Inc
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Filing: 1987-01-16
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Granted: —
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Expires: 2007-01-16
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Abstract

Abstract This patent application discloses a process for fabricating printhead structures for use in thermal ink jet printers. In this process, a thin film resistor substrate (10) is bonded to a flat orifice plate (12) by means of an adhesive polymer (14) to which heat and pressure are applied for a predeter­mined time. This pressure is applied to the outer surfaces of the orifice plate (12) and substrate (10) respectively and hydrostatically transmitted to the adhesive polymer (14) in such a manner as to apply pressure uniformly across the surface of the polymer (14). This application of uniform pressure is accomplished in spite of contours and other surface irregularities that may exist on either the materials being bonded or the heat staker members which apply heat and pressure to these members. In a preferred embodiment of the invention, the above hydrostatic transmission of pressure is ac­complished by means of a "waterbed" sandwich structure (16) in which a liquifiable material (22) is enclosed between layers (18,20) of flexible foil material.

Inventors

  • 👤 Winthrop D. Childers
  • 👤 Steven W. Steinfield

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-08 01:27
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/16; B41J2/1601; B41J2/1621; B41J2/1623

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 105 words
A process for precisely aligning an orifice plate with an ink jet printhead and then securely bonding the orifice plate and printhead one to another, characterized in that cohesive failure mode bonding between the orifice plate (12) and the ink jet printhead substrate (10) is achieved by providing an adhesive layer (14) on one surface of the substrate (10), aligning the orifice plate (12) with the substrate (10) and atop the adhesive layer (14), providing a liquid layer (22) on the structure defined above, and applying predetermined heat and pressure through the liquid layer (22) and to the adhesive layer (14) for a predetermined time.
Claim 2
Dependent Claim 105 words
A process for precisely aligning an orifice plate with an ink jet printhead and then securely bonding the orifice plate and printhead one to another, characterized in that cohesive failure mode bonding between the orifice plate (12) and the ink jet printhead substrate (10) is achieved by providing an adhesive layer (14) on one surface of the substrate (10), aligning the orifice plate (12) with the substrate (10) and atop the adhesive layer (14), providing a liquid layer (22) on the structure defined above, and applying predetermined heat and pressure through the liquid layer (22) and to the adhesive layer (14) for a predetermined time.
Claim 3
Dependent Claim 18 words
The process defined in claim 1, charac­terized in that the adhesive layer (14) is a thermally curable polymer.
Claim 4
Dependent Claim 86 words
The process defined in claims 1 or 2, characterized by applying heat and pressure to a sandwich structure (16) disposed on the orifice plate (12) and enclosing a lique­fiable material (22) therein, thereby translating hydro-static forces through said liquefiable material (22) and to the plane of the major bonding forces of said substrate (10) and orifice plate (12) respectively, whereby substantially uniform bonding forces are applied across said major surfaces without regard to contours and irregularities in said surfaces to thereby enhance the adhesive bonding therebetween.
Claim 5
Dependent Claim 27 words
The process defined in claim 3, charac­terized in that said sandwich structure (16) includes a pair of outer flexible foil layers (18,20) enclosing a liquefiable material (22).
Claim 6
Dependent Claim 48 words
The process defined in claims 3 or 4, cha­racterized in that said substrate (10) is a silicon die including a thin film resistor structure for a thermal ink jet printhead, and said orifice plate (12) has nozzles therein for receiving ink from reservoirs in the silicon substrate (10).
Claim 7
Dependent Claim 52 words
The process defined in one of claims 3,4 or 5, characterized in that the pressure is applied to the sandwich structure (16) over a range of 1.3 - 130 bar (20 - 2000 PSI) and for the time of 5 to 60 seconds at a predetermined elevated temperature from 90°C to 160°C.

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