Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
90 words
An integrated circuit device having a wiring substrate (2) with integrated circuit chips (l) on one surface thereof and a power source substrate (5) in contact with another surface thereof, the power source substrate having means (4) for supplying electrical power to the chips (l); characterized in that: the power source substrate has a unitary laminated structure of alternate conductor layers (7) and electrically insulating layers (6) and at least one of the conductor layers (7) and/or at least one of the insulating layers (6) having heat radiating means therein.
Claim 2
Dependent Claim
90 words
An integrated circuit device having a wiring substrate (2) with integrated circuit chips (l) on one surface thereof and a power source substrate (5) in contact with another surface thereof, the power source substrate having means (4) for supplying electrical power to the chips (l); characterized in that: the power source substrate has a unitary laminated structure of alternate conductor layers (7) and electrically insulating layers (6) and at least one of the conductor layers (7) and/or at least one of the insulating layers (6) having heat radiating means therein.
Claim 3
Independent Claim
15 words
A device according to claim l, wherein the heat radiating means includes through bores (ll,20).
Claim 4
Independent Claim
27 words
A device according to claim l wherein the bores (20) are for passage of coolant, and the device includes means for supplying coolant to the bores (20).
Claim 5
Dependent Claim
28 words
A device according to claim 3, wherein the coolant supply means includes a tank (25) for coolant and conduits (27,28,29) connecting the tank (25) to the bores (20).
Claim 6
Dependent Claim
22 words
A device according to claim 4 also having return conduits (27,28,29) for returning coolant from the bores (20) to the tank (25).
Claim 7
Dependent Claim
36 words
A device according to claim 4 or claim 5 where at least some of the conduits (27,28,29) also provide a path for electrical connection between the power source substrate (5) and an external power source (30).
Claim 8
Independent Claim
19 words
A device according to any one of claims 2 to 6 wherein the bores are parallel to each other.
Claim 9
Independent Claim
21 words
A device according to any one of the preceding claims, wherein the insulating layers are of organic resin or inorganic material.
Claim 10
Dependent Claim
17 words
A device according to claim 8 wherein the inorganic material is a SiC ceramic, alumina or beryllium.
Claim 11
Dependent Claim
58 words
l0. A device according to any one of claims l to 7, wherein the insulating layers are of a mixture of an organic resin and a heat radiating filler comprising the heat radiating means, the heat radiating filler being in the form of powder or fibres and having a heat conductivity greater than that of the organic resin.
Claim 12
Dependent Claim
27 words
A device according to claim 9 or claim l0, wherein the organic resin is at least one of epoxy resin, addition-polymerised polyimide, polyvinylidene fluoride, or phenol formaldehyde.
Claim 13
Independent Claim
24 words
A device according to any one of the preceding claims, wherein the conductor layers (7) are of copper, copper-silver alloy, or copper titanium alloy.
Claim 14
Independent Claim
44 words
A device according to any one of the preceding claims, wherein the means for supplying electrical power to the chips (l) includes terminal pins (4) extending from said another surface of the wiring substrate (2) into holes (8) in the power source substrate (5).