Patent US1497740A successfully refreshed from Google Patents.
Patent EP0226433A2 successfully refreshed from Google Patents.
EP0226433A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High density printed wiring board
Assignee: Fujitsu Ltd
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Filing: 1986-12-09
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Granted: —
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Expires: 2006-12-09
Abstract
Abstract A high density printed wiring board (21), on which terminal pads (3) are provided and to which high density semiconductor devices (1) having input and output terminals are mounted using the terminal pads. Respective via pads (6), each internally connected with previously designated circuits of the board, are placed nearby each terminal pad (3) and each is electrically connected with the respective terminal pad (3) by a wiring pattern (8) provided on the surface of the board (21). When the destination of a terminal pad (3) is required to be modified for connection to a different circuit of the board, the wiring pattern (8,857,866) is severed and electrical connection between the terminal pad (3,357,366) and the different circuit is performed by an insulated discrete wire (75,77) wired on to the surface of the board (21). Modification pads (500) for relaying the discrete wires are provided on the surface of the board either surrounding a terminal pad region (R1), or distributed within that region (R1) so that a modification pad is provided near to each terminal pad (3) and via pad (6).
Inventors
- 👤 Kiyotaka Fujitsu Ltd Patent Department Seyama
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 19:39
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0292; H05K1/11; H05K1/111; H05K1/112; H05K1/114; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H05K1/0296; H05K1/0298; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/10719; H05K2201/10734; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
131 words
A printed wiring board, for mounting a semiconductor device having input terminals and output terminals, said board including internal wirings and comprising: a plurality of terminal pads provided on a surface of the printed wiring board for electrical connection to the input and output terminals of the semiconductor device, and forming a terminal pads region on the surface of the printed wiring board; and a plurality of via pads provided within said terminal pads region such that each via pad is positioned near a respective said terminal pad, for electrically connecting said terminal pads to said internal wirings of the board, each via pad being internally connected to a said internal wiring providing a connection to a previously designated circuit of the board, and being connected with its respective terminal pad.
Claim 2
Dependent Claim
131 words
A printed wiring board, for mounting a semiconductor device having input terminals and output terminals, said board including internal wirings and comprising: a plurality of terminal pads provided on a surface of the printed wiring board for electrical connection to the input and output terminals of the semiconductor device, and forming a terminal pads region on the surface of the printed wiring board; and a plurality of via pads provided within said terminal pads region such that each via pad is positioned near a respective said terminal pad, for electrically connecting said terminal pads to said internal wirings of the board, each via pad being internally connected to a said internal wiring providing a connection to a previously designated circuit of the board, and being connected with its respective terminal pad.
Claim 3
Dependent Claim
49 words
A printed wiring board according to claim 1, wherein said terminal pads are arranged in a grid pattern having an equal pitch in two directions and each via pad is positioned so as to be substantially equally spaced from each of the terminal pads closest to said via pad.
Claim 4
Dependent Claim
34 words
A printed wiring board according to claim 1 or 2, wherein each via pad is externally connected with its respective terminal pad by a wiring pattern on the surface of the printed wiring board.
Claim 5
Dependent Claim
81 words
A printed wiring board according to claim 1 or 2, further comprising: a plurality of first surface wiring patterns provided on the surface of the printed wiring board, for electrically connecting each terminal pad with its respective via pad, the first surface wiring patterns having a mechanical structure capable of being severed so as to allow the connection of said terminal pad to be modified to connection with a different circuit, not said previously designated circuit, of the printed wiring board.
Claim 6
Dependent Claim
53 words
A printed wiring board according to claim 4, further comprising a plurality of first modification pads, provided on the surface of the printed wiring board for electrically relaying a connection from a said terminal pad to said different circuit of the printed wiring board when the connection of said terminal pad is modified.
Claim 7
Dependent Claim
70 words
A printed wiring board according to claim 5, wherein said first modification pads are arranged around said terminal pads region, and said relaying of a connection is performed on the surface of the printed wiring board by using discrete wires, one of which is wired from said terminal pad to a said first modification pad, and another of which is wired from that first modification pad to said different circuit.
Claim 8
Dependent Claim
45 words
A printed wiring board according to claim 5 or 6, wherein said first modification pads are arranged in a line around the periphery of the terminal pads region and are of a number less than the number of terminal pads and are distributed substantially equally.
Claim 9
Dependent Claim
57 words
A printed wiring board according to claim 1, further comprising: a plurality of second modification pads provided within the terminal pads region, each one being located near a respective terminal pad and via pad for electrically relaying a connection from said terminal pad to a different circuit, not said previously designated circuit, of the printed wiring board.
Claim 10
Dependent Claim
37 words
A printed wiring board according to claim 8, further comprising a plurality of second surface wiring patterns provided on the surface of the board for electrically connecting each said second modification pad to its respective terminal pad.
Claim 11
Dependent Claim
73 words
A printed wiring board according to claim 9, further comprising a plurality of third surface wiring patterns provided on the surface of the board for electrically connecting each said second modification pad to its respective via pad, each third surface wiring pattern having a mechanical structure capable of being severed when the corresponding terminal pad is to be connected with a different circuit, not said previously designated circuit, of the printed wiring board.
Claim 12
Dependent Claim
82 words
A printed wiring board according to claim 8, 9 or 10, wherein said terminal pads are arranged in a grid pattern having an equal pitch in first and second directions, said via pads are arranged so that each via pad is equally spaced between two adjacent terminal pads along the first direction of the grid, and said second modification pads are arranged so that each second modification pad is equally spaced from each of four terminal pads which are closest to it.
Claim 13
Dependent Claim
99 words
A printed wiring board, for mounting a semiconductor device having input terminals and output terminals, said board comprising: a plurality of terminal pads provided on a surface of the printed wiring board for electrical connection to the input and output terminals of the semiconductor device, and forming terminal pads region on the surface of the printed wiring board; and a plurality of modification pads provided within said terminal pads region such that each modification pad is positioned near to and connected to a respective terminal pad, for electrically connecting said terminal pads to circuitry of the printed wiring board.
Claim 14
Dependent Claim
99 words
A printed wiring board, for mounting a semiconductor device having input terminals and output terminals, said board comprising: a plurality of terminal pads provided on a surface of the printed wiring board for electrical connection to the input and output terminals of the semiconductor device, and forming terminal pads region on the surface of the printed wiring board; and a plurality of modification pads provided within said terminal pads region such that each modification pad is positioned near to and connected to a respective terminal pad, for electrically connecting said terminal pads to circuitry of the printed wiring board.
References Cited (Backward Citations)
No citation records indexed.
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