Patent EP0218796A2 successfully refreshed from Google Patents.
EP0218796A2
Expired / Lapsed
EP
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Semiconductor device comprising a plug-in-type package
Assignee: I Pex Inc
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Filing: 1986-06-27
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Granted: —
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Expires: 2006-06-27
Abstract
Abstract A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package (4) is being molded with a printed wiring substrate (1), head portions of terminals (2), and a heat sink (3) for semiconductor chip (27) attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.
Inventors
- 👤 Akira Konishi
- 👤 Teruo Wakano
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-26 20:58
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/20; H10W40/25; H10W40/258; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W90/00; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49147; Y10T29/49151
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
123 words
(1) A semiconductor device comprising a plug-in type package and one or more semiconductor chips packaged therein, characterized in that said package comprises a plastic package body molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package, said printed wiring substrate being composed of an insulating film or thin sheet with an opening and a plurality of through holes for terminal attachment and being provided on its one or both sides with printed wirings of conductor patterns, said terminals being fixed to the substrate and connected to the respective conductor patterns, said heat sink being mounted on the substrate so as to close the opening of the substrate.
Claim 2
Dependent Claim
27 words
(2) The semiconductor device according to claim 1 wherein the substrate is composed of a heat resistant resin in the form of a film or thin sheet.
Claim 3
Dependent Claim
36 words
(3) The semiconductor device according to claim 2 wherein the heat resistant resin is the one selected from the group consisting of epoxy resins, aromatic polyamide resins, aromatic polyimide resins, phenol resins, and thermosetting polyester resins.
Claim 4
Dependent Claim
28 words
(4) The semiconductor device according to claim 1 wherein the substrate is composed of a film or a thin sheet of a glass fiber reinforced heat resistant resin.
Claim 5
Dependent Claim
47 words
(5) The semiconductor device according to claim 4 wherein the glass fiber reinforced heat resistant resin consists of glass fabric and a heat resistant resin selected from the group consisting of epoxy resins, aromatic polyamide resins, aromatic polyimide resins, melamine resins, phenol resins, and thermosetting polyester resins.
Claim 6
Dependent Claim
20 words
(6) The semiconductor device according to claim 1 wherein the substrate is composed of a film or sheet of ceramics.
Claim 7
Dependent Claim
14 words
(7) The semiconductor device according to claim 6 wherein said ceramics consists of alumina.
Claim 8
Dependent Claim
15 words
(8) The semiconductor device according to claim 6 wherein the ceramic consists of silicon carbide.
Claim 9
Dependent Claim
40 words
(9) The semiconductor device according to claim 1 wherein the substrate is a multi-layered film, each film being provided with at least one opening, a plurality of through holes for terminal attachment, and the conductor patterns different from one another.
Claim 10
Dependent Claim
18 words
(10) The semiconductor ceramic according to claim 9 wherein the consists of two sheets of polyimide resin films.
Claim 11
Dependent Claim
33 words
(11) The semiconductor device according to claim 1 wherein the terminals are mounted at their heads on the substrate by calking and are connected to the respective conductor patterns formed on the substrates.
Claim 12
Dependent Claim
41 words
(12) The semiconductor device according to claim 1 wherein reinforcing rings or washers are formed Coaxially with the axis of the through holes on one side of the substrate which is opposite to the side on which conductor patterns are formed.
Claim 13
Dependent Claim
20 words
(13) The semiconductor device according to claim 1 wherein the substrate is provided on its one side with conductor patterns.
Claim 14
Dependent Claim
20 words
(14) The semiconductor device according to claim 1 wherein the substrate is provided with conductor patterns on its both sides.
Claim 15
Dependent Claim
30 words
(15) The semiconductor device according to claim 1 wherein the substrate is provided with a plurality of plated through holes to provide electrical connection between the terminals and conductor patterns.
Claim 16
Dependent Claim
20 words
(16) The semiconductor device according to claim 15 wherein the through holes are plated with nickel and silver or gold.
Claim 17
Dependent Claim
29 words
(17) The semiconductor device according to claim 1 wherein the conductor patterns of the substrate are composed of a copper layer and a silver or gold layer electroplated thereon.
Claim 18
Dependent Claim
38 words
(18) The semiconductor device according to claim 1 wherein the conductor patterns of the substrate are composed of a copper layer, a nickel layer, a palladium layer and a silver or gold layer plated one on the other.
Claim 19
Dependent Claim
44 words
(19) The semiconductor device according to claim 1 wherein the conductor patterns of the substrate are composed of a copper layer chemically plated on the surface of the thin resin film substrate, and a silver or gold layer electrically plated on the copper layer.
Claim 20
Dependent Claim
22 words
(20) The semiconductor device according to claim 19 wherein the copper layer is formed on a catalyst layer formed on the substrate.
Claim 21
Dependent Claim
19 words
(21) The semiconductor device according to claim 1 wherein the heat sink is made of a thermally conductive material.
Claim 22
Dependent Claim
25 words
(22) The semiconductor device according to claim 21 wherein the heat sink is made of aluminum, aluminum alloy, copper, copper alloy, iron or its alloy.
Claim 23
Dependent Claim
18 words
(23) The semiconductor device according to claim 22 wherein the heat sink is plated with silver or gold.
Claim 24
Dependent Claim
27 words
(24) The semiconductor device according to claim 21 wherein the thermally conductive material for heat sink is a sintered body of a metal or a metal oxide.
Claim 25
Dependent Claim
18 words
(25) The semiconductor device according to claim 24 wherein the sintered body is of copper or its alloy.
Claim 26
Dependent Claim
28 words
(26) The semiconductor device according to claim 21 wherein the heat sink is being provided on its one side at least one recess for mounting the semiconductor chip.
Claim 27
Dependent Claim
22 words
(27) The semiconductor device according to claim 26 wherein the recess of the heat sink is being plated with gold or silver.
Claim 28
Dependent Claim
25 words
(28) The semiconductor device according to claim 26 wherein the recess of the heat sink is provided at a central portion of the heat sink.
Claim 29
Dependent Claim
30 words
(29) The semiconductor device according to claim 26 wherein the heat sink is encapsulated in the package body so that the recess faces towards the extending direction of the terminals.
Claim 30
Dependent Claim
34 words
(30) The semiconductor device according to claim 26 wherein the heat sink is encapsulated in the package body so that the recess faces toward a direction opposite to the extending direction of the terminals.
Claim 31
Dependent Claim
19 words
(31) The semiconductor device according to claim 1 wherein the package body is molded with a heat resistant resin.
Claim 32
Dependent Claim
20 words
(32) The semiconductor device according to claim 31 wherein the heat resistant material contains an inorganic material as a filler.
Claim 33
Dependent Claim
22 words
(33) The semiconductor device according to claim 32 wherein a content of the inorganic material is 30 to 70 percent by weight.
Claim 34
Dependent Claim
25 words
(34) The semiconductor device according to claim 31 wherein the inorganic material is the one selected from the group consisting of glass fibers and silica.
Claim 35
Dependent Claim
38 words
(35) The semiconductor device according to claim 31 wherein the heat resistant material is the one selected from the group consisting of epoxy resins, phenol resins, thermosetting polyester resins, melamine resins, aromatic polyamide resins, and aromatic polyimide resins.
Claim 36
Dependent Claim
26 words
(36) The semiconductor device according to claim 1 wherein the terminals are soldered at their base portions to the conductor patterns by a electrically conductive material.
Claim 37
Dependent Claim
20 words
(37) The semiconductor device according to claim 1 wherein a cavity of the package body is filled with a resin.
Claim 38
Dependent Claim
20 words
(38) The semiconductor device according to claim 1 wherein a cavity of the package body is sealed with a lid.
Claim 39
Dependent Claim
54 words
(39) The semiconductor device according to claim 1 wherein one or more monolithic semiconductor integrated circuit chips are mounted on the heat sink and wherein the package body is being molded with the printed wiring substrate, the head portions of terminals, the heat sink, and the chips as an integral part of the package.
Claim 40
Dependent Claim
26 words
(40) The semiconductor device according to claim 1 wherein the package body is provided with at least one standoff as an integral part of the body.
Claim 41
Dependent Claim
19 words
(41) The semiconductor device according to claim 40 wherein standoffs are molded concentric with the axis of the terminals.
Claim 42
Dependent Claim
109 words
(42) A method for manufacturing plug-in type packages for semiconductor devices comprising the steps of preparing a printed wiring substrate having an opening and a plurality of through holes, fixing a plurality of terminals to the substrate by inserting one ends of their shank into the through holes and then hammering or beating out their projecting ends of their shank into head, loading the substrate and a heat sink into a cavity of a mold so that the heat sink closes the opening of the substrate, and molding a resin around the substrate, head portions of the terminals and sides of the heat sink to form a package body.
References Cited (Backward Citations)
No citation records indexed.
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