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Epoxy resin composition

Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1986-10-06
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Granted: —
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Expires: 2006-10-06
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Abstract

Abstract An epoxy resin composition comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by addition reaction between alkenyl group-containing epoxy resins and organopolysiloxanes of the following formula (1) in which each R represents a substituted or unsubstituted monovalent hydrocarbon group, «a» is a value of from 0.01 to 0.1, «b» is a value of 1.8 to 2.2 and 1.81 < a + b < 2.3, and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; copolymers obtained by addition reaction between epoxy resins and amino group-containing organopolysiloxanes of the following formula (2) in which R' represents a divalent organic group, each R 2 represents a monovalent organic group, «a» is a value of from 0.01 to 0.1, «b» is a value of from 1.8 to 2.2 and 1.81 < a + b < 2.3, and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; and mixtures thereof.

Inventors

  • 👤 Kunio Shin-Etsu Chemical Co. Ltd. Itoh
  • 👤 Toshio Shin-Etsu Chemical Co. Ltd. Shiobara
  • 👤 Koji Shin-Etsu Chemical Co. Ltd. Futatsumori
  • 👤 Kazutoshi Shin-Etsu Chemical Co. Ltd. Tomiyoshi
  • 👤 Hisashi Shin-Etsu Chemical Co. Ltd. Shimizu

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-06 12:28
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/02; C08G59/027; C08G77/00; C08G77/42; C08L; C08L63/00; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 208 words
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by addition reaction between alkenyl group-containing epoxy resins and organopolysiloxanes of the following formula (1) in which each R represents a substituted or unsubstituted monovalent hydrocarbon group, "a" is a value of from 0.01 to 0.1,"b"is a value of 1.8 to 2.2 and 1.81 < a + b < 2.3,and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; copolymers obtained by addition reaction between epoxy resins and amino group-containing organopolysiloxanes of the following formula (2) in which R 1 represents a divalent organic group each R represents a monovalent organic group, "a" is a value of from 0.01 to 0.1, "b" is a value of from 1.8 to 2.2 and 1.81 < a + b < 2.3, and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; and mixtures thereof.
Claim 2
Dependent Claim 208 words
An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by addition reaction between alkenyl group-containing epoxy resins and organopolysiloxanes of the following formula (1) in which each R represents a substituted or unsubstituted monovalent hydrocarbon group, "a" is a value of from 0.01 to 0.1,"b"is a value of 1.8 to 2.2 and 1.81 < a + b < 2.3,and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; copolymers obtained by addition reaction between epoxy resins and amino group-containing organopolysiloxanes of the following formula (2) in which R 1 represents a divalent organic group each R represents a monovalent organic group, "a" is a value of from 0.01 to 0.1, "b" is a value of from 1.8 to 2.2 and 1.81 < a + b < 2.3, and the number of silicon atom in a molecule is an integer of from 20 to 400 and the number of hydrogen atom directly connected to silicon atom is an integer of from 1 to 5; and mixtures thereof.
Claim 3
Dependent Claim 33 words
A composition according to Claim 1, wherein said curable epoxy resin is at least one resin selected from the group consisting of substituted or unsubstituted novolac-type epoxy resins and bisphenol A-type epoxy resins.
Claim 4
Dependent Claim 31 words
A composition according to Claim 1, wherein the organopolysiloxane of the formula (1) is at least one member selected from the group consisting of hydrogen-terminated dimethyl-polysiloxane, hydrogen-terminated methylphenyl-polysiloxane and hydrogen-terminated methyl-(2-trimethoxysilylethyl)-polysiloxane.
Claim 5
Dependent Claim 23 words
A composition according to Claim 1, wherein R 2 s in the amino group-containing organopolysiloxane are a methyl group and a phenyl group.
Claim 6
Dependent Claim 32 words
A composition according to Claim 1, wherein R 2 s in the amino group-containing organopolysiloxane are a methyl group and -CH 2 CH 2 S i ( OCH 3 ) 3 .
Claim 7
Dependent Claim 14 words
A composition according to Claim 1, wherein the amino group-containing organopolysiloxane is y-aminopropyldimethylsiloxy-blocked dimethylpolysiloxane.
Claim 8
Dependent Claim 37 words
A composition according to Claim 1, wherein the amount of the copolymer is from 1 to 100 parts by weight per 100 parts by weight of the total of said curable epoxy resin and said curing agent.
Claim 9
Dependent Claim 38 words
A composition according to Claim 1, wherein the amount of said inorganic filler is from 100 to 1000 parts by weight per 100 parts by weight of the total of said curable epoxy resin and said curing agent.

References Cited (Backward Citations)

GB906544A Cited
JPS5821417A Cited
JPS59129252A Cited

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